Date
Chiplet-Marketplace.com wrote:
Article: "Low-Loss Integration of High-Density Polymer Waveguides with Silicon
#Photonics
for Co-Packaged Optics"
By Jef Van Asch , Jeroen Missinne , Junwen He , Arnita Podpod , Lepage Guy , Negin Golshani , Rafal Magdziak, PhD , Huseyin SAR , Hakim Kobbi, Swetanshu Bipul , Dieter Bode, Yoojin Ban , Filippo Jacopo Ferraro , Joris Van Campenhout and Geert Van Steenberge
https://lnkd.in/dZGe3T7d
Co-Packaged Optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coupling while maintaining compatibility with widely used approaches for electrical redistribution. The authors present two heterogeneous integration techniques that enable high-density electrical and optical I/O connections, utilizing adiabatic coupling between on-chip silicon nitride (SiN) waveguides and package-level polymer optical waveguides.
Read more at https://lnkd.in/dZGe3T7d
#chiplet #3DIC #AdvancedPackaging #MultiDie #semiconductor
By Jef Van Asch , Jeroen Missinne , Junwen He , Arnita Podpod , Lepage Guy , Negin Golshani , Rafal Magdziak, PhD , Huseyin SAR , Hakim Kobbi, Swetanshu Bipul , Dieter Bode, Yoojin Ban , Filippo Jacopo Ferraro , Joris Van Campenhout and Geert Van Steenberge
https://lnkd.in/dZGe3T7d
Co-Packaged Optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coupling while maintaining compatibility with widely used approaches for electrical redistribution. The authors present two heterogeneous integration techniques that enable high-density electrical and optical I/O connections, utilizing adiabatic coupling between on-chip silicon nitride (SiN) waveguides and package-level polymer optical waveguides.
Read more at https://lnkd.in/dZGe3T7d
#chiplet #3DIC #AdvancedPackaging #MultiDie #semiconductor