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Smart Objects for IOT
In this application domain, we have 4 main research tracks:
- Wearables and e-textiles:
Conformable, wearable and mostly textile integrated sensor systems, made for capturing information of the wearer (e.g. movement, temperature,...). We mainly focus on protective, medical and sports garments. - Structural electronics:
Polymer products made by lamination, thermoforming, injection moulding, etc. with integrated electronic functionality. Furthermore, polymer fabrication processes can be monitored by integrated sensors e.g. for optimization of curing, forming process etc. - Soft sensors:
Dedicated developed sensors realized in soft materials e.g. pressure sensors, ECG sensors. - GaN technology simulation and devices.
Wearables and E-Textiles:
Selection of recent work:
Testing for wearability and reliability of TPU lamination method in e-textiles.
Paula Veske (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)
(2022) APPLIED SCIENCES-BASEL. 10(24).”
Development and washing reliability testing of a
stretchable circuit on knit fabric.
“Paula Veske (UGent) , Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Tom Sterken
(UGent) and Jan Vanfleteren (UGent)
(2020) APPLIED SCIENCES-BASEL. 10(24).”
Vacuum lamination of a stretchable sensor
system in polypropylene.
“Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Jan Patrick Deckers and Jan Vanfleteren (UGent)
(2020) 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).”
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Structural electronics:
Selection of recent work:
The integration of electronic circuits in plastics using injection technologies : a literature review.
“Mona Bakr (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent)
(2022) 2022 Flexible and Printed Electronics
Solar cells integration in over-molded printed electronics.
“Mona Bakr (UGent) , Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) , Imen Chtioui
and Wim Christiaens
(2020) 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), Proceedings.”
Flexible microsystems using over-molding technology.
“Mona Bakr (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) and Yibo Su
(2020) PROCEDIA MANUFACTURING. 52. p.26-31.”
Effect of overmolding process on the integrity of electronic circuits.
“Mona Bakr (UGent) , Yibo Su, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)
(2019) 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). In European
Microelectronics Packaging Conference.”
Soft Sensors:
Selection of recent work:
No publications so far. We are working on soft pressure sensors. Contact us for more information.GaN technology simulation and devices.
Selection of recent work:
TCAD Modeling of the Dynamic VTH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs.
A. N. Tallarico, M. Millesimo, Benoit Bakeroot (UGent) , M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi and C. Fiegna
(2022) IEEE TRANSACTIONS ON ELECTRON DEVICES. 69(2). p.507-513
Schottky gate induced threshold voltage instabilities in p-GaN gate AlGaN/GaN HEMTs.
Arno Stockman (UGent) , Eleonora Canato, Matteo Meneghini, Gaudenzio Meneghesso, Peter Moens and Benoit Bakeroot (UGent)
(2021) IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. 21(2). p.169-175
Surface-potential-based compact modeling of p-GaN gate HEMTs.
Jie Wang, Zhanfei Chen, Shuzhen You, Benoit Bakeroot (UGent) , Jun Liu and Stefaan Decoutere
(2021) MICROMACHINES. 12(2).