Date
wrote:
Yesterday, PHIX had the pleasure of hosting the 11th general meeting of the
PUNCH
consortium!
This collaborative research effort of imec , NVIDIA , PHIX, Ericsson , AT&S , Fraunhofer IZM , and the University of Cambridge develops key technologies for next-generation co-packaged optics ( #CPO ) and ultra-high-speed optical interconnects for the #datacenters of the future. The project enables PHIX to develop novel fiber array attachment and flip-chip die bonding techniques to serve this flourishing market.
It was great to meet face to face and align on progress and the next milestones. We're excited to see our combined innovations move closer to real-world deployment!
#datacom #photonics #chipindustry
𝘛𝘩𝘦 𝘗𝘜𝘕𝘊𝘏 𝘱𝘳𝘰𝘫𝘦𝘤𝘵 𝘩𝘢𝘴 𝘳𝘦𝘤𝘦𝘪𝘷𝘦𝘥 𝘧𝘶𝘯𝘥𝘪𝘯𝘨 𝘧𝘳𝘰𝘮 𝘵𝘩𝘦 𝘌𝘶𝘳𝘰𝘱𝘦𝘢𝘯 𝘜𝘯𝘪𝘰𝘯’𝘴 𝘏𝘰𝘳𝘪𝘻𝘰𝘯 𝘌𝘶𝘳𝘰𝘱𝘦 𝘙𝘦𝘴𝘦𝘢𝘳𝘤𝘩 𝘢𝘯𝘥 𝘐𝘯𝘯𝘰𝘷𝘢𝘵𝘪𝘰𝘯 𝘗𝘳𝘰𝘨𝘳𝘢𝘮𝘮𝘦 𝘶𝘯𝘥𝘦𝘳 𝘎𝘳𝘢𝘯𝘵 𝘈𝘨𝘳𝘦𝘦𝘮𝘦𝘯𝘵 𝘕𝘰 101070560.
This collaborative research effort of imec , NVIDIA , PHIX, Ericsson , AT&S , Fraunhofer IZM , and the University of Cambridge develops key technologies for next-generation co-packaged optics ( #CPO ) and ultra-high-speed optical interconnects for the #datacenters of the future. The project enables PHIX to develop novel fiber array attachment and flip-chip die bonding techniques to serve this flourishing market.
It was great to meet face to face and align on progress and the next milestones. We're excited to see our combined innovations move closer to real-world deployment!
#datacom #photonics #chipindustry
𝘛𝘩𝘦 𝘗𝘜𝘕𝘊𝘏 𝘱𝘳𝘰𝘫𝘦𝘤𝘵 𝘩𝘢𝘴 𝘳𝘦𝘤𝘦𝘪𝘷𝘦𝘥 𝘧𝘶𝘯𝘥𝘪𝘯𝘨 𝘧𝘳𝘰𝘮 𝘵𝘩𝘦 𝘌𝘶𝘳𝘰𝘱𝘦𝘢𝘯 𝘜𝘯𝘪𝘰𝘯’𝘴 𝘏𝘰𝘳𝘪𝘻𝘰𝘯 𝘌𝘶𝘳𝘰𝘱𝘦 𝘙𝘦𝘴𝘦𝘢𝘳𝘤𝘩 𝘢𝘯𝘥 𝘐𝘯𝘯𝘰𝘷𝘢𝘵𝘪𝘰𝘯 𝘗𝘳𝘰𝘨𝘳𝘢𝘮𝘮𝘦 𝘶𝘯𝘥𝘦𝘳 𝘎𝘳𝘢𝘯𝘵 𝘈𝘨𝘳𝘦𝘦𝘮𝘦𝘯𝘵 𝘕𝘰 101070560.