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Learn more about the PUNCH advanced integration solutions for electronic-photonic co-packaging

Submitted by jmissinn on
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Jeroen Missinne wrote:


The PUNCH project aims at establishing solutions for time-deterministic and time-sensitive networks, and focuses on developing novel photonic components and interface electronics, integration, assembly and packaging technologies, manufacturing and prototyping, and beyond state-of-the-art demonstrations in one-hop optical switching in 5G radio access networks, and in disaggregated memory in data centers. 

Interested to learn more about the technology we develop? See our updated Technology page: https://lnkd.in/eca4K7Y5 
imec PHIX Photonics Assembly NVIDIA Ericsson AT&S Fraunhofer IZM University of Cambridge 

#Innovation #Photonics #Networking #5G #datacenter #Collaboration 
#HorizonEurope #HaDEA