[1] A. Vervaet, “Invloed van indifferent elektrolyt op de dissociatie van weinig gesplitste verbindingen en de toepassing ervan voor het meten van diffusiepotentialen,” in Dag der Jongeren, (Leuven), pp. 3-4, Vlaamse Chemische Vereniging, January 1966.
[2] A. Vervaet, “Invloed van indifferent elektrolyt op de aktiviteit van zwak zuur- en neerslagionen,” in Dag der Jongeren, (Brussel), p. 16, Vlaamse Chemische Vereniging, February 1967.
[3] W. Rigole and A. Vervaet, “Meting van diffusiepotentialen in elektrolytoplossingen,” Mededelingen van de Koninklijke Vlaamse Academie voor Wetenschappen, vol. 1, pp. 3-10, 1967.
[4] A. Vervaet, “Invloed van indifferent elektrolyt op de activiteit van zwak zuur- en neerslagionen,” Mededelingen van de Vlaamse Chemische Vereniging, vol. 1, pp. 31-34, January 1968.
[5] F. Vanden Kerchove and A. Vervaet, “Heterogene katalyse i,” Mededelingen van de Koninklijke Vlaamse Academie voor Wetenschappen, vol. 6, pp. 3-19, 1971.
[6] A. Van Calster and H. Pauwels, “Dispersion characteristics of thin film capacitances caused by surface trapping,” Thin Solid Films, vol. 7, pp. R17-R20, March-April 1971.
[7] A. Vervaet and F. Vanden Kerchove, “Heterogene katalyse ii,” Mededelingen van de Koninklijke Vlaamse Academie voor Wetenschappen, vol. 5, pp. 3-35, 1973.
[8] G. van der Horst and A. Vervaet, “Natuurwetenschappelijk onderwijs op Afrikaanse bodem: wensdroom of realiteit,” chemisch weekblad, vol. 51.
[9]
A. Van Calster,
“Effective mobility and bulk trapping in heavily doped CdSe,” Solid-State Electronics, vol. 16,
pp. 117-119, 1973.
[10] A. Van Calster and H. Pauwels, “Role of incompletely ionized donors as bulk traps in thin film transistors,” Thin Solid Films, vol. 21, pp. S33-S36, 1974.
[11]
A. Van Calster
and H. Pauwels, “Theoretical influence of surface states and bulk traps on
thin film transistors,” Solid State
Electronics, vol. 18, pp. 691-698, 1975.
[12]
A. Van Calster,
“Industrial potential of research on amorphous semiconductors, thin film
transistors and solar cells,” in ISHM
studiedag, (Gent), LEM - ISHM, March 1977.
[13]
A. Van Calster
and P. Reussens, “The variation of resistivity with temperature for n-type
degenerate indium antimonide films,” Thin
Solid Films, vol. 44, pp. 21-28, July 1977.
[14]
A. Van Calster,
“A channel conductance measuring technique for determining the interface properties
of a SiO-InSb thin film transistor,”
Solid State Electronics, vol. 21, p. 393, 1978.
[15]
A. Van Calster,
“A InSb thin film transistor operating at cryogenic temperatures,” in 15th International Conference on Low
Temperature Physics, book of abstracts, 1978.
[16] A. Van Calster, “A InSb thin film transistor operating at cryogenic temperatures,” Journal de physique, vol. C6, no. 39, Supplement 8, p. 1186, 1978.
[17]
A. Vervaet,
W. Gomes, and F. Cardon, “Some electrochemical processes at the N-
and P-InP electrodes,” Journal of
Electroanalytical Chemistry, vol. 91, pp. 133-136, 1978.
[18]
A. Van Calster,
“The experimental study of the indium antimonide thin film transistor,” Solid State Electronics, vol. 22,
pp. 77-80, 1979.
[19]
A. Van Calster,
“Barrier limited conductivity in thin semiconducting films,” Physica Status Solidi, vol. 54,
pp. 207-216, 1979.
[20] A. Van Calster and L. Vandendriessche, “On the theory of thin-film MIS capacitances,” IEEE Trans. Electron Dev., vol. EDL-26, pp. 765-775, 1979.
[21]
A. Van Calster
and A. De Vos, “State of the art in thin film transistor : a review
of the used insulator-semiconductor combinations,” in Proc. 2nd European Hybrid Microelectronics Conf., (Gent), pp. 197-204,
ISHM, May, 21-23 1979.
[22] A. Van Calster and Li Yu-Min, “An investigation of the Al2O3-CdSe interface in accumulation,” J. Appl. Phys., vol. 23, pp. 327-331, 1980.
[23]
S. Demolder
and A. Van Calster, “The measuring of 1/f noise of thick and thin
film resistors,” Journal of Physics,
vol. 80, pp. 1323-1327, 1980.
[24]
A. Van Calster
and A. De Vos, “State of the art in thin film transistor : a review
of the used insulator semiconductor combinations,” Electrocomponent Science and Technology, no. 6, pp. 131-134,
1980.
[25]
S. Demolder,
A. Van Calster, and M. Vandendriessche, “Current noise in thick and
thin film resistors,” in Proc. 3rd
European Hybrid Microelectronics Conf., (Avignon), pp. 19-25, ISHM,
1981.
[26]
A. Van Calster,
“Thin film transistors and thin film transistor circuits,” in Proc. 3rd European Hybrid Microelectronics
Conf., (Avignon), pp. 411-416, ISHM, 1981.
[27]
A. Van Calster, Course on thin films. Center for
Proffesional Advancement, yearly course, started 1982.
[28] A. Van Calster, S. Demolder, and L. Van Den Eede, “Current noise measurements,” European Electronics, vol. 1, pp. 26-27, 1982.
[29]
A. Van Calster,
A. De Vos, and M. Burgelman, “The development of the thin film transistor,” Bulletin KVE-Revue, vol. 98, pp. 95-98,
1982.
[30]
M. Trari,
A. Vervaet, and R. Ouahes, “Etude de quelques parametres d`une cellule
photoelectrochimique,” in 2ieme Seminaire
National sur l`Energie Solaire Commissariat aux Energie Nouvelles (CEN),
(Algiers, Agerije), 1982.
[31]
A. Van Calster,
“Thin film transistors and thin film transistor circuits,” Electrocomponent Science and technology, vol. 10, p. 153,
1983.
[32]
S. Demolder,
A. Van Calster, and M. Vandendriessche, “Current noise in thick and
thin film resistors,” Electrocomponent
Science and technology, vol. 10, p. 81, 1983.
[33]
A. Van Calster,
L. Van Den Eede, S. Demolder, and A. De Keyser, “1/f
noise in cermet and metanet resistors,” in
7th Int. Conf. on Noise in Physical Systems, book of abstracts, (Montpellier),
p. 162, 1983.
[34]
A. Van Calster,
L. Van Den Eede, S. Demolder, and A. De Keyser, “1/f
noise in cermet and metanet resistors,” in
Noise in Physical Systems and 1/f Noise (M. Savelli, G. Lecoy,
and J.-P. Nougier, eds.), (Amsterdam), pp. 193-195, North-Holland, 1983.
[35]
A. Van Calster, Thin film technology. Course in
Microelectronics Packaging and Interconnection, Amsterdam, June 1983.
[36]
A. Van Calster,
L. Van Den Eede, S. Demolder, and B. Bouw, “Current and
noise measurements on low temperature thick film resistors,” in Proc. 4th Hybrid European Microelectronics
Conf., (Copenhagen), ISHM, 1983.
[37] H. E. Maes, G. Heyns, J. Remmeric, M. Hinoul, H. Loos, A. Van Calster, A. Lequesne, and K. Allaert, “Comparative study of plasma nitrides for IC passivation,” in The Electrochemical Soc. Proceedings, Symposium, p. 177, 1983.
[38]
G. De Mey,
D. Loret, and A. Van Calster, “The boundary element method for modeling
the DMOS transistor at high drain voltages,” in Int. Conf. on Simulation of Semiconductor Devices and Processes,
(Swansea), June 1984.
[39] K. Allaert and A. Van Calster, “The influence of the deposition and annealing temperature on plasma enhanced chemical vapour deposition of Si3N4,” in 6th Int. Conf. on Thin Films, August 1984.
[40] A. Van Calster, “Fabrication process for the thin film transistor,” in 6th Int. Conf. on Thin Films, August 1984.
[41]
K. Allaert,
A. Van Calster, H. Loos, and A. Lequesne, “A comparison
between silicon nitride films made by PCVD of N2-SiH4/Ar
and N2-SiH4/He,” J.
of the Electrochemical Soc., vol. 132, no. 7, pp. 1763-1766,
1985.
[42]
S. Demolder,
A. Van Calster, A. Lequesne, and E. Daelen, “Noise-design criteria
for thick-film resistors,” in Proc. 5th
European Hybrid Micoelectronics Conf., (Stresa), p. 265, ISHM, May
1985.
[43]
S. Demolder
and A. Van Calster, “A model for the electrical condoction and 1/f-noise
in cermet thick-film resistors-systems,” in
8th Int. Conf. on Noise in Physical Systems and 4th Conf. on 1/f noise, book of
abstracts, (Roma), September 1985.
[44]
S. Demolder
and A. Van Calster, “A model for the electrical condoction and 1/f-noise
in cermet thick-film resistors-systems,” in
Noise in Physical Systems and 1/f Noise (A. D'Amico and P. Mazetti,
eds.), (Amsterdam), pp. 145-148, North-Holland, 1985.
[45] K. Allaert and A. Van Calster, “Evaluation of PCVD silicon nitride as thin film isolator, as a cross over dielectric and as a passivation layer,” in Proc. 3rd Int. Conf. on Plasma Etching and Plasma Deposition, pp. 239-243, November 1985.
[46]
A. Van Calster,
“Fabrication processes for the film transistor,” Thin Solid Films, vol. 126, pp. 219-225, 1985.
[47] F. N. Sinnaduria, ed., Handbook of microelectronics packaging & interconnection technology, Van Calster, André, ch. Thin film technology, pp. 15-38. Ayr: Electrochemical Publications, 1985.
[48] J. Vanfleteren and A. Van Calster, “A four-vacuum-cycle lift-off process for the polycrystalline CdSe thin-film transistor,” IEEE Electron Device Lett., vol. EDL-6, no. 1, pp. 11-13, 1985.
[49] J. Vanfleteren, A. Van Calster, and H. Pauwels, “Shift registers with polycrystalline CdSe thin film transistors,” in Int. Display Research Conf. 85, (San-Diego), pp. 72-75, SID, 1985.
[50]
A. Van Calster, Course on thin film technology. ATAC,
London, yearly course, started in 1986.
[51]
K. Allaert,
A. Van Calster, and A. Vervaet, “Evaluation of PCVD silicon nitride
as total passivation layer for chips,” in
5th VLSI Packaging Workshop, (Paris), p. 26, November 1986.
[52]
J. Vanfleteren
and A. Van Calster, “A comparative study of evaporated Al2O3,
SiO2 and SiO2-Al2O3 thin films,” Thin Solid Films, no. 139, pp. 89-94,
1986.
[53]
A. Vervaet,
M. Burgelman, and D. Van Wassenhove, “Kinetics of the dry formation
of Cu2S in Cu2S/CdS solar cells,” Thin
Solid Films, no. 151, pp. 133-143, 1986.
[54]
I. De Rycke,
A. Van Calster, J. Vanfleteren, and A. De Clercq, “The
design and simulation of poly-CdSe TFT driving circuits for high resolution LC displays,”
in Japan Display 86, (Tokyo), pp. 304-307,
SID, 1986.
[55]
J. Doutreloigne,
S. Demolder, A. Van Calster, and L. Vandendriessche, “1/f noise
in p-channel MOS transistors made in a BIMOS process,” in 9th Int. Conf. on Noise in Physical Systems, book of abstracts,
(Montreal), May 1987.
[56]
J. Doutreloigne,
S. Demolder, A. Van Calster, and L. Vandendriessche, “1/f noise
in p-channel MOS transistors made in a BIMOS process,” in Noise in Physical Systems (C. M. Van Vliet, ed.),
(Singapore), pp. 461-464, World Scientific, 1987.
[57]
S. Demolder,
D. Brokken, A. Van Calster, A. Lequesne, and K. Van Daele,
“A comparative study of evaluation tests on PdAg multilayer systems,” in Proc. 6th European Hybrid Microelectronics
Conf., (Bornemouth), p. 464, ISHM, June 1987.
[58]
K. Allaert,
A. Van Calster, and A. Vervaet, “PCVD SIN conformal coatings for
the improvement of the reliability of wire bonded chips,” in Int. Symposium on the Physical and Failure
Analysis of Integrated Circuits, (Singapore), 1987.
[59]
A. Van Calster,
A. Vervaet, I. De Rycke, J. De Baets, and J. Vanfleteren,
“Polycrystalline CdSe films for thin film transistors,” in The Seventh American Conference on Crystal Growth, (Monterey),
July 1987.
[60]
A. Van Calster,
A. Vervaet, I. De Rycke, J. De Baets, and J. Vanfleteren,
“Polycrystalline CdSe films for thin film transistors,” in 3rd Int. Conf. on II-VI compounds, book of abstracts, (Monterey),
p. 397, July 1987.
[61]
J. Vanfleteren,
P. Vandenberghe, A. Van Calster, J. De Baets, I. De Rycke,
F. Cuypers, and P. Jones, “A self-aligned poly-CdSe thin film
transistor technology for active matrix addressing with grey scales,” in Eurodisplay 87, (London), p. 165,
SID, 1987.
[62] A. Van Calster, I. De Rycke, A. Vervaet, J. De Baets, and J. Vanfleteren, “A new technology for fast switching circuits on glass,” IEEE Electron Device Lett., vol. EDL-8, no. 10, pp. 477-479, 1987.
[63]
G. De Mey,
D. Loret, and A. Van Calster, “Modelling of dmos transistors,” Reprint of Colloqium Topics in Applied
Numerical Analysis, 1987.
[64] A. Van Calster, J. Vanfleteren, I. De Rycke, and J. De Baets, “On the field effect in polycrystalline CdSe thin-film transistors,” J. Appl. Phys., vol. 64, no. 6, pp. 3282-3286, 1988.
[65]
A. Vervaet,
M. Burgelman, and I. Clemminck, “On the interpretation of solid-state
coulometry (SSC), used in studies of thin films of copper sulphide,” Journal of Materials Science Letters,
vol. 8, pp. 69-70, 1988.
[66]
A. Vervaet,
D. Van Wassenhove, M. Burgelman, and I. Clemminck, “Structural
analysis of `DRY` Cu2S-CdS solar cells,”
Solar Cells, vol. 23, pp. 217-232, 1988.
[67]
A. Van Calster,
A. Vervaet, I. De Rycke, J. De Baets, and J. Vanfleteren,
“Polycrystalline CdSe films for thin film transistors,” Journal of Crystal Growth, vol. 86, pp. 924-928, 1988.
[68] J. Vanfleteren, P. De Visschere, J. De Baets, I. De Rycke, J. Doutreloigne, and A. Van Calster, “Active matrix CdSe TFT addressed electroluminescent displays,” in Int. Display Research Conf. 88, (San Diego), pp. 74-79, SID, 1988.
[69] I. De Rycke, J. De Baets, J. Doutreloigne, A. Van Calster, and J. Vanfleteren, “The realisation and evaluation of poly-CdSe TFT driving circuits,” in Int. Display Research Conf. 88, (San Diego), pp. 70-73, SID, 1988.
[70]
A. Vervaet,
M. Burgelman, I. Clemminck, and J. Capon, “Screen printing of CuInSe2
films,” in 9th European Photovoltaic
Solar Energy Conference, (Freiburg (BRD)), pp. 480-484, 1988.
[71]
I. Clemminck,
A. Vervaet, M. Burgelman, and A. De Meyere, “Electrical and
morphological properties of screenprinted cds layers for cds-cdte solar cells,”
in Proceedings 20nd IEEE Photovoltaic
Specialists Conference, (Las Vegas), pp. 1585-1590, IEEE, 1988.
[72] A. Vervaet and M. Burgelman, “Analyse apparatuur voor materiaalonderzoek - een verkenning,” Het Ingenieursblad, vol. 58, no. 2, pp. 13-20, 1989.
[73]
A. Van Calster,
“Thin film transistors and flat-panel displays,” in Proc. 7th European Hybrid Microelectronics Conf., ISHM, May 1989.
[74]
A. Van Calster,
J. De Baets, I. De Rycke, J. Doutreloigne, H. De Smet,
and J. Vanfleteren, “On the poly-CdSe thin film transistor technology,” in Japan Display 89, (Kyoto), pp. 408-411,
SID, 1989.
[75]
J. Doutreloigne,
J. De Baets, I. De Rycke, H. De Smet, A. Van Calster,
and J. Vanfleteren, “A complementary Ge-CdSe TFT technology for flat panel
displays,” in TATF book of abstracts,
(Regensburg), TATF, 1989.
[76]
J. Doutreloigne,
J. De Baets, I. De Rycke, H. De Smet, A. Van Calster,
and J. Vanfleteren, “A correlation between 1/f-noise and short-term drift
in poly CdSe:In thin film transistors,” in
10th Int. Conf. on Noise in Physical Systems, book of abstracts,
(Budapest), pp. 313-315, August 1989.
[77]
J. Doutreloigne,
J. De Baets, I. De Rycke, H. De Smet, A. Van Calster,
and J. Vanfleteren, “A correlation between 1/f-noise and short-term drift
in poly CdSe:In thin film transistors,” in
Noise in Physical Systems (Ambrozy, ed.), pp. 511-514, 1989.
[78] A. Vervaet, “Het gebruik van kunststoffen in het zeefdrukken,” in Studiedag: Kunststoffen in de Elektronika, (Anterpen), KVIV, oktober 1989.
[79] A. Van Calster, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, and J. Vanfleteren, “Transistori a film sottile per indicatori a schermo piatto,” Alta Frequenza Riv. di Elett., vol. II, no. 1, pp. 3-8, 1990.
[80]
J. Doutreloigne,
J. De Baets, I. De Rycke, H. De Smet, A. Van Calster,
and J. Vanfleteren, “The influence of low copper-doping concentrations on
the recrystallisation process in and the electrical properties of germanium in Ge:Cu
thin film transistors,” Thin Solid Films,
no. 189, pp. 235-245, 1990.
[81]
I. De Rycke,
A. Van Calster, J. Vanfleteren, J. De Baets, J. Doutreloigne,
H. De Smet, and P. Vetter, “2-MHz clocked LCD drivers on glass,” IEEE J. Solid-State Circuits, vol. 25,
no. 2, pp. 531-538, 1990.
[82]
A. Vervaet,
I. Clemminck, and M. Burgelman, “Solid-state coulometric titration study
of sputtered cuxs layers,” Journal of the
Electrochemical Society, vol. 137, pp. 2962-2966, 1990.
[83] J. De Baets, J. Vanfleteren, I. De Rycke, J. Doutreloigne, A. Van Calster, and P. De Visschere, “High-voltage polycrystalline CdSe thin film transistors,” IEEE Trans. Electron Devices, vol. 37, no. 3, pp. 636-639, 1990.
[84] A. Van Calster, Video course on thin film technology. EuroPACE, March 1990.
[85] J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, and J. Vanfleteren, “Influence of the processing parameters of CdSe on TFT characteristics,” in Proc. of the 1st Int. CdSe Workshop, (Gent), pp. 53-68, TFCG-RUG, 1990.
[86] J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, and A. Van Calster, “CdSe TFT technology at the RUGent laboratory of electronics,” in Proc. of the 1st Int. CdSe Workshop, (Gent), pp. 16-26, TFCG-RUG, 1990.
[87] H. De Smet, J. Doutreloigne, J. Capon, J. De Baets, I. De Rycke, A. Van Calster, and J. Vanfleteren, “Designing complementary integrated driver circuits,” in Proc. of the 1st Int. CdSe Workshop, (Gent), pp. 92-102, TFCG-RUG, 1990.
[88] J. Doutreloigne, H. De Smet, J. De Baets, I. De Rycke, A. Van Calster, and J. Vanfleteren, “Complementary CdSe:In/Ge:Cu TFT circuits for integrated display drivers,” in Eurodisplay 90, (Amsterdam), pp. 316-319, SID, 1990.
[89] J. Vanfleteren, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmén, and R. Graeffe, “Design of a prototype active matrix CdSe TFT addressed EL display,” in Eurodisplay 90, (Amsterdam), pp. 216-219, SID, 1990.
[90]
A. Vervaet,
M. Burgelman, I. Clemminck, and M. Casteleyn, “Screen printing
of CIS films for CIS-CdS solar cells,” in
Proceedings of the 10th E.C. PVSEC, (Lissabon), pp. 900-903, 1990.
[91]
I. Clemminck,
M. Burgelman, and A. Vervaet, “Screenprinted CdS-CdTe solar cells,”
in Proceedings of the 10th E.C. PVSEC,
(Lissabon), pp. 577-580, 1990.
[92]
J. Doutreloigne,
J. De Baets, I. De Rycke, H. De Smet, A. Van Calster,
and J. Vanfleteren, “The electrical performance of a complementary CdSe:In/Ge:Cu
thin film transistor technology for flat panel displays,” Solid State Electronics, vol. 34, no. 2, pp. 143-147,
1991.
[93]
A. Van Calster,
J. Capon, J. De Baets, I. De Rycke, H. De Smet,
J. Doutreloigne, and J. Vanfleteren, “Thin film transistors for the addressing
of liquid crystal displays,” in Summer
European Liquid Crystal Conf., (Vilnius), --, August 19-25 1991.
[94] J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa, and H. Takatsu, “A polymer network liquid crystal poly-CdSe TFT active matrix display,” in Int. Display Research Conf. 91, (San-Diego), pp. 215-218, SID, 1991.
[95] J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmén, and K. Graeffe, “Evaluation of a 64 × 64 CdSe TFT addressed ACTFEL display demonstrator,” in Int. Display Research Conf. 91, (San-Diego), pp. 134-136, SID, 1991.
[96]
J. Capon,
J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne,
A. Van Calster, and J. Vanfleteren, “CdSe based thin film
integrated optical sensors,” in
Eurosensors V conf. book of abstracts, (Rome), p. 257, 1991.
[97]
R. Vanden Berghe,
S. Demolder, M. Saillé, A. Van Calster, and H. Schotte,
“Palladium/silver multilayers,” Hybrid
Circuits, no. 25, pp. 16-20, 1991.
[98]
J. Capon,
J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne,
A. Van Calster, and J. Vanfleteren, “CdSe based thin film
integrated optical sensors,” Sensors and
Actuators A, vol. 32, no. 1-3, pp. 437-411, 1992.
[99]
J. Vanfleteren,
J. Capon, J. De Baets, I. De Rycke, H. De Smet,
J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmén,
and R. Graeffe, “CdSe TFT active matrix addressed electroluminescent displays,”
in 3rd Winter workshop AMLCDs,
(Minsk), February 1992.
[100]H. De Smet, J. Doutreloigne, J. Capon, J. De Baets, I. De Rycke, A. Van Calster, and J. Vanfleteren, “Unification of poly-CdSe active matrix and poly-CdSe/poly-Ge integrated driver technology,” in Proc. of the 2nd Int. CdSe Workshop, (London), Imperial College, May 1992.
[101]J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, and J. Vanfleteren, “Polymer network liquid crystal poly-CdSe TFT active matrix displays,” in Proc. of the 2nd Int. CdSe Workshop, (London), Imperial College, May 1992.
[102]A. Van Calster, J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, and J. Vanfleteren, “On the ohmic contact formation in poly-CdSe thin films,” in Proc. of the 2nd Int. CdSe Workshop, (London), Imperial College, May 1992.
[103]J. Farrell, M. Westcott, A. Van Calster, J. De Baets, I. De Rycke, J. Capon, H. De Smet, J. Doutreloigne, and J. Vanfleteren, “Thin film cadmium selenide technology in large area active matrix high resolution displays,” in Proceedings of the ESSDERC '92, (Leuven), pp. 187-190, IMEC, September 1992.
[104]J. Capon, J. De Baets, I. De Rycke,
H. De Smet, J. Doutreloigne, A. Van Calster, and J. Vanfleteren,
“Geometric design of lensless photoconductive contact-type image sensors,” Journal of the SID, vol. 1, no. 2,
pp. 233-241, 1993.
[105]J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, T. Fujisawa, H. Ogawa, and H. Takatsu, “Active matrix design for polymer network liquid crystal projection displays,” in Proc. of the 1st TFTT Symposium, vol. 92-24, (Toronto), pp. 296-306, The Electrochem. Soc., October 1992.
[106]J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, G. Nachtergaele, and S. Demolder, “Silicon oxynitride layers for device passivation,” in Proc. of the 1st TFTT Symposium, vol. 92-24, (Toronto), pp. 192-199, The Electrochem. Soc., October 1992.
[107]H. De Smet, J. Capon, J. De Baets,
I. De Rycke, J. Doutreloigne, A. Van Calster, and J. Vanfleteren,
“Active matrix with integrated drivers on soda-lime glass using poly-CdSe and poly-Ge,”
in Japan Display 92, (Hiroshima), pp. 225-228,
SID, 1992.
[108]M. J. Zhou, A. De Bruycker, A. Van Calster,
J. Witters, and G. Schols, “Breakdown walkout and its reduction in
high-voltage pLDMOS transistors on thin epitaxial layer,” IEE Electronics Letters, vol. 28, no. 16, pp. 1537-1538,
1992.
[109]J. Capon, J. De Baets, I. De Rycke,
H. De Smet, J. Doutreloigne, A. Van Calster, and J. Vanfleteren,
“A lensless contact-type image sensor based on a CdSe photoconductive array,”
in Eurosensors VI conf. book of abstracts,
(San Sebastian), pp. 287-288, October 1992.
[110]A. Van Calster, J. Capon, J. De Baets,
I. De Rycke, H. De Smet, J. Doutreloigne, and J. Vanfleteren,
“Thin film transistors for the addressing of liquid crystal displays,” Molecular Materials, vol. 1, pp. 189-301,
1992.
[111]J. De Baets, A. Van Calster,
J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne,
J. Vanfleteren, T. Fujisawa, H. Ogawa, and H. Takatsu, “Active
matrix design for polymer network liquid crystal projection displays,” in Thin Film Transistor Technologies,
Symposium, Book of Abstracts, (Toronto), pp. 471-472, The
Electrochemical Society, October 1992.
[112]J. De Baets, A. Van Calster,
J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne,
and J. Vanfleteren, “Silicon oxynitride layers for device passivation,” in Thin Film Transistor Technologies,
Symposium, Book of Abstracts, vol. 92-2, (Toronto), pp. 454-455,
The Electrochemical Society, October 1992.
[113]A. Van Calster, J. De Baets,
A. M. De Cubber, H. De Smet, J. Capon, J. Vanfleteren,
J. Farrell, and M. Westcott, “Thin film technologies for high density
active matrix addressed displays,” in
Proc. 9th European Hybrid Microelectronics Conf., (Nice), pp. 84-90,
ISHM, June 2-4, 1993.
[114]B. De Meulemeester, A. Van Calster,
A. De Bruycker, and K. Allaert, “Fabrication of high density
multi-chip modules with standard IC production equipment,” Hybrid Circuits, no. 30, pp. 27-30, 1993.
[115]J. De Baets, J. Capon, I. De Rycke,
H. De Smet, J. Doutreloigne, A. Van Calster, J. Vanfleteren,
T. Fujisawa, H. Ogawa, and H. Takatsu, “A polymer-network
liquid-crystal poly-CdSe-TFT active-matrix display,” Journal of the SID, vol. 1, no. 2, pp. 189-194,
1993.
[116]M. J. Zhou, A. De Bruycker, A. Van Calster,
and G. Schols, “Modified SPICE modelling of DC characteristics for high-
voltage DMOS transistors,” IEE
Electronic Letters, vol. 29, no. 1, pp. 126-127, 1993.
[117]A. De Bruycker, M. J. Zhou, A. Van Calster,
and J. Witters, “Improved negative dynamic resistance model for high
voltage MOSFETs,” IEE Electronic Letters,
vol. 29, no. 2, pp. 212-213, 1993.
[118]H. De Smet, J. Capon, J. De Baets, A. M. De Cubber, A. Van Calster, and J. Vanfleteren, “Generalised TFT-Model for 4-Quadrant simulations,” in Proc. of the 3nd Int. CdSe Workshop, (Strasbourg), Institut für Bildschirmtechnik, Aug 1993.
[119]A. Van Calster, J. De Baets, A. M. De Cubber, J. Capon, H. De Smet, and J. Vanfleteren, “On the physical properties of a new HVTFT design,” in Proc. of the 3nd Int. CdSe Workshop, (Strasbourg), Institut für Bildschirmtechnik, Aug 1993.
[120]I. Vedernikova and A. Vervaet, “A new synthesis of peremidines,” in Presented at the 14th Int. Congres of Heterocyclic Chemistry, (Antwerp), Aug 1993.
[121]A. Vervaet and I. Vedernikova, “Nucleophilic reactions of 4-OXO-1,4-dihydropiridiniumperchlorate,” in Presented at the 14th Int. Congres of Heterocyclic Chemistry, (Antwerp), Aug 1993.
[122]M. J. Zhou, H. De Smet, A. De Bruycker,
and A. Van Calster, “A 2-D boundary element method approach to the
simulation of DMOS transistors,” IEEE
Trans. on CAD of ICs and Systems, vol. 12, no. 6, pp. 810-816, 1993.
[123]R. Baets, P. Demeester, P. Van Daele,
L. Martens, J. Van Campenhout, H. Pauwels, A. Van Calster,
P. De Visschere, I. Veretennicoff, H. Thienpont, R. Vounckx,
A. Barel, A. Vander Vorst, and D. Van Hoenacker, “Iuap-24:
Optoelectronic information technology,”
Physicalia Magazine, vol. 15, no. 12, pp. 167-181, 1993.
[124]J. Capon, J. De Baets, I. De Rycke,
H. De Smet, J. Doutreloigne, A. Van Calster, and J. Vanfleteren,
“A lensless contact-type image sensor based on a CdSe photoconductive array,” Sensors and Actuators A, vol. 37-38,
pp. 546-551, 1993.
[125]J. De Baets, J. Capon, A. M. De Cubber, H. De Smet, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa, M. Aizawa, and H. Takatsu, “Hysteresis phenomena in active matrix addressed Polymer Network Liquid Crystal displays,” in The 13th Int. Display Research Conf., (Strasbourg), pp. 117-120, SID, 1993.
[126]H. De Smet, J. Capon, J. De Baets,
I. De Rycke, J. Doutreloigne, A. Van Calster, and J. Vanfleteren,
“Active matrix with integrated drivers on soda-lime glass using poly-CdSe and poly-Ge,” Journal of the SID, vol. 1, no. 4,
pp. 423-428, 1993.
[127]R. Vanden Berghe, S. Demolder,
M. Saillé, K. Allaert, A. De Bruycker, A. Van Calster,
J. Capon, J. De Baets, I. De Rycke, H. De Smet,
J. Doutreloigne, and J. Vanfleteren, “Failure mechanisms in
dielectrics,” in Proc. 8th European
Hybrid Microelectronics Conf., (Rotterdam), pp. 157-164, ISHM, May 28-31
1993.
[128]I. Clemminck, M. Burgelman, M. Casteleyn,
J. De Poortere, and A. Vervaet, “Interdiffusion of CdS and CdTe
in screenprinted and sintered CdS-CdTe solar cells,” in Proceedings of the 22nd IEEE PVS Conference, (Las Vegas), pp. 1114-1119,
1993.
[129]J. Capon, J. De Baets, A. M.
De Cubber, H. De Smet, A. Van Calster, and J. Vanfleteren,
“Analysis of transient photoconductivity in CdSe:Cu:Cl thin films,” Physica Status Solidi (a), vol. 142,
no. 1, 1994.
[130]A. Van Calster, J. De Baets, J. Vanfleteren, A. Dravet, K. Allaert, E. Cortes, K. Deckelmann, and G. Schols, “Anisotropic conductive adhesives for high density interconnections,” in Proc. 1st European Conf. on Electron. Packaging Techn., pp. 66-68, DVS, 1994.
[131]J. Vanfleteren, J. De Baets, A. Van Calster,
A. Dravet, K. Deckelmann, J. Wiese, W. Schmitt, K. Allaert,
P. Vetter, G. Schols, and E. Cortés, “Anisotropic Conductive Adhesives
for high density interconnections in Liquid Crystal Displays,” in Proc. of the 1st Int. Conf. on Adhesive
Joining Technology in Electronics Manufacturing., (Berlin), Nov 1994.
[132]M. Vrana, A. Van Calster, D. Vanický,
W. Delbare, R. Vanden Berghe, S. Demolder, and K. Allaert,
“Photo-imageable thick films for multichipmodules,” in International Conference on Electronic Technologies, (Windsor,
England), pp. 41-45, June 1994.
[133]A. Van Calster, A. M. De Cubber, J. De Baets, H. De Smet, and J. Vanfleteren, “A simplified 3-step fabrication scheme for high mobility AMLCD panels,” in The 14th Int. Display Research Conf., (Monterey, USA), pp. 289-290, SID, October 1994.
[134]J. De Baets, A. Van Calster,
A. M. De Cubber, H. De Smet, and J. Vanfleteren, “Modelling
Poly-CdSe TFTs for AMLCD,” in Fall
Meeting of the Electrochemical Society, Extended Abstracts, vol. 94-2,
(Miami), pp. 693-694, The Electrochemical Society, October 1994.
[135]G. De Pestel, W. Delbare, K. Allaert,
A. Ambrosy, T. Qingsheng, J. Vandewege, J. Verbeke, and M. Vrana,
“Multifibre electro-optical modules compatible with the fibre in board
technology,” in LEOS '94 Conference,
(Boston, USA), October 1994.
[136]J. De Baets, A. Van Calster,
A. De Cubber, H. De Smet, and J. Vanfleteren, “Modelling
Poly-CdSe TFTs for AMLCD,” in Proceedings
of the Electrochemical Society, (Miami, USA), pp. 228-232, October
1994.
[137]A. M. De Cubber and N. Carchon, “Active
matrix design for projection,” in Mid
European SID AMLCD Meeting, (Gent), October 1994.
[138]M.-J. Zhou and A. Van Calster, “A
breakdown voltage model for implanted resurf p-LDMOS device n+
buried layer,” Solid-State Electronics,
vol. 37, no. 7, pp. 1383-1385, 1994.
[139]R. Baets, P. Demeester, P. Van Daele,
L. Martens, J. Van Campenhout, H. Pauwels, A. Van Calster,
P. De Visschere, I. Veretenicoff, H. Thienpont, R. Vounckx,
A. Barel, A. Vander Vorst, and D. Vanhoenacker, “Optoelectronic
information technology. interuniversity attraction pole 24,” HF Tijdschrift, no. 3, pp. 33-42,
1994.
[140]M. Vrana, A. Van Calster, D. Vanický,
W. Delbare, R. Vanden Berghe, S. Demolder, and K. Allaert,
“Photo-imageable thick films for multichipmodules,” Microelectronics International, no. 36, pp. 16-18, 1995.
[141]I. Popov and B. Tchernorotov, “a-SiN:H
thin films for application in diode array AMLCD's,” in Proc. of the 4th SID workshop on high informative displays,
(Minsk, Russia), p. acc., February 1995.
[142]J. Lernout, A. Van Calster, M. Vereeken, and G. Schols, “Two-layer silicon hybrids interconnect technology,” in Proc. of the 4th Int. Conf. on multichip modules, (Denver, Colorado), pp. 375-380, April 1995.
[143]J. Lernout, A. Van Calster, M. Vereeken,
and G. Schols, “Two-layer silicon hybrid interconnect,” in Proc. of the 10th European Microelectronics
Conference, (Copenhagen, Denmark), pp. 162-171, May 1995.
[144]A. Dravet, S. Séchez, A. Van Calster,
J. De Baets, J. Vanfleteren, K. Allaert, P. Vetter, M. Forrest,
G. Schols, K. Deckelmann, J. Wiese, and E. Cortés, “A new
cost-effective TAB technology for small and medium volumes,” in Proc. of the 10th European Microelectronics
Conference, (Copenhagen, Denmark), pp. 547-558, May 1995.
[145]M. Vrana, A. Van Calster, R. Vanden Berghe,
and K. Allaert, “Interconnection technology for advanced high density
thick films,” in Proc. of the 10th European
Microelectronics Conference, (Copenhagen, Denmark), pp. 190-198, May
1995.
[146]A. Van Calster, “Hybrid integrated
sensors,” in NATO Advanced Research Workshop,
(Budapest, Hongary), p. invited, May 1995.
[147]J. De Baets, A. Van Calster, J. Van Den Steen, G. Van Doorselaer, D. Wojciechowski, G. Schols, and J. Witters, “Design of an x-Si active matrix for high resolution reflective displays,” in Proc. of the 15th Int. Display Research Conf., (Hamamatsu, Japan), pp. 477-479, SID, October 1995.
[148]I. Popov, A. Van Calster, and J. Lernout, “Stable a-SiN:H TFD for use in X-ray environment,” in Proc. of the 15th Int. Display Research Conf., (Hamamatsu, Japan), pp. 297-300, SID, October 1995.
[149]H. De Smet, J. De Baets, A. M.
De Cubber, J. De Vos, A. Van Calster, and J. Vanfleteren,
“New model for the characterization and simulation of TFTs in all operating
regions,” Journal of the SID, vol. 3,
no. 3, pp. 119-125, 1995.
[150]D. Wojciechowski, A. Van Calster,
and J. Witters, “Technology-CAD applied to the development of DMOS
devices,” in Proc. of the International Semiconductor
Device Research Symposium, (Charlottesville, Virginia), pp. 785-788,
December 1995.
[151]B. Maximus, A. De Meyere, J. Capon,
E. De ley, D. Corlatan, and H. Pauwels, “Optimisation of
the design of a discrete cdse-flc oaslm,” in
Book of abstracts FLC 95, pp. 213-214, 1995.
[152]M. Casteleyn, M. Burgelman, B. Depuydt,
A. Vervaet, and W. Vanhelleputte, “High pressure selenization of CuInSe2,”
in Proc. of the 13th European
Photovoltaic Solar Energy Conference and Exhibition, book of abstracts,
(Nice, France), p. PO7B.16, October 1995.
[153]M. Casteleyn, M. Burgelman, B. Depuydt,
and A. Vervaet, “High pressure selenization of CuInSe2,” in Proc. of the 13th European Photovoltaic Energy
Conference, (UK), pp. 1987-1990, October 1995.
[154]B. Depuydt, M. Burgelman, M. Casteleyn,
and A. Vervaet, “The effects of diffusion of impurities from graphite back
contacts on CdTe/CdS cells,” in Proc. of
the 13th European Photovoltaic Solar Energy Conference and Exhibition, book of
abstracts, (Nice, France), p. OR3.1, October 1995.
[155]B. Depuydt, M. Burgelman, M. Casteleyn,
A. Vervaet, and A. Niemegiers, “The effects of diffusion of
impurities from graphite back contacts on CdTe/CdS cells,” in Proc. of the 13th European Photovoltaic
Energy Conference, (UK), pp. 593-596, October 1995.
[156]D. Wojciechowski, A. Van Calster, M. Vrana, J. De Baets, and M. De Caluwé, “Flip-chip technology for chip on glass applications (LCD),” in Proc. of the 2nd European Conf. on Electron. Packaging Techn., (Essen, Germany), pp. 47-50, DVS, January 1996.
[157]J. Vanfleteren, A. Van Calster, K. Sabbe, M. De Caluwé, A. Dravet, P. Kertesz, S. Sécher, K. Deckelmann, J. Wiese, E. Cortés, M. Lopez, G. Schols, K. Allaert, P. Vetter, and M. Forrest, “Development of an adhesive TAB joining technology,” in Proc. of the 2nd European Conf. on Electron. Packaging Techn., (Essen, Germany), pp. 24-26, DVS, January 1996.
[158]G. De Pestel, A. Ambrosy, Q. Tan, M. Vrana, F. Migom, H. Richter, J. Vandewege, and P. Vetter, “Multichannel optical modules compatiblewith the fiber-in-board technology,” IEEE Trans. on Components, Packaging and Manufacturing technology, vol. B-19, no. 1, pp. 116-123, 1996.
[159]J. Lernout, A. Van Calster, and
G. Schols, “On the effective integration of resistors and capacitors into
a MCM-Si design,” in Proc. of the 1996 International
Conference on Multichip Modules, (Denver, Colorado), pp. 391-396,
ISHM, April 1996.
[160]A. Dravet, P. Kertesz, S. Séchez,
A. Van Calster, J. Vanfleteren, M. De Caluwé, K. Deckelmann,
J. Wiese, Cortes, M. Lopez, G. Schols, K. Allaert, P. Vetter,
and M. Forrest, “A low-cost TAB interconnection technology for LCD
drivers,” in Digest of technical papers,
(San Diego, California), pp. 925-928, SID, May 1996.
[161]M. Vrana, J. De Baets, A. Van Calster,
D. Wojciechowski, A. Ostmann, and H. Reichl, “An anisotropic
adhesive flip-chip technology for lcd drivers,” in Digest of technical papers, (San Diego, California), pp. 929-932,
SID, May 1996.
[162]G. De Pestel, A. Ambrosy, Q. Tan,
M. Vrana, F. Migom, H. Richter, J. Vandewege, and P. Vetter,
“Parallel optical interconnections for future broad band systems based on the
fiber-in-board technology,” in Proc. of
the 46th Electronic Components Technology Conference (ECTC'96), (Orlando,
Florida), pp. 264-268, May 1996.
[163]I. Popov, A. Van Calster, H. De Smet, E. Boesman, and F. Callens, “2D direct X-ray sensor array on the base of SiN:H thin films,” in Proc. of the 16th Int. Display Research Conf., (Birmingham, England), pp. 431-433, SID, October 1996.
[164]N. Carchon, G. Van Doorselaer,
A. M. De Cubber, J. De Baets, A. Van Calster, P. Candry,
and J. Bruggeman, “A poly-CdSe active matrix for PNLC projection displays,”
in Proc. of the 3rd symposium on thin
film transistor technologies (Y. Kuo, ed.), vol. 96-2,
(Pennington, New Jersey), pp. 366-374, The Electrochemical Society,
Electrochemical Publications, October 1996.
[165]N. Carchon, G. Van Doorselaer,
A. M. De Cubber, J. De Baets, A. Van Calster, P. Candry,
and J. Bruggeman, “A poly-CdSe active matrix for PNLC projection displays,”
in Book of abstract of the 3rd symposium
on thin film transistor technologies, vol. 2, p. 649, The
Electrochemical Society, October 1996.
[166]R. Baets, B. Dhoedt, J. Blondelle,
H. De Neve, F. Fredricx, L. Vanwassenhove, P. Demeester,
I. Moerman, P. Van Daele, G. Borghs, J. Lernout, J. Van Campenhout,
A. Van Calster, H. Thienpont, I. Veretennicoff, and R. Vounckx,
“Micro-cavity LED's and their application in optical interconnect research
within the IUAP-24 project (invited paper),” in Proc. of the Annual Symposium of the IEEE/LEOS Benelux Chapter,
(Enschede, Nederland), pp. 4-10, November 1996.
[167]M. Vrana, A. Van Calster, R. Van den
Berghe, and K. Allaert, “Interconnection technology for advanced high
density thick films,” Microelectronics International
(Hybrid Circuits), no. 41, pp. 5-8, 1996.
[168]A. M. De Cubber, H. De Smet, J. De Vos, N. Carchon, and A. Van Calster, “Complementary high-voltage technology based on n-type CdSe:In and p-type Ge:Cu thin-film transistor,” IEEE Electron Device Lett., vol. EDL-17, no. 12, pp. 581-583, 1996.
[169]B. Maximus, A. De Meyere, J. Capon,
E. De Ley, D. Corlatan, and H. Pauwels, “Optimisation of
the design of a discrete cdse-flc oaslm,”
Ferroelectrics, vol. 181, pp. 111-120, 1996.
[170]M. Vermandel, “De warmtebeeldgenerator als visuele prothese voor blinden,” Het Ingenieursblad, vol. EDL-17, no. 3, pp. 52-59, 1997.
[171]S. Zhang, M. Vereecken, J. De Baets,
A. Van Calster, A. Vervaet, J. Peeters, and K. Allaert,
“Electroless nickel-gold stud bumping on laminate for flip-chip assembly,” in Proc. of the Printed Circuit Board
Technology, Reliability and Microintegration Session, (Berlin, Germany),
January 1997.
[172]J. Lernout, J. Vanfleteren, A. Van Calster,
and G. Schols, “A five layer thin film MCM-Si design using oxynitride
dielectrics,” in Proc. of the 11th
European Microelectronics Conference, (Venice, Italy), pp. 637-640, May
1997.
[173]J. Lernout, J. Vanfleteren, A. Van Calster,
and G. Schols, “A five layer thin film MCM-Si design using oxynitride
dielectrics,” in Abstract Book of IMAPS/NATO
Advanced Research Workshop on Electronic Packaging for High Reliability, Low
Cost Electronics, (Bled, Slovenia), May 1997.
[174]M. Vrana, J. De Baets, A. Van Calster,
and B. Allaert, “Flip-chip assembly for chips with gold bumps on high
density thick film substrates,” in Proc. of
the 11th European Microelectronics Conference, (Venice, Italy), pp. 175-182,
May 1997.
[175]L. Vanwassenhove, L. Haelvoet, L. Martens,
P. Van Daele, A. Van Calster, and J. Vandewege, “Low-cost
fibre-chip coupling for electro-optic EMC-probes,” in Proc. of the 11th European Microelectronics Conference, (Venice,
Italy), pp. 148-155, May 1997.
[176]E. Reese and J. Vanfleteren, “Fine
pitch interconnection using anisotropic conductive adhesives,” in Proc. of the 11th European Microelectronics
Conference, (Venice, Italy), pp. 457-464, May 1997.
[177]J. Van den Steen, G. Van Doorselaer,
J. De Baets, and A. Van Calster, “Custom design and system
integration,” in Proc. of the 20th
International Spring Seminar on Electronic Technology, Education and Research
in Microelectronics (M. Lukaszewicz and M. Kramkowska, eds.),
(Szklarska Poreba, Poland), pp. 263-266, June 1997.
[178]M. Vermandel, C. De Backere, and
A. Van Calster, “A high voltage nDMOS structure in a standard
sub-micron CMOS process,” in Proc. of the
27th European Solid-State Device Research Conference (H. Grunbacher,
ed.), (Stuttgart, Germany), pp. 508-511, ESSDERC, Editions Frontieres,
September 1997.
[179]J. De Vos, H. De Smet, and
A. Van Calster, “High voltage EL drivers integrated on glass,” in Proc. of the 1997 International Display Research
Conference, (Toronto, Canada), pp. 366-369, SID, September 1997.
[180]J. Van den Steen, N. Carchon, G. Van Doorselaer,
C. De Backere, J. De Baets, H. De Smet, J. De Vos,
J. Lernout, J. Vanfleteren, and A. Van Calster, “Technology
and circuit aspects of reflective PNLC microdisplays,” in Proc. of the 1997 International Display Research Conference,
(Toronto, Canada), pp. 195-198, SID, September 1997.
[181]A. Van Calster, “Microdisplays and
interconnection technologies for telecommunication systems,” in IMEC, Annual Research Review Meeting, (Leuven,
Belgium), pp. 20-21, IMEC, November 1997.
[182]P. Van Daele and A. Van Calster,
“Flip-chip and interconnection technology,” in IMEC, Annual Research Review Meeting, (Leuven, Belgium), p. 39,
IMEC, November 1997.
[183]I. A. Popov, G. Van Doorselaer,
A. Van Calster, H. De Smet, F. Callens, and E. Boesman,
“Prototype of 2D direct X-ray a-SiN:H sensor array,” in Proc. of the Photonics West'98 Electronic Imaging, (Anaheim, USA),
pp. 126-130, SPIE, January 1998.
[184]L. Vanwassenhove, K. Haelvoet, L. Martens,
P. Van Daele, A. Van Calster, and J. Vandewege, “Low-cost
fibre-chip coupling for electro-optic EMC-probes,” Microelectronics International (Hybrid Circuits), vol. 15,
no. 1, pp. 32-34, 1998.
[185]J. Lernout, J. Vanfleteren, A. Van Calster,
and G. Schols, “A five-layer thin film MCM-Si design using oxynitride
dielectrics,” Microelectronics International
(Hybrid Circuits), vol. 15, no. 1, pp. 39-42, 1998.
[186]M. Réczey, R. Dobay, G. Harsanyi,
Z. Illyefalvi-Vitéz, J. Van den Steen, A. Vervaet, W. Reinert,
J. Urbancik, A. Guljajev, C. Visy, and I. Barsony, “ASIC
chip, hybrid multisensor, and package co-design for smart gas monitoring
module,” in Proc. of the International
Workshop on Chip Package Co-Design, (Zurich, Switzerland), pp. 132-139,
IEEE, March 1998.
[187]I. A. Popov, G. Van Doorselaer,
A. Van Calster, H. De Smet, F. Callens, and E. Boesman,
“Material aspects of a a-SiN:H based 2D direct X-ray sensor array,” in Proc. of the 1998 Material research Society,
(San francisco, USA), pp. 231-236, ?, April 1998.
[188]J. Vanfleteren, “Flip chip attachment
using adhesives,” in Proc. of the IMAPS-Benelux
Spring Event 98, (Leuven, Belgium), pp. ?-?, IMAPS, April 1998.
[189]M. Vrana, J. De Baets, A. Van Calster, , I. Born, and D. Detemmermann, “Low cost high density multlayer interconnection technology,” in Proc. of the 3rd European Conf. on Electron. Packaging Techn., (Nuremberg, Germany), pp. 129-133, DVS, June 1998.
[190]J. Lernout, J. Vanfleteren, A. Van Calster, L. Vanwassenhove, and P. Vandaele, “Design and fabrication of a two layer thin film interconnection sytem on glass for use in a parallel free-space optical interconnection demonstrator,” in Proc. of the 3rd European Conf. on Electron. Packaging Techn., (Nuremberg, Germany), pp. 7-9, DVS, June 1998.
[191]S. Zhang, M. Vereeken, , J. De Baets, A. Van Calster, J. Peeters, and K. Allaert, “The realisation of photo-via technology using multipost as a photo imageable dielectric,” in Proc. of the 3rd European Conf. on Electron. Packaging Techn., (Nuremberg, Germany), pp. 62-65, DVS, June 1998.
[192]A. Van Calster and P. Vandaele, “Technological
aspects of optoelectronic array devices for free space optical systems,” in Proc. of Optics in Computing, (Brugge,
Belgium), pp. 506-509, EOS, SPIE, June 1998.
[193]M. Vermandel, C. De Backere, A. Van Calster,
J. Witters, and M. Tack, “A high voltage p-type drain extended MOS in
a low voltage sub-micron CMOS technology,” in Proc. of the 28th European Solid-State Device Research Conference,
(Bordeaux, France), pp. 492-495, ESSDERC, September 1998.
[194]G. Van Doorselaer, N. Carchon,
J. Van den Steen, D. Cuypers, J. Vanfleteren, H. De Smet,
and A. Van Calster, “A reflective polymer dispersed information display
made on CMOS,” in Proc. of the ICPS,
(Antwerpen, Belgium), pp. 222-225, September 1998.
[195]I. Popov, G. Van Doorselaer, A. Van Calster,
H. De Smet, F. Callens, and E. Boesman, “A-SiN:H TFD sensor
array for digital radiography,” in Proc.
of the ICPS, (Antwerpen, Belgium), pp. 315-319, September 1998.
[196]G. Van Doorselaer, N. Carchon,
J. Van den Steen, J. Vanfleteren, H. De Smet, D. Cuypers,
and A. Van Calster, “Characterization of a paper-white reflective PDLC
microdisplay for portable IT applications,” in Proc. of the 1998 International Display Research Conference,
(Seoul, Korea), pp. 55-58, SID, September 1998.
[197]C. De Backere, M. Vermandel, and
V. C. A, “Light shielding with liquid crystal on silicon displays,” in Proc. of the 1998 International Display Research
Conference, (Seoul, Korea), pp. 415-418, SID, September 1998.
[198]D. Wojciechowski, J. Vanfleteren, E. Reese,
and H. Hagedorn, “New adhesives for high density flip-chip
interconnections,” in Proc. of the IMAPS'98,
(San Diego, USA), pp. 224-229, IMAPS, November 1998.
[199]H. De Pauw, H. De Smet, J. Vanfleteren,
and A. Van Calster, “Multilayer motherboard technology in MCM-Si with
opto-electronic features,” in Proc. of
the IMAPS'98, (San Diego, USA), pp. 347-352, IMAPS, November 1998.
[200]G. Van Doorselaer, B. Dobbelaere,
M. Vrana, X. Xie, N. Carchon, J. Van den Steen, J. Vanfleteren,
H. De Smet, D. Cuypers, and A. Van Calster, “A paper-white
chip-based display MCM package for portable IT products,” in Proc. of the IMAPS'98, (San Diego,
USA), pp. 543-547, IMAPS, November 1998.
[201]M. Vrana, J. De Baets, A. Van Calster,
I. Born, and D. Detemmerman, “High density thick film multilayers
with Ag-based conductors,” in Proc. of the
IMAPS'98, (San Diego, USA), pp. 789-794, IMAPS, November 1998.
[202]S. Zhang, M. Vereeken, J. De Baets,
and A. Van Calster, “The fabrication and reliability of a photovia
test vehicle for MCM-L applications,” in Proc.
of the IMAPS'98, (San Diego, USA), pp. 53-58, IMAPS, November 1998.
[203]J. De Vos, S. Stoukatch, H. De Pauw,
H. De Smet, I. Popov, J. Vanfleteren, and A. Van Calster,
“Active matrix vacuum fluorescent display with CdSe:In TFTS,” in Proc. of the 194th meeting of the Electrochemical
Society, (Boston, USA), pp. ?-?, The Electrochemical Society, November
1998.
[204]J. De Vos, S. Stoukatch, H. De Pauw,
H. De Smet, I. Popov, J. Vanfleteren, and A. Van Calster,
“Active matrix vacuum fluorescent display with CdSe:In TFTS,” in Meeting abstracts of the 194th meeting of
the Electrochemical Society, vol. 98-2, (Boston, USA), p. 716,
The Electrochemical Society, November 1998.
[205]I. Popov, G. Van Doorselaer, A. Van Calster,
H. De Smet, F. Callens, and E. Boesman, “a-SiN:H thin films
for x-ray sensor array,” in Proc. of international
seminar: Noise and degradation processes in semiconductor devices,
(Moscou), pp. 123-129, November 1998.
[206]A. Van Calster, “Microdisplays for
portable IT products and projection applications,” in Proc. of the fifth international display workshops, (Kobe, Japan),
pp. 135-138, IDW, December 1998.
[207]A. Van Calster, “Design and fabrication
of high-resolution light valves with silicon backplanes,” in Proc. of the 11th international symposium
on Electronic Imaging, (San Jose, USA), pp. ?-?, SPIE, January 1999.
[208]G. Van Doorselaer, N. Carchon,
J. Van den Steen, J. Vanfleteren, H. De Smet, D. Cuypers,
and A. Van Calster, “A silicon based reflective polymer dispersed LC
display for portable low power applications,” in Proc. of the 11th international symposium on Electronic Imaging,
(San Jose, USA), pp. 95-102, SPIE, January 1999.
[209]H. De Smet and A. Van Calster,
“Microdisplays,” in Proc. of the 11th Symposium
and Seminar on Displays and Display Technology (VISU 99), (Grenoble,
France), Le Club Visu (SID France), January 1999.
[210]H. De Smet, “Liquid crystal displays
on monocrystalline silicon,” in Proc. of
the 11th Symposium and Seminar on Displays and Display Technology (VISU 99),
(Grenoble, France), Le Club Visu (SID France), January 1999.
[211]J. De Vos, H. De Smet, A. De Cubber,
and A. Van Calster, “High voltage CdSe-Ge TFT driver circuits for
passive AC-TFEL displays,” IEEE J. Solid-State
Circuits, vol. 34, no. 2, pp. 228-232, 1999.
[212]Z. Illyefalvi-Vitéz, A. Vervaet, A. Van Calster,
N. Sinnadurai, M. Hrovat, P. Svasta, E. Toth, D. Belavic,
R. M. Ionescu, and W. Dennehy, “Low cost prototyping of multichip
modules,” in Proc. of the fifth European Conference
on MultiChip Modules, (London, UK), pp. 35-47, IMAPS-UK, February
1999.
[213]I. Born, D. Detemmerman, J. De Baets,
and A. Van Calster, “Low cost high-density multilayer circuits for MCM-C,”
in Proc. of the fifth European Conference
on MultiChip Modules, (London, UK), pp. 21-26, IMAPS-UK, February
1999.
[214]Z. Illyefalvi-Vitéz, A. Vervaet, A. Van Calster,
N. Sinnadurai, M. Hrovat, P. Svasta, E. Toth, D. Belavic,
R. M. Ionescu, and W. Dennehy, “Low cost prototyping of multichip
modules - the european INCO-Copernicus project,” Microelectronics International (Hybrid Circuits), vol. 16,
no. 2, pp. 13-19, 1999.
[215]G. Harsanyi, M. Réczey, R. Dobay,
I. Lepsényi, Z. Illyefalvi-Vitéz, J. Van den Steen, A. Vervaet,
W. Reinert, J. Urbancik, A. Guljajev, C. Visy, G. Inzelt,
and I. Barsony, “Combining inorganic and organic sensors elements: a new
approach for multi- component sensing,”
Sensor Review, vol. 19, no. 2, pp. 128-134, 1999.
[216]I. Born, D. Detemmerman, J. De Baets,
and A. Van Calster, “Low cost high-density multilayer circuits for MCM-C,” Microelectronics International (Hybrid
Circuits), vol. 16, no. 2, pp. 55-58, 1999.
[217]Z. Illyefalvi-Vitez, A. Vervaet, A. Van Calster,
N. Sinnadurai, M. Hrovat, P. Svasta, E. Toth, D. Belavic,
R. Ionescu, and W. Dennehy, “Cheap multichip modules,” Journal of Microelectronics, Electronic
Components and Materials, vol. 29, no. 2, pp. 71-78, 1999.
[218]S. Zhang, J. De Baets, and A. Van Calster,
“A new approach to flip chip on board technology using smt compatible
processes,” Microelectronics International,
vol. 16, no. 3, pp. 39-42, 1999.
[219]M. Vermandel and A. Van Calster,
“Implementation of the HV natural DEMOS in a sub-um CMOS technology,” in Proc. of MIPRO, (Optatija), pp. 9-12,
May 1999.
[220]J. Vanfleteren, J. De Baets, A. Van Calster,
G. Schols, N. Pergoot, E. Jarvinen, and A. Aintila, “Design,
fabrication and bumping of test chips for development of fine pitch flip-chip
technologies,” in Proc. of the 12th
European Microelectronics and Packaging Conference, (Harrogate, England),
pp. 399-404, IMAPS-Europe, June 1999.
[221]M. Réczey, I. Lepsényi, A. Reichardt,
G. Harsanyi, R. Dobay, A. Schon, Z. Illyefalvi-Vitéz, J. Van den
Steen, A. Vervaet, W. Reinert, J. Urbancik, A. Guljajev, C. Visy,
G. Inzelt, and I. Barsony, “Combining inorganic and organic gas
sensor elements: a new approach for multicomponent sensing,” in Proc. of the 12th European Microelectronics
and Packaging Conference, (Harrogate, England), pp. 189-195,
IMAPS-Europe, June 1999.
[222]S. Zhang, J. De Baets, and A. Van Calster,
“A new approach of flip chip on board technology using SMT compatible
processes,” in Proc. of the 12th European
Microelectronics and Packaging Conference, (Harrogate, England), pp. 111-117,
IMAPS-Europe, June 1999.
[223]H. Pauwels and H. De Smet, “Addressing
of liquid crystal displays,” in Proc. of
the 6th International Conference on Mixed Design, (Krakow, Poland), pp. 21-26,
June 1999.
[224]S. Zhang, J. De Baets, M. Vereeken,
A. Vervaet, and A. Van Calster, “Stabilizer concentration and
local environment: Their effects on electroless nickel plating of pcb
micropads,” Journal of The Electrochemical
Society, vol. 146, no. 8, pp. 2870-2875, 1999.
[225]H. De Smet, J. Van den
Steen, N. Carchon, D. Cuypers, C. De Backere, M. Vermandel,
A. Van Calster, A. De Caussemaeker, A. Witvrouw, H. Ziad,
K. Baert, P. Colson, G. Schols, and M. Tack, “The design
and fabrication of a 2560x2048 pixel microdisplay chip,” in Proc. of the 19th International Display Research Conference
(EuroDisplay99), (Berlin, Germany), pp. 493-496, SID, September 1999.
[226]C. De Backere, M. Vermandel, J. Van den
Steen, H. De Smet, and A. Van Calster, “A silicon backplane
technology for microdisplays,” in
Proceedings of the 29th European Solid-State Device Research Conference
ESSDERC`99, pp. 712-715, 1999.
[227]H. De Pauw, J. Vanfleteren, H. De Smet,
S. Zhang, and A. Van Calster, “A hybrid thin-film laser driver
module for RF frequency with a full-custom C07 analog driver amplifier,” in Proc. of the IMAPS'99, (Chicago, USA), pp. 195-200,
IMAPS, October 1999.
[228]S. Zhang, J. De Baets, A. Van Calster,
D. Corlatan, P. De Langhe, and K. Allaert, “Photovia
technology: Some important aspects for reliability,” in Proc. of the IMAPS'99, (Chicago, USA), pp. 240-245, IMAPS,
October 1999.
[229]G. Harsanyi, I. Lepsényi, A. Reichardt,
R. Réczey, M an Dobay, A. Schon, Z. Illyefalvi-Vitéz, J. Van den
Steen, A. Vervaet, W. Reinert, J. Urbancik, L. L, A. Petrikova,
A. Guljajev, C. Visy, G. Inzelt, and I. Barsony, “New perspectives
of selective gas sensing: Combining electroconducting polymers with thick and
thin films,” in Proc. of the IMAPS'99,
(Chicago, USA), pp. 207-212, IMAPS, October 1999.
[230]D. Baert and A. Vervaet, “Lead-acid
battery model for the derivation of peukert's law,” Electrochimica Acta, no. 44, pp. 3491-3504, 1999.
[231]J. Doutreloigne, H. De Smet, J. Van den
Steen, and G. Van Doorselaer, “Low-power high-voltage CMOS
level-shifters for liquid crystal display drivers,” in Proc. of the 11th International Conference on Microelectronics,
(State of Kuwait), pp. 213-216, November 1999.
[232]J. Van den Steen, H. De Smet,
G. Van Doorselaer, A. Van Calster, and Colson, “Cost
effective reticule design for very high resolution Si backplane prototypes,” in Proc. of IDW, (Sendai, Japan), pp. 235-238,
ITE, December 1999.
[233]A. Guljaev, I. Warlashov, O. Muchina,
I. Miroshnikova, O. Sarach, A. Titov, J. Van den
Steen, A. Vervaet, M. Reczey, R. Dobay, G. Horsanyi, Z. Illjefalvi-Vitez,
J. Urbanchik, and W. Reinert, “Sigma sensors intellectual gas
monitoring applications,” in Proc. of the
XXX international seminar: Noise and degradation processes in semiconductor devices,
(Moscou), pp. 402-407, November-December 1999.
[234]A. Vervaet, A. Comhaire, and E. Messens,
“Le professeur arend j. rutgers (1903-1998),” Chimie Nouvelle, vol. 17, no. 68, pp. 3024-3027,
1999.
[235]J. Lernout, J. Vanfleteren, A. Van Calster,
and G. Schols, “A five layer thin film MCM-Si design using oxynitride
dielectrics,” in Electronic Packaging for
High Reliability; Low Cost Electronics, (Kluwer Academic publishers, NATO
ASI Series, ISBN 0-7923-5218-1), pp. 179-186, (Tummala, Kosec, Jones,
Belavic editors), Vol 57 1999.
[236]A. Van Calster and D. Cuypers, “Reflective
vertically aligned nematic liquid crystal microdisplays for projection
applications (invited paper),” in Proc.
of the 2000 international symposium on Electronic Imaging Vol. 3954: Prction
Displays 2000: Sixth in a Series, (San Jose, USA), pp. 112-119, SPIE,
January 2000.
[237]D. Cuypers, “Vertically aligned nematic
liquid crystal displays for projection purposes,” in Proc. of the Spring '00 meeting of the SID-ME-Chapter meeting,
(Balzers (Liechtenstein)), SID, March 2000.
[238]H. De Pauw, H. De Smet, J. Vanfleteren,
J. Lernout, and A. Van Calster, “Extension of a multilayer
interconnection technology in MCM-Si with opto-electronic facilities,” Microelectronics Reliability, vol. 40,
pp. 163-170, 2000.
[239]I. Popov, G. Van Doorselaer, A. Van Calster, H. De Smet, J. De Baets, F. Callens, and E. Boesman, “a-SiN:H thin film diode for digital radiograhph,” in Proc. of the 2000 Material Research Society, (San francisco, USA), pp. A12.9.1-A12.9.5, April 2000.
[240]H. De Pauw, J. Vanfleteren, H. De Smet,
S. Zhang, and A. Van Calster, “An MCM-D laser driver hybrid with
RF amplifier chip, combining advanced FC assembly and novel single chip bumping
technology,” in Proc. of the International
Conference on High-Density Interconnect and Systems Packaging, (Denver),
pp. 557-562, April 2000.
[241]I. Popov, A. Van Calster, J. De Baets,
and H. De Pauw, “Implementation of the sytem of experiment design and
taboo search into SiON thin film technology,” in Book of abstracts of the third SIAM Conference on Mathematical Aspects
of Materials Science, (Philadelphia, Pennsylvania), p. 44, May 2000.
[242]M. Vermandel, J. Doutreloigne, P. Moens,
and M. Tack, “Calibration during the TCAD development of a high voltage pDEMOS
in a sub um CMOS technology,” in
Proceedings of CHIPPS, (Wandlitz, Germany), pp. 3-4, May 2000.
[243]J. Vanfleteren, A. Vervaet, and A. Van Calster,
“Highlights of the DACTEL project: Development of adhesive flip-chip
technologies for dedicated electronic applications,” in Proc. of the 23rd International Spring Seminar on Electronics Technology,
(Balatonfured, Hungary), pp. 315-318, May 2000.
[244]J. De Baets, M. Vereeken, A. Van Calster,
D. Corlatan, E. Raedschelders, P. De Langhe, G. Patra,
M. Morrell, C. Haley, G. Schols, A. Ostmann, and D. Mathelin,
“HIPERPRINT: A board technology for high-frequency applications,” in Proceedings of the European
Microelectronics Packaging and Interconnection Symposium, (Prague, Czech
Republic), pp. 326-332, June 2000.
[245]J. Vanfleteren, S. Stoukatch, B. Vandecasteele,
A. Van Calster, S. Criel, G. Willems, P. De Langhe,
L. Vandam, and K. Allaert, “Mixed assembly on PCB using a novel
flip-chip technology,” in Proceedings of
the European Microelectronics Packaging and Interconnection Symposium,
(Prague, Czech Republic), pp. 65-70, June 2000.
[246]S. Stoukatch, S. Zhang, J. Vanfleteren,
M. Vereeken, A. Van Calster, and B. Vandecasteele, “Electroless
ni plating bath composition and replenishment for microvia plating process,” in Proceedings of the European Microelectronics
Packaging and Interconnection Symposium, (Prague, Czech Republic), pp. 447-452,
June 2000.
[247]P. Colson, F. De Pestel, M. Tack,
G. Schols, H. De Smet, J. Van den Steen, and A. Van Calster,
“The design and fabrication of a GXGA microdisplay chip,” in Proceedings of SPIE on Micromachining,
Micromanufacturing and Microelectronic Manufacturing, Vol.4181, (Santa Clara,
California), pp. 315-323, September 2000.
[248]J. Doutreloigne, H. De Smet, and
A. Van Calster, “A new architecture for monolithic low-power high
voltage display drivers,” in Proceedings
of the 20th International Display Research Conference (IDRC), (Palm Beach, Florida),
pp. 115-118, September 2000.
[249]F. Bruyneel, H. De Smet, J. Vanfleteren,
and A. Van Calster, “Characteristics of PNLC in reflective displays,”
in Proceedings of the 20th International
Display Research Conference (IDRC), (Palm Beach, Florida), pp. 217-220,
September 2000.
[250]G. Van Doorselaer, J. Van den
Steen, H. De Smet, D. Cuypers, and A. Van Calster, “Flicker
reduction in AMLC displays by individual pixel voltage correction,” in Proceedings of the 20th International
Display Research Conference (IDRC), (Palm Beach, Florida), pp. 447-450,
September 2000.
[251]M. Vermandel, J. Doutreloigne, P. Moens,
and M. Tack, “Using the self aligned field implant to design high voltage
devices in sub-um CMOS technologies,” in
Proceedings of ESSDRC, (Cork), pp. 228-231, September 2000.
[252]J. Vanfleteren, S. Stoukatch, B. Vandecasteele,
A. Van Calster, S. Criel, G. Willems, P. De Langhe,
L. Vandam, and K. Allaert, “Mixed assembly on PCB using a novel
flip-chip technology,” Advancing
Microelectronics, vol. 27, no. 5, pp. 28-30, 2000.
[253]A. Van Calster, “Analog addressed
microdisplays (invited),” in Proceedings
of the 198th Meeting of the Electrochemical Society, (Phoenix, Arizona),
pp. 295-302, October 2000.
[254]A. Van Calster, “Miniaturized
reflective displays (invited),” in Proceedings
of the 7th International Display Workshops (IDW'00), (Kobe, Japan), pp. 179-182,
November 2000.
[255]F. Bruyneel, H. De Smet, A. Van Calster,
and J. Egelhaaf, “Measurement and evaluation of the applicability of
reflective displays for direct applications,” in Proceedings of the 7th International Display Workshops (IDW'00),
(Kobe, Japan), pp. 45-48, November 2000.
[256]P. Moens, M. Tack, H. Van Hove,
M. Vermandel, and D. Bolognesi, “Development of an optimised 40V
pDMOS device by use of a TCAD design of experiment methodology,” in International conference on simulation of Semiconductor
Processes and Device, SISPAD2000, pp. 276-279, 2000.
[257]A. Vervaet, A. Comhaire, and E. Messens, “Prof. dr. arend j. rutgers (1903-1998,” Chemie Magazine, vol. 27, no. 6, pp. 39-44, 2001.
[258]C. Anghel, N. Heyfyene, A. Ionescu,
M. Vermandel, B. Bakeroot, J. Doutreloigne, R. Gillon, S. Frere,
C. Maier, and Y. Mourier, “Physical modelling strategy for (quasi)
saturation effects in lateral dmos transistors based on the concept of
intrinsic drain voltage,” in Proceedings
of the International Semiconductor Conference CAS2001, (Sinaia, Romania), pp. 417-420,
2001.
[259]S. Harris, G. Patra, S. Mainwaring,
G. Schols, D. Mathelin, D. Corlatan, E. Raedschelders, P. De Langhe,
J. De Baets, M. Vereeken, A. Van Calster, M. Morrell,
C. Haley, and A. Ostman, “Standard SMT process for flip-chip assembly
on FR4 substrate,” in Proceedings of the
Electronics Assembly Process exhibition conference (APEX), (San Diego,
USA), pp. 1-13, January 2001.
[260]J. Doutreloigne, H. De Smet, and
A. Van Calster, “A versatile micro-power high-voltage flat panel
display driver,” in Proceedings of the
IEEE International Solid-State Circuits Conference (ISSCC), (San Francisco,
USA), pp. 254-255, February 2001.
[261]B. Bakeroot, P. Moens, M. Vermandel,
and J. Doutreloigne, “Using adaptive resurf technique and field plate
working to improve the safe operating area of n-type drain extended MOS
transistors,” in Proceedings of MSM 2001,
(South Carolina, USA), pp. 498-501, March 2001.
[262]F. Bruyneel, H. De Smet, J. Vanfleteren,
and A. Van Calster, “Method for measuring the cell gap in liquid
crystal displays,” Optical Engineering,
vol. 40, no. 2, pp. 259-267, 2001.
[263]H. De Smet, J. Van den
Steen, and J. Doutreloigne, “Custom display driver design (invited
speech),” in Proceedings of the SID-ME
Spring meeting, (Delft, The Netherlands), pp. -, April 2001.
[264]H. De Pauw, J. Vanfleteren, J. De Baets,
and A. Van Calster, “Novel electroless bumping technologies for MCM-D:
bumping of single chips and straight-wall bumping on cu metallisations,” in Proceedings of the 2001 International
Conference on High-Density Interconnect and Systems Packaging, (Santa Clara,
California), pp. 302-307, April 2001.
[265]A. Van Calster, “Microdisplays: A
cost-effective technology for high-resolution displays (invited),” in Proceedings of the conference on Displays
and Vacuum Electronics, (Garmisch-Partenkirchen, Germany), pp. 115-119,
May 2001.
[266]J. Doutreloigne, H. De Smet, A. Van Calster,
R. Klappert, and J. Grupp, “High-voltage driver for cholesteric LCDs,”
in Proceedings of the conference on
Displays and Vacuum Electronics, (Garmisch-Partenkirchen, Germany), pp. 283-287,
May 2001.
[267]J. Vanfleteren, B. Vandecasteele, T. Podprocky,
and P. Jacobs, “Low temperature flip-chip assembly for biomedical
applications,” in Proceedings of 13th
European Microelectronics and Packaging Conference and Exhibition,
(Strassbourg, France), pp. 213-216, May 2001.
[268]J. De Baets, M. Vereeken, A. Van Calster,
D. Corlatan, E. Roose, A. Van Laere, S. Mainwaring, G. Patra,
S. Harris, M. Morell, C. Haley, G. Schols, A. Ostmann,
and D. Mathelin, “Reliability of a board technology for high-frequency
applications,” in Proceedings of 13th
European Microelectronics and Packaging Conference and Exhibition,
(Strassbourg, France), pp. 271-275, May 2001.
[269]H. De Smet, J. Van den
Steen, and A. Van Calster, “Microdisplays with high pixel counts
(invited),” in Proceedings of the
International Symposium, Seminar and Exhibition (SID), (San Jose, California),
pp. 968-971, June 2001.
[270]F. Bruyneel, H. De Smet, and A. Van Calster,
“Assembly of reflective PDLC microdisplays,” in Proceedings of the International Symposium, Seminar and Exhibition
(SID), (San Jose, California), pp. 442-445, June 2001.
[271]J. Van den Steen, G. Van Doorselaer,
D. Cuypers, H. De Smet, A. Van Calster, F. Chu,
and L. Tseng, “A 0.9 XGA LCoS backplane for projection applications,” in Proceedings of the Microdisplay 2001
conference, (Westminster, Colorado), pp. 87-90, August 2001.
[272]F. Bruyneel, H. De Smet, J. Vanfleteren,
and A. Van Calster, “Cell gap optimization and alignment effects in
reflective PDLC microdisplays,” Liquid
Crystals, vol. 28, no. 8, pp. 1245-1252, 2001.
[273]H. De Smet, J. Van den
Steen, D. Cuypers, N. Carchon, and A. Van Calster, “Monocrystalline
silicon active matrix reflective light valve (invited speech),” in Proceedings of Microdisplay Conference,
(Edinburg), pp. -, September 2001.
[274]F. Bruyneel, W. Hendrix, H. De Smet,
and A. Van Calster, “Fast PDLC using field oriented addressing,” in Proceedings of Asia Display/IDW, (Nagoya,
Japan), pp. 45-48, October 2001.
[275]F. Bruyneel, H. De Smet, A. Van Calster,
and J. Egelhaaf, “Comparison of reflective PNLCDs and reflective
single-polarizer heilmeier guest-host displays,” Journal of the SID, vol. 9, no. 4, pp. 313-318,
2001.
[276]P. Palm, J. Maattanen, Y. De Maquille,
A. Picault, J. Vanfleteren, and B. Vandecasteele, “Reliability
of different flex materials in high density flip chip on flex applications,” in Proceedings of the first International IEEE
Conference on Polymers and Adhesives in Microelectronics and Photonics
(Polytronic), (Potsdam, Germany), pp. 224-229, October 2001.
[277]Z. Illyefalvi-Vitez, R. Berenyi, P. Gordon,
J. Pinkola, M. Ruszinko, and J. Vanfleteren, “Laser via
generation into flexible substrates,” in Proceedings
of the first International IEEE Conference on Polymers and Adhesives in
Microelectronics and Photonics (Polytronic), (Potsdam, Germany), pp. 230-235,
October 2001.
[278]D. Baert and A. Vervaet, “Determination
of the state-of-health of VRLA batteries by means of noise measurements,” in Proceedings of the 23rd International
Telecommunications Energy Conference (INTELEC), (Edinburgh, UK), pp. 301-306,
October 2001.
[279]J. Van den Steen, G. Van Doorselaer,
H. De Smet, and A. Van Calster, “On the design of LCoS
backplanes for large information content displays,” in Proceedings of the 2nd RUG-FTW PhD Symposium, (Gent, Belgium), p. paper
79, December 2001.
[280]F. Bruyneel, H. De Smet, and A. Van Calster,
“Introduction of color in reflective microdisplays,” in Proceedings of the 2nd RUG-FTW PhD Symposium, (Gent, Belgium), p. paper9,
December 2001.
[281]N. Heyfyene, C. Anghel, A. Ionescu,
S. Frere, R. Gillon, M. Vermandel, B. Bakeroot, and J. Doutreloigne,
“An experimental approach for bias-dependent drain series resistances
evaluation in asymmetric HV MOSFETs,” in
Proceedings of the 31th European Solid-State Device Research Conference,
(Nuremberg), pp. 403-406, 2001.
[282]C. Anghel, N. Heyfyene, A. Ionescu,
M. Vermandel, B. Bakeroot, J. Doutreloigne, R. Gillon, S. Frere,
C. Maier, and Y. Mourier, “Investigations and physical modelling of
saturation effects in lateral DMOS transistor architectures based on the
concept of intrinsic drain voltage,” in
Proceedings of the 31th European solid-state Device Research Conference,
(Nuremberg), pp. 399-402, 2001.
[283]J. Doutreloigne, H. De Smet, and
A. Van Calster, “A versatile micropower high-voltage flat-panel
display driver in a 100V 0.7 um CMOS intelligent interface technology,” IEEE Journal of Solid-State Circuits,
vol. 36, no. 12, pp. 2039-2048, 2001.
[284]H. De Smet, J. Van den
Steen, and P. Colson, “Use of stitching in microdisplay fabrication,” in Proc. of SPIE, Vol. 4657: Projection
Displays VIII, (San Jose, USA), pp. 23-30, SPIE, January 2002.
[285]F. Bruyneel, H. De Smet, and A. Van Calster, “Reflective color PDLC displays using color filters,” in Proceedings of SID, Digest of technical papers, vol. XXXIII, number I, (Boston, USA), pp. 534-537, May 2002.
[286]W. De Moerloose, G. Van Doorselaer, and A. Van Calster, “Reducing greyvalue non-uniformities in microdisplays,” in Proceedings of SID, Digest of technical papers, vol. XXXIII, number I, (Boston, USA), pp. 635-637, May 2002.
[287]J. Vanfleteren, B. Vandecasteele, and
T. Podprocky, “Low cost adhesive flip-chip assembly technology using a
combination of ICA and NCA,” in Presented
at GOOD-DIE International Workshop, (Brugge, Belgium), May 2002.
[288]A. Vervaet and D. Baert, “The lead
acid battery: semiconducting properties and peukert's law,” Electrochimica Acta, vol. 47, pp. 3297-3302, 2002.
[289]B. Vandecasteele, T. Podprocky, and
J. Vanfleteren, “High density flip chip with adhesives on ceramics,” in Proceedings of IMAPS-Europe, (Cracow, Poland),
pp. 175-180, June 2002.
[290]J. Vanfleteren, B. Vandecasteele, S. Raevens,
J. Maattanen, and P. Perttula, “Reduced temperature flip-chip
technologies on flexible display substrates using adhesives,” in Proceedings of the 2nd International IEEE Conference
on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC 2002),
(Zalaegerszeg, Hungary), pp. 92-95, June 2002.
[291]J. Vanfleteren, B. Vandecasteele, and
T. Podprocky, “Low cost, wide temperature range adhesive flip-chip
technology using a combination of ICA and NCA,” in Book of Extended Abstracts, IMAPS Flip-Chip Technology Workshop and
Exhibition, (Austin, Texas USA), June 2002.
[292]J. Vanfleteren, B. Vandecasteele, and
T. Podprocky, “A new adhesive flip-chip technology for low temperature and
high density electronic assembly,” in
Presented at 1st POLYSCENE Workshop, (Leuven, Belgium), June 2002.
[293]H. De Smet, D. Cuypers, A. Van Calster,
J. Van den Steen, and G. Van Doorselaer, “Design,
fabrication and evaluation of a high-performance XGA VAN-LCOS microdisplay,” Displays, vol. 23, no. 3, pp. 89-98,
2002.
[294]B. Manirambona, J. De Baets, and A. Vervaet, “Eximer laser microvia technology in mcms,” in Book of abstracts of the European Materials Research Society (MRS), (Strasbourg, France), pp. D-II.27, June 2002.
[295]F. Bruyneel, H. De Smet, and A. Van Calster,
“Reduction of the switching time of polymer dispersed liquid crystal using
field oriented addressing,” IEEE Electron
Device Letters, vol. 23, no. 7, pp. 401-403, 2002.
[296]H. De Pauw, J. De Baets, J. Vanfleteren,
and A. Van Calster, “An O/E measurement probe based on an
optics-extented MCM-D motherboard technology,” in Proceedings of IMAPS, (Denver, Colorado), pp. 936-941,
September 2002.
[297]B. Bakeroot, M. Vermandel, J. Doutreloigne,
P. Moens, and D. Bolognesi, “Cost effective implementation of a 90 v RESURF
p-type drain extended MOS in 0.35 um based smart power technology,” in Proceedings of ESSDERC-ESSCIRC,
(Florence, Italy), pp. 291-294, September 2002.
[298]P. Moens, D. Bolognesi, L. Delobel,
D. Villanueva, K. Reynders, A. Lowe, G. Van Herzeele,
M. Tack, and B. Bakeroot, “Future trends in intelligent interface
technologies for 42 v battery automotive applications,” in Proceedings of ESSDERC-ESSCIRC, (Florence, Italy), pp. 287-290,
September 2002.
[299]G. Van Doorselaer, D. Cuypers, H. De Smet, J. Van den Steen, A. Van Calster, K.-S. Ten, and L.-Y. Tseng, “A XGA VAN-LCoS projector,” in Proceedings of Eurodisplay 2002, (Nice, France), pp. 205-208, October 2002.
[300]D. Cuypers, G. Van Doorselaer,
J. Van den Steen, H. De Smet, and A. Van Calster,
“Assembly of an XGA 0.9" LCoS display using inorganic alignment layers for
VAN LC,” in Proceedings of Eurodisplay
2002, (Nice, France), pp. 551-554, October 2002.
[301]T. Bert, G. Van Steenberge, H. De Smet,
F. Bruyneel, J. Doutreloigne, E. Schroten, and A. Ketelaars,
“Passive matrix addressing of electrophoretic image display,” in Proceedings of Eurodisplay 2002, (Nice,
France), pp. 251-254, October 2002.
[302]D. Cuypers, G. Van Doorselaer,
J. Van den Steen, H. De Smet, and A. Van Calster,
“A projection system using vertically aligned nematic liquid crystal on silicon
panels,” in Proceedings of IDW 2002,
(Hiroshima, Japan), pp. 45-48, December 2002.
[303]W. Hendrix, J. Doutreloigne, and A. Van Calster,
“Programmable and frequency regulated low-power, high-voltage generators for
display drivers,” in Proceedings of IDW
2002, (Hiroshima, Japan), pp. 379-382, December 2002.
[304]J. Vanfleteren, B. Vandecasteele, and
T. Podprocky, “Low temperature flip-chip process using ICA and NCA
(isotropically and non-conductive adhesive) for flexible displays application,”
in Proceedings of 4th Electronics Packaging
Technology Conference (EPTC), (Singapore), pp. 139-143, December 2002.
[305]D. Cuypers, H. De Smet, G. Van Doorselaer,
J. Van den Steen, and A. Van Calster, “Measurement
methodology for vertically aligned nematic reflective displays,” in Proceedings of SPIE, Vol. 5002, (Santa Clara),
pp. 62-72, January 2003.
[306]P. Palm, J. Maattanen, Y. De Maquille,
A. Picault, J. Vanfleteren, and B. Vandecasteele, “Comparison of
different flex materials in high density flip chip on flex applications,” Microelectronics Reliability, vol. 43,
no. 3, pp. 445-451, 2003.
[307]T. Bert and H. De Smet, “The
microscopic physics of electronic paper revealed,” Displays, vol. 24, no. 3, pp. 103-110, 2003.
[308]D. Baert and A. Vervaet, “Small
bandwith measurement of the noise voltage of batteries,” Journal of Power Sources, vol. 114, no. 2, pp. 357-365,
2003.
[309]B. Manirambona, J. De Baets, and A. Vervaet, “Excimer laser microvia technology in multichip modules,” Applied Surface Science, pp. 171-176, 2003.
[310]J. Doutreloigne, H. De Smet, W. Hendrix,
M. Vermandel, and A. Van Calster, “Low-power high-voltage
drivers for reflective bistable LCDs,” in
Proceedings of SID-ME Chapter Meeting, (Neuchatel, Switzerland), pp. -,
March 2003.
[311]S. Siau, L. Degrendele, J. De Baets,
and A. Van Calster, “Electroless Ni/Au plating as a solderable finish
on top of sequential buildup layers: overplating reliability considerations for
the solder mask,” in Proceedings of the
26 th International Spring Seminar on Electronics Technology, (Stara Lesna,
Slovakia), pp. 158-162, May 2003.
[312]T. Podprocky, B. Vandecasteele, J. De Baets,
A. Van Calster, and J. Bansky, “Integration of thick film
resistors in a multilayer structure,” in Proceedings
of the 26 th International Spring Seminar on Electronics Technology, (Stara
Lesna, Slovakia), pp. 137-140, May 2003.
[313]B. Vandecasteele, J. Vanfleteren, J. Maattanen,
and T. Laitinen, “Results of a high density flip chip on flex reliability
test program,” in Proceedings of the 26
th International Spring Seminar on Electronics Technology, (Stara Lesna,
Slovakia), pp. 1-6, May 2003.
[314]J. Doutreloigne, M. Vermandel, H. De Smet,
and A. Van Calster, “A micro-power 100V cholesteric texture LCD
driver,” in Proceedings of SID International
Symposium, Digest of technical papers, Volume XXXIV, book I, (Baltimore, USA),
pp. 328-331, May 2003.
[315]W. Hendrix, J. Doutreloigne, M. Vermandel,
and A. Van Calster, “Design of an integrated low-power high-voltage
driver,” in Proceedings of SID International
Symposium, Digest of technical papers, Volume XXXIV, book I, (Baltimore, USA),
pp. 320-323, May 2003.
[316]B. Vandecasteele, T. Podprocky, J. Vanfleteren,
and J. Maattanen, “Low temperature flip chip with adhesives on PES,” in Proceedings of the 14th European
Microelectronics and Packaging Conference and Exhibition, (Friedrichshafen,
Germany), pp. 319-324, June 2003.
[317]T. Podprocky, B. Vandecasteele, J. De Baets,
and A. Van Calster, “Thick film inductors for RF applications,” in Proceedings of the 14th European Microelectronics
and Packaging Conference and Exhibition, (Friedrichshafen, Germany), pp. 138-142,
June 2003.
[318]H. De Pauw, J. De Baets, J. Vanfleteren,
and A. Van Calster, “Integrated optics in a standard MCM-D
motherboard technology demonstrated in O/E measurement probes,” in Proceedings of International Electronic Packaging
Technical Conference and Exhibition, (Maui,Hawaii, USA), p. 35192, July
2003.
[319]H. De Smet, J. Van den
Steen, G. Van Doorselaer, D. Cuypers, N. Carchon, and A. Van Calster,
“On the development of VAN LCOS microdisplays (invited),” in Proceedings of the IEEE LEOS Annual
Meeting Conference, (Tucson, Arizona), pp. 814-815, October 2003.
[320]S. Siau, A. Vervaet, A. Van Calster,
Y. Swennen, and E. Schacht, “Influence of wet chemical treatments on
the evolution of epoxy polymer layer surface roughness for usage as build-up
layer,” in Abstracts of the 7th International
Conference on Atomically Controlled Surfaces, Interfaces and Nanostructures,
(Nara, Japan), p. 496, November 2003.
[321]H. De Smet, J. Van den
Steen, and D. Cuypers, “Spice model for a dynamic liquid crystal pixel
capacitance,” in Proceedings of the 10th international
Display Workshops (IDW), (Fukuoka,Japan), pp. 53-56, December 2003.
[322]D. Cuypers, J. Van den Steen, G. Van Doorselaer,
H. De Smet, and A. Van Calster, “WXGA LCOS projection panel
with vertically aligned nematic LC,” in
Proceedings of the 10th international Display Workshops (IDW),
(Fukuoka,Japan), pp. 1541-1544, December 2003.
[323]T. Bert and H. De Smet, “A new
insight in electronic paper: EPID or DEPID,” in Proceedings of the 10th international Display Workshops (IDW),
(Fukuoka,Japan), pp. 1621-1624, December 2003.
[324]S. Siau, A. Vervaet, Schacht, and A. Van Calster,
“Influence of chemical pretreatment of epoxy polymers on the adhesion strength
of electrochemically deposited Cu for use in electronic interconnections,” Journal of the Electrochemical Society,
vol. 151, no. 2, pp. 133-141, 2004.
[325]T. Bert and H. De Smet, “Dielectrophoresis
in electronic paper,” Displays, vol. 24,
no. 4, pp. 223-230, 2004.
[326]B. Vandecasteele, J. Maattanen, T. Podprocky,
and J. Vanfleteren, “Low temperature flip chip attachment for flexible
display applications,” in Proceedings of
the International Conference on Electronics Packaging, (Tokyo, Japan), pp. 307-312,
April 2004.
[327]J. Maatanen, B. Vandecasteele, J. Vanfleteren,
and Y. de Maquille, “Tiheiden joustaville alustoille tehtyjen
kääntösiruliitosten testausohjelma ja tulokset, reliability results of high
density flip chip on flex assemblies,” in
Proceedings of Elektroniikan Valmistus 2004; Elektroniikan tuotanto-ja
pakkaustekniikan konferenssii, (Pori, Finland), pp. 89-93, May 2004.
[328]W. Hendrix, J. Doutreloigne, and A. Van Calster,
“Integrated low-power high-voltage driver for bistable nematic displays,” in Proceedings of the Society for Information
Display 2004, Digest of technical papers, Volume XXXV, Book I,
(Seattle,Washington), pp. 376-379, May 2004.
[329]H. De Smet, J. Van den
Steen, and D. Cuypers, “Electrical model of a liquid crystal pixel with
dynamic, voltage history-dependent capacitance value,” Liquid Crystals, vol. 31, no. 5, pp. 705-711, 2004.
[330]S. Siau, A. Vervaet, A. Van Calster,
and E. Schacht, “Influence of build-up epoxy layer surface roughness on
the adhesion strength of electrochemically deposited copper,” in Meeting abstracts of the 205th Meeting of
The Electrochemical Society, (San Antonio, Texas), p. 207, May 2004.
[331]S. Siau, A. Vervaet, A. Van Calster,
I. Swennen, and E. Schacht, “Epoxy polymer surface roughness modeling
based on kinetic studies of wet chemical treatments,” Journal of the Electrochemical Society, vol. 151, no. 8,
pp. 54-61, 2004.
[332]J. Doutreloigne and W. Hendrix, “Integrated
high-voltage generators for low-power bistable LCD drivers,” in Proceedings of the 24th International
Display Research conference (IDRC Asia Display 2004 and the 4th International
Meeting on Information Display (IMID 2004), (Daegu, Korea), pp. 135-138,
August 2004.
[333]S. Siau, A. Vervaet, A. Van Calster,
I. Swennen, and E. Schacht, “Influence of wet chemical treatments on
the evolution of epoxy polymer layer surface roughness for use as a build-up
layer,” Applied Surface Science, vol. 237,
no. 1, pp. 457-462, 2004.
[334]B. Bakeroot, J. Doutreloigne, and P. Moens,
“A new substrate current free nLIGBT for junction isolated technologies,” in Proceedings of the 34th European
Solid-State Device Research Conference, (Leuven, Belgium), pp. 461-464,
September 2004.
[335]T. Bert, F. Beunis, H. De Smet,
and K. Neyts, “Transient current properties in electronic paper,” in Proceedings of the SID-ME 2004 10th
Anniversary Meeting, (Stuttgart, Germany), October 2004.
[336]T. Bert and H. De Smet, “How total internal reflection can make electronic paper better,” in Proceedings of Americas Display Engineering and Applications Conference (ADEAC 2004), (Ft. Worth, Texas, USA), pp. 84-86, October 2004.
[337]H. De Pauw, N. Carchon, J. De Baets,
and A. Van Calster, “Redistribution on wafer: an alternative,
cost-efficient approach,” in Proceedings
of the 37th International Symposium on Microelectronics, (Long Beach,
California, USA), November 2004.
[338]T. Bert and H. De Smet, “Current
transport mechanisms in electronic paper,” in Proceedings of the 5th Doctoraatssymposium, (UGent, Belgium), p. 28,
December 2004.
[339]S. Siau, A. Vervaet, S. Nalines,
E. Schacht, and A. Van Calster, “Kinetic study of wet chemical
treatments on the surface roughness of epoxy polymer layers for build-up
layers. part 1: sweller influence,”
Journal of the Electrochemical Society, vol. 151, no. 12, pp. 816-830,
2004.
[340]S. Siau, A. Vervaet, S. Nalines,
E. Schacht, and A. Van Calster, “Kinetic study of wet chemical
treatments on the surface roughness of epoxy polymer layers for build-up
layers. part 2: oxidative treatment of the surface,” Journal of the Electrochemical Society, vol. 151, no. 12,
pp. 831-849, 2004.
[341]J. Doutreloigne, “A monolithic low-power
high-voltage driver for bistable LCDs,” in
Proceedings of the 16th International Conference on Microelectronics (ICM),
(Tunis, Tunesia), pp. 425-428, December 2004.
[342]T. Bert, F. Beunis, H. De Smet,
and K. Neyts, “Transient current properties in electronic paper,” in Proceedings of 11th Internation Display
Workshops (IDW), (Niigata, Japan), pp. 1749-1752, December 2004.
[343]W. Hendrix, J. Doutreloigne, and A. Van Calster,
“A fully integrated low-power high-voltage bistable display driver for
smartcard applications,” in Proceedings
of 11th Internation Display Workshops (IDW), (Niigata, Japan), pp. 1733-1736,
December 2004.
[344]A. Monte, J. Doutreloigne, and A. Van Calster,
“An intelligent driving scheme for high-voltage display drivers,” in Proceedings of 11th Internation Display
Workshops (IDW), (Niigata, Japan), pp. 1737-1740, December 2004.
[345]D. Cuypers, H. De Smet, and A. Van Calster,
“Fringe-field induced disclinations in van lcos panels,” in Proceedings of 11th Internation Display Workshops (IDW), (Niigata,
Japan), pp. 1679-1682, December 2004.
[346]S. Siau, A. Vervaet, S. Degrande,
E. Schacht, and A. Van Calster, “Dip coating of dielectric and
solder mask epoxy polymers layers for buid-up purposes,” Applied Surface Science, vol. 245, no. 1, pp. 353-368,
2004.
[347]S. Siau, J. De Baets, A. Van Calster,
L. Heremans, and S. Tanghe, “Processing quality results for
electroless/electroplating of high-aspect ratio plated through holes in
industrially produced printed circuit boards,” Microelectronics Reliability, vol. 45, no. 3, pp. 675-687,
2005.
[348]H. Murat, H. De Smet, D. Cuypers,
Y. Meuret, H. Thienpont, M. Vervaeke, and L. Desmet, “Increased
lumens per etendue by combining pulsed LEDs,” in Proceedings of SPIE, Projection Displays XI, Vol. 5740, (San
Jose), pp. 1-12, January 2005.
[349]B. Bakeroot, J. Doutreloigne, and P. Moens,
“A new LIGBT structure to suppress substrate currents in a junction isolated
technology,” Solid-State Electronics,
vol. 49, no. 3, pp. 363-367, 2005.
[350]H. Murat, H. De Smet, and D. Cuypers,
“Time sharing of pulsed LEDs increases lumen output within the same etendue,”
in Proceedings of joint SID meeting (SID-ME/Le
Club Visu) on CD-rom, (Ghent), March 2005.
[351]T. Bert and H. De Smet, “Hexagonal
patterns in electronic paper,” in Proceedings
of joint SID meeting (SID-ME/Le Club Visu) on CD-rom, (Ghent), March 2005.
[352]J. Vanfleteren, “Presentation of FP6
integrated project FLEXIDIS,” in
Proceedings of joint SID meeting (SID-ME/Le Club Visu) on CD-rom, (Ghent),
March 2005.
[353]H. De Smet, “Presentation of FP5-IST
project LCOS4LCOS,” in Proceedings of
joint SID meeting (SID-ME/Le Club Visu) on CD-rom, (Ghent), March 2005.
[354]J. Doutreloigne, M. Vermandel, H. De Smet,
and A. Van Calster, “A multifunctional high-voltage driver chip for
low-power mobile display systems,” in
Proceedings of the 2005 IEEE International Symposium on Circuits and Systems
(ISCAS 2005), (Kobe, Japan), pp. 1855-1858, May 2005.
[355]D. Cuypers, H. De Smet, and A. Van Calster,
“Fringe field effects in microdisplays,” in
Proceedings of the Society for Information Display 2005, (Boston,
Massachusetts, USA), pp. 1298-1301, May 2005.
[356]T. Bert and H. De Smet, “Pattern
formation in electronic paper,” in Proceedings
of the Society for Information Display 2005, (Boston, Massachusetts, USA),
pp. 765-767, May 2005.
[357]S. Siau, A. Vervaet, L. Van Vaeck,
E. Schacht, U. Demeter, and A. Van Calster, “Adhesion
strength of the epoxy polymer/copper interface for use in microelectronics,” Journal of the Electrochemical Society,
vol. 152, no. 6, pp. c442-c455, 2005.
[358]S. Siau, A. Vervaet, S. Degrande,
E. Schacht, and A. Van Calster, “Dip coating of dielectric and
solder mask epoxy polymer layers for build-up purposes,” Applied Surface Science, vol. 245, no. 1.
[359]S. Siau, A. Vervaet, E. Schacht,
S. Degrande, K. Callewaert, and A. Van Calster, “Chemical
modification of buildup epoxy surfaces for altering the adhesion of
electrochemically deposited copper,”
Journal of the Electrochemical Society, vol. 152, no. 9, pp. d136-d150,
2005.
[360]S. Siau, A. Vervaet, E. Schacht,
and A. Van Calster, “Interface evolution of epoxy layers due to
wet-chemical treatments and its relevance to adhesion of eltrochemically
deposited copper,” in Meeting abstracts
of the 207th meeting of The Electrochemical Society, (Ville de Quebec,
Canada), p. 348, May 2005.
[361]S. Siau, A. Vervaet, A. Van Calster,
E. Schacht, and E. Demeter, “Epoxy polymer surface modification
through wet-chemical organic surface synthesis for adhesion improvement in
microelectronics,” in Meeting abstracts
of E-MRS 2005 Spring meeting, (Strassbourg), pp. e37-e38, June 2005.
[362]S. Siau, A. Vervaet, A. Van Calster,
and D. Baert, “The development of epoxy polymer surface roughness due to
wet chemical treatments and its relevance to adhesion of elctrochemically
deposited copper (invited),” in Proceedings
of the fifth International Symposium on Polymer Surface Modification
(relevanced to adhesion), (Toronto, Canada), p. 22, June 2005.
[363]T. Bert, J. Vanfleteren, B. Vandecasteele,
S. Maeyaert, J. Doutreloigne, J. Govaerts, H. De Smet,
and A. Van Calster, “Advanced technologies in fabrication and
interconnection of flexible displays and substrates,” in Proceedings of flexible displays and electronics (FDE) 2005, (San Francisco),
pp. 1-14, June 2005.
[364]A. Ostmann, J. De Baets, A. Kriechbaum,
H. Kostner, and A. Neumann, “Technology for embedding active dies,”
in Proceedings of the 15th European
Microelectronics and Packaging Conference and Exhibition, (Brugge, Belgium),
pp. 101-106, June 2005.
[365]J. Vanfleteren, “FP5-CSG-IMECAT:
Introduction and highlights of an EC funded project on lead-free materials and
assembly development technologies,” in
Proceedings of the 15th European Microelectronics and Packaging Conference and
Exhibition, (Brugge, Belgium), pp. 419-422, June 2005.
[366]B. Vandecasteele, J. Vanfleteren, D. Manessis,
A. Ostmann, H.-W. Hagedorn, and J. Wiese, “Lead-free flip chip: a
comparison between lead-free solder and adhesives,” in Proceedings of the 15th European Microelectronics and Packaging
Conference and Exhibition, (Brugge, Belgium), pp. 434-439, June 2005.
[367]M. Gonzalez, B. Vandevelde, J. Vanfleteren,
and D. Manessis, “Thermo-mechanical FEM analysis of lead free an lead
containing solder for flip chip applications,” in Proceedings of the 15th European Microelectronics and Packaging
Conference and Exhibition, (Brugge, Belgium), pp. 440-445, June 2005.
[368]N. Hendrickx, G. Van Steenberge,
P. Geerinck, H. Ottevaere, H. Thienpont, and P. Van Daele,
“Multilayer optical interconnections integrated on a printed circuit board,” in Proceedings of the 15th European
Microelectronics and Packaging Conference and Exhibition, (Brugge,
Belgium), pp. 329-333, June 2005.
[369]G. Van Steenberge, P. Geerinck,
S. Van Put, N. Hendrickx, H. Ottevaere, H. Thienpont,
and P. Van Daele, “45° out-of-plane deflecting mirrors for optical
printed circuit boards,” in Proceedings
of the 15th European Microelectronics and Packaging Conference and Exhibition,
(Brugge, Belgium), pp. 557-560, June 2005.
[370]F. Beunis, F. Strubbe, K. Neyts,
T. Bert, H. De Smet, A. Verschueren, and L. Schlangen,
“Electric field compensation in electrophoretic ink displays,” in Proceedings of the 25th International
Display Research Conference, (Edinburgh, Scotland), pp. 344-345,
September 2005.
[371]T. Bert and H. De Smet, “How to
introduce a treshold in EPIDs,” in Proceedings
of the 25th International Display Research Conference, (Edinburgh,
Scotland), pp. 337-339, September 2005.
[372]S. Lam, H. De Smet, F. Verdicchio,
and A. Munteanu, “Wavelet based moving picture coding multiple line
addressing for passive matrix displays,” in
Proceedings of the 25th International Display Research Conference, (Edinburgh,
Scotland), pp. 309-311, September 2005.
[373]H. De Smet, D. Cuypers, F.-A.
Fernandez, and S.-E. Day, “Inter-grey-level response times of a liquid crystal
display,” in Proceedings of the 25th International
Display Research Conference, (Edinburgh, Scotland), pp. 294-297,
September 2005.
[374]A. Monte, J. Doutreloigne, and A. Van Calster,
“Principles to reduce the power consumption in high-voltage bistable display
drivers,” in Proceedings of the 25th
International Display Research Conference, (Edinburgh, Scotland), pp. 148-151,
September 2005.
[375]A. Monte, J. Doutreloigne, and A. Van Calster,
“A power-efficient way** to operate high-voltage bistable display drivers,” in Proceedings of the 12th International
Display Workshops in conjunction with Asia Display 2005 (IDW/AD’05),
(Takamatsu, Japan), pp. 887-890, December 2005.
[376]S. Maeyaert, J. Doutreloigne, and A. Van Calster,
“Pixel-based optical feedback to correct ageing and non-uniformities in
large-area displays,” in Proceedings of
the 12th International Display Workshops in conjunction with Asia Display 2005
(IDW/AD’05), (Takamatsu, Japan), pp. 1939-1942, December 2005.
[377]D. Cuypers, A. Van Calster, and
H. De Smet, “Vcom drift phenomena in VAN LCOS panels,” in Proceedings of the 12th International
Display Workshops in conjunction with Asia Display 2005 (IDW/AD’05),
(Takamatsu, Japan), pp. 1931-1934, December 2005.
[378]V. De Gezelle, J. Doutreloigne,
and A. Van Calster, “A high-voltage 765 mW switching ADSL line
driver,” in Proceedings of the 17th
International Conference on Micro Electronics (ICM'05), (Islamabad,
Pakistan), pp. 213-217, December 2005.
[379]S. Siau, A. Vervaet, E. Schacht,
U. Demeter, and A. Van Calster, “Epoxy polymer surface modification
through wet-chemical organic surface synthesis for adhesion improvement in
microelectronics,” Thin Solid Films, vol. 495,
pp. 348-356, 2006.
[380]A. Vervaet, S. Siau, J. De Baets,
and B. Manirambona, “Optimization of microvia-technology using eximer
laser for build-up layer application in microelectronics,” Applied Surface Science, vol. 252, pp. 8243-8250, 2006.
[381]S. Siau, A. Vervaet, L. Degrendele,
J. De Baets, and A. Van Calster, “Qualitative electroless
ni/au plating considerations for the solder mask on top of sequential build-up
layers,” Applied Surface Science,
vol. 252, pp. 2717-2740, 2006.
[382]T. Bert, H. De Smet, F. Beunis,
and K. Neyts, “Steady state current in EPIDs,” Displays, vol. 27, no. 1, pp. 35-38, 2006.
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crystal on silicon panels and light emitting diodes,” in Proceedings of SPIE, Vol. 7001, (Strasbourg, France), p. 700103,
April 2008.
[476]E. Bosman, G. Van Steenberge, N. Hendrickx,
W. Christiaens, J. Vanfleteren, and P. Van Daele, “Flexible
embedded active optical link,” in
Proceedings of SPIE, Vol. 6992, (Strasbourg, France), pp. 69920V1-69920V10,
April 2008.
[477]E. Bosman, G. Van Steenberge, W. Christiaens,
N. Hendrickx, and P. Vanfleteren, J an Van Daele, “Active
optical links embedded in flexible substrates,” in Proceedings IEEE-IECTC, (Orlando, Florida, USA), pp. 1150-1157,
May 2008.
[478]D. Cuypers, H. De Smet, and A. Van Calster,
“Electronic compensation for fringe-field effects in VAN LCOS microdisplays,”
in Proceedings of the SID 2008
International Symposium Digest of Technical Papers (Volume 39), (Los
Angeles, USA), pp. 228-231, May 2008.
[479]B. Kuyken, W. Verstichel, F. Bossuyt,
J. Vanfleteren, M. Demey, and M. Leman, “The HOP senor: wireless
motion sensor,” in Proceedings of the 8th
International Conference on new interfaces for musical expression (NIME), (Genova,
Italy), June 2008.
[480]M. Demey, M. Leman, L. De Bruyn,
F. Bossuyt, and J. Vanfleteren, “The musical synchrotron: using
wireless motion sensors to study how social interaction affects synchronization
with musical tempo,” in Proceedings of
the 8th International Conference on new interfaces for musical expression (NIME),
(Genova, Italy), June 2008.
[481]M. Gonzalez, F. Axisa, M. Vanden Bulcke,
D. Brosteaux, B. Vandevelde, and J. Vanfleteren, “Design of metal
interconnects for stretchable electronic circuits,” Microelectronics Reliability, vol. 48, no. 6, pp. 825-832,
2008.
[482]J. Buyle, V. De Gezelle, B. Bakeroot,
and J. Doutreloigne, “A high-voltage switching ADSL line-driver, with an
n-type output stage,” in Proceedings of
the 12th WSEAS International Conference on CIRCUITS, (Heraklion, Greece),
pp. 60-64, July 2008.
[483]J. Govaerts, W. Christiaens, E. Bosman,
and J. Vanfleteren, “Multiple chip integration for flat flexible
electronics,” in Proceedings of the 7th IEEE
Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic
2008), (Garmisch-Partenkirchen, Germany), pp. -, August 2008.
[484]J. Buyle, V. De Gezelle, B. Bakeroot,
and J. Doutreloigne, “A new type of level-shifter for n-type high side
switches used in high-voltage switching ADSL line-drivers,” in Proceedings of the 15th IEEE International Conference
on Electronics, Circuits and Systems, (St Julians, Malta), pp. 954-957,
August 2008.
[485]V. De Gezelle, J. Buyle, and J. Doutreloigne,
“Distortion calculation of an asynchronous switching x DSL line-driver,” in Proceedings of the 2nd IEEE
International Interdisciplinary Conference on Portable Information Devices
(Portable) and the 7th IEEE Conference on Polymers and Adhesives in Microelectronics
and Photonics (Polytronic), (Garmisch-Partenkirchen, Germany), pp. 2386-2389,
August 2008.
[486]F. Axisa, F. Bossuyt, J. Missinne,
R. Verplancke, T. Vervust, and J. Vanfleteren, “Stretchable
engineering technologies for the development of advanced stretchable polymeric
system,” in Proceedings of the 7th International
IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
(Polytronic), (Garmisch-Partenkirchen, Germany), pp. -, August 2008.
[487]N. De Geyter, R. Morent, F. Axisa,
N. De Smet, L. Gengembre, E. De Leersnyder, C. Leys,
J. Vanfleteren, M. Rymarczyk-Marchal, E. Schacht, and E. Payen,
“Medium and atmospheric pressure plasma treatment for improvement of adhesion
of PDMS used for flexible and stretchable electronics,” in Proceedings of the 7th International IEEE Conference on Polymers
and Adhesives in Microelectronics and Photonics (Polytronic), (Garmisch-Partenkirchen,
Germany), pp. -, August 2008.
[488]J. van den Brand, J. De Baets,
T. van Mol, and A. Dietzel, “Systems-in-foil- devices, fabrication
processes and reliability issues,” Microelectronics
Reliability, vol. 48, pp. 1123-1128, 2008.
[489]J. Govaerts and J. Vanfleteren, “Assembly
of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible
displays,” in Proceedings of the 2nd
Electronics System Integration Technology Conference (ESTC 2008),
(Greenwich, UK), pp. 309-313, September 2008.
[490]F. Axisa, F. Bossuyt, T. Vervust,
and J. Vanfleteren, “Laser based fast prototyping methodology of producing
stretchable and conformable electronic systems,” in Proceedings of the 2nd Electronics System Integration Technology
Conference (ESTC 2008), (Greenwich, UK), pp. 1387-1390, September
2008.
[491]M. Gonzalez, F. Axisa, F. Bossuyt,
Y. Hsu, B. Vandevelde, and J. Vanfleteren, “Design and
performance of metal conductors for stretchable electronic circuits,” in Proceedings of the 2nd Electronics System
Integration Technology Conference (ESTC 2008), (Greenwich, UK), pp. 371-376,
September 2008.
[492]W. Christiaens, T. Torfs, W. Huwel,
and J. Vanfleteren, “Functionality and reliability testing of bendable
ultrathin chip packages (UTCP's) (abstract),” in Proceedings of the IMAPS Nordic Annual Conference, (Helsingor,
Denmark), p. 230, September 2008.
[493]R. Carta, B. Jourand, J. Hermans,
D. Thone, F. Brosteaux, F. Axisa, J. Vanfleteren, and B. Puers,
“Design and implementation of advanced systems on flexible-stretchable
technology towards embedding textile,” in
Proceedings of the 22nd International Conference EUROSENSORS, (Dresden, Germany),
pp. -, September 2008.
[494]S. Maeyaert, B. Bakeroot, J. Doutreloigne,
A. Monte, P. Bauwens, and A. Van Calster, “Integrated
driver with optical compensation for improved uniformity of emissive displays,”
in Proceedings of the 8th International
Meeting of Information Display (IMID), International Display Manufacturing
Conference (IDMC) and Asia Display, (Ilsan-Seoul, Korea), pp. 692-695,
October 2008.
[495]L. Bogaert, Y. Meuret, B. Van Giel,
H. Murat, H. De Smet, and H. Thienpont, “Projection display
for the generation of two orthogonal polarized images using liquid on silicon
panels and light emitting diodes,”
Applied Optics, Optical Society of America, vol. 47, no. 10, pp. 1535-1542,
2008.
[496]A. Monte, P. Bauwens, S. Maeyaert,
and J. Doutreloigne, “New driving scheme for intelligent power-efficient
high-voltage display drivers,” Journal of
the SID, vol. 16, no. 11, pp. 1171-1180, 2008.
[497]D. Cuypers, H. De Smet, and A. Van Calster,
“Analysis of fringe-field effects in VA microdisplays for image quality
improvement,” in Proceedings of the 15th
International Display Workshops (IDW 08), (Niigata, Japan), pp. 191-194,
December 2008.
[498]C. Van Hoff, H. Neves, A. Aarts,
F. Iker, P. Soussan, M. Gonzalez, E. Beyne, J. Vanfleteren,
R. Puers, and P. De Moor, “Design and integration technology for
miniature medical microsystems,” in IEEE
International Electron Devices meeting 2008, Technical Digest, (San Francisco,
USA), pp. 319-322, December 2008.
[499]J. Govaerts, B. Vandecasteele, and J. Vanfleteren,
“Interconnecting drivers to flexible displays,” Journal of the Society for Information Display, vol. 16, pp. 765-775,
2008.
[500]B. Van Giel, Y. Meuret, L. Bogaert,
H. Murat, H. De Smet, and H. Thienpont, “LED projector with
two liquid crystal on silicon light valves and a fly's eye integrator,” Displays, vol. 29, pp. 464-470,
2008.
[501]B. Huyghe, H. Rogier, J. Vanfleteren,
and F. Axisa, “Design and manufacturing of stretchable hig frequency
interconnects,” IEEE Transaction on Advanced
Packaging, vol. 31, no. 4, pp. 802-808, 2008.
[502]R. Carta, P. Jourand, B. Hermans,
J. Thone, D. Brosteaux, F. Axisa, J. Vanfleteren, and R. Puers,
“Design and implementation of advanced systems on flexible-stretchable
technology for biomedical application,”
Sensors and Actuators A: Physical (submitted).
[503]J. Missinne, G. Van Steenberge,
B. Van Hoe, K. Van Coillie, T. Van Gijseghem, P. Dubruel,
J. Vanfleteren, and P. Van Daele, “An array waveguide sensor for
artificial optical skins,” in Proceedings
of SPIE, vol. 7221: Photonics Packaging, Integration, and Interconnects IX,
(San Antonio, USA), pp. 722105-1-722105-9, January 2009.
[504]J. Van Erps, N. Hendrickx, M. Vervaeke,
C. Debaes, G. Van Steenberge, and P. Van Daele, “MT-compatible
interface between peripheral fiber ribbons and printed circuit board-integrated
optical waveguides,” in Proceedings of SPIE,
vol. 7221: Photonics Packaging, Integration, and Interconnects IX, (San
Antonio, USA), pp. 72210C-1-72210C-10, January 2009.
[505]J. Govaerts, W. Christiaens, E. Bosman,
and J. Vanfleteren, “Fabrication processes for embedding thin chips in
flat flexible substrates,” IEEE Transactions
on Advanced Packaging, vol. 32, no. 1, pp. 77-83, 2009.
[506]M. Gonzalez, F. Axisa, F. Bossuyt,
Y. Hsu, B. Vandevelde, and J. Vanfleteren, “Design and
performance of metal conductors for stretchable electronic circuits,” Circuit world, vol. 35, no. 1,
pp. 22-29, 2009.
[507]P. Bauwens, A. Monte, W. Christiaens,
J. Doutreloigne, and Vanfleteren, “Improved passive-matrix
multiplexability with a modular display and utcp technology,” Displays, vol. 30, pp. 71-76,
2009.
[508]B. Huyghe, J. Doutreloigne, and J. Vanfleteren,
“3D orientation tracking based on unscented kalman filtering of accelerometer
and magnetometer data,” in IEEE
Sensors, Applications Symposium (SAS 2009), (New Orleans, USA), pp. 148-152,
February 2009.
[509]A. Monte, J. Doutreloigne, and A. Van Calster,
“Driving-scheme algorithms for intelligent energy-efficient high-voltage
display drivers,” IEEE transactions on
circuits and systems-I: Regular papers, vol. 56, no. 2, pp. 497-507,
2009.
[510]J. Vanfleteren, “Flexible and stretchable
circuits for wearable electronic systems,”
SMT News, vol. 2, no. 09, pp. 24-26, 2009.
[511]T. Torfs, W. Christiaens, J. Vanfleteren,
W. Huwel, W. Perdu, Y. R.F., S. Brebels, and C. Van Hoof,
“Flexible wireless biopotential system with embedded ultra-thin chip,” in Proceedings of Smart Systems Integration Conference
2009, (Brussels, Belgium), pp. 536-539, March 2009.
[512]P. Dagur, R. Verplancke, J. Missinne,
F. Axisa, and J. Vanfleteren, “Porous silicones using water/silicone
emulsions,” in Proceedings of the 1st International
Conference on Multifunctional, Hybrid and Nanomaterials, (Tours, France),
pp. -, March 2009.
[513]W. Christiaens, T. Torfs, W. Huwel,
C. Van Hoof, and J. Vanfleteren, “3D integrated, ultra-thin
functional microcontroller for wireless, flexible ECG systems,” in Proceedings of the International
Semiconductor Technology Conference and China Semiconductor Technology
International Conference (ISTC/CSTIC 2009), (Shanghai, China), pp. -,
March 2009.
[514]B. Van Hoe, K. Van Coillie, G. Van Steenberge, J. Vanfleteren, and P. Van Daele, “Nieuwe benadering voor druksensoren: flexibele artificiële optische huid,” in KVIV Ingenieursprijzen, (Brussels, Belgium), pp. -, March 2009.
[515]J. Vanfleteren, “Technology and
applications of flexible and elastic electronics and sensor circuits (invited),”
in Proceedings of MRS Spring meeting,
Symposium PP, (San Francisco, USA), pp. -, April 2009.
[516]Y. Hsu, M. Gonzalez, F. Bossuyt,
F. Axisa, J. Vanfleteren, and I. De Wolf, “A novel
interconnect design with high stretchability and fine pitch capability for
applications in stretchable electronics,” in
Proceedings of MRS Spring meeting, Symposium PP, (San Francisco, USA), pp. -,
April 2009.
[517]H. Depauw, V. De Gezelle, J. Doutreloigne,
E. Op de Beeck, R. Van Bolderik, and J. Content, “Active-tunable
inductor effected by a novel impedance synthesis circuit,” in Proceedings of the 8th WSEAS
International Conference on Instrumentation, Measurement, Circuits and Systems,
(Hangzhou, China), pp. 95-100, May 2009.
[518]J. Doutreloigne, J. Buyle, and V. De Gezelle,
“A multi-level switching amplifier with improved power efficiency for analog
signals with high crest factor,” in
Proceedings of 8th WSEAS International Conference on Microelectronics,
Nanoelectronics and Optoelectronics (MINO 09), (Istanbul, Turkey), pp. 47-52,
May-June 2009.
[519]J. Doutreloigne, “Reduction of peak input
currents during charge pump boosting in integrated high-voltage generators,” in Proceedings of 8th WSEAS International
Conference on Microelectronics, Nanoelectronics and Optoelectronics (MINO 09),
(Istanbul, Turkey), pp. 53-58, May-June 2009.
[520]J. Govaerts, W. Christiaens, and J. Vanfleteren,
“Ultra-thin chip packaging (UTCP): a promising technology for future flexible
display interconnection,” in Proceedings
of SID 09 Digest, (San Antonio, USA), pp. 202-205, May-June 2009.
[521]A. Van Calster, D. Cuypers, and
H. De Smet, “LCOS devices for professional projection displays,” in Proceedings of SID 09 Digest, (San
Antonio, USA), pp. 70-72, May-June 2009.
[522]R. Verplancke and J. Vanfleteren, “Stretchable
microelectrode arrays as a cell culture platform,” in Proceedings of the 2009 Symposium on Microeletrode Arrays in Tissue
Engineering (MEATE 2009), (Tampere, Finland), pp. 20-22, June 2009.
[523]W. Christiaens, T. Torfs, W. Huwel,
C. Van Hoof, and J. Vanfleteren, “3d integration of ultra-thin
functional devices inside standard multilayer flex laminates,” in Proceedings of the European
Microelectronics and Packaging Conference (EMPC 2009), (Rimini, Italy), pp. -,
June 2009.
[524]F. Bossuyt, T. Vervust, F. Axisa,
and J. Vanfleteren, “A new low cost, elastic and conformable eletronics
technology for soft and stretchable electronic devices by use of a stretchable
substrate,” in Proceedings of the European
Microelectronics and Packaging Conference (EMPC 2009), (Rimini, Italy), pp. -,
June 2009.
[525]E. Bosman, G. Van Steenberge, P. Geerinck,
J. Vanfleteren, and P. Van Daele, “Fully embedded optical and
electrical interconnections in flexible foils,” in Proceedings of the European Microelectronics and Packaging Conference (EMPC
2009), (Rimini, Italy), pp. -, June 2009.
[526]J. Govaerts, E. Bosman, W. Christiaens,
and J. Vanfleteren, “Fine-pitch capabilities of the flat ultra-thin chip
packaging (UTCP) technology (accepted),”
IEEE transactions on advanced packaging, pp. ?-?, 2009.
[527]W. Christiaens, E. Bosman, and J. Vanfleteren,
“UTCP: a novel polyimide based ultra-thin chip packaging technology
(submitted),” IEEE transactions on
components and packaging, pp. ?-?, 2009.
[528]Y. Hsu, M. Gonzalez, F. Bossuyt, F. Asixa, J. Vanfleteren, and I. De Wolf, “A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics,” Mater. Res. Soc. Symposium, Proc. Vol. 1192, pp. 1192-PP15-03, 2009.
[529]Y. Hsu, M. Gonzalez, F. Bossuyt,
F. Asixa, J. Vanfleteren, and I. De Wolf, “In situ
observations on deformation behaviour and stretching-induced failure of fine
pitch stretchable interconnect,” Journal
of Materials Research, vol. 24, no. 12, pp. ?-?, 2009.
[530]H. Murat, A. Avci, R. Beernaert,
K. Dhaenens, H. De Smet, L. Bogaert, J. Meuret, and H. Thienpont,
“Two LCOS full color projector with efficient LED illumination engine,” Displays, vol. 30, pp. 155-163,
2009.
[531]D. Schaubroeck, J. De Baets, T. Desmet,
S. Van Vlierberghe, E. Schacht, and A. Van Calster, “Introduction
of amino groups on the surface of thin photo definable epoxy resin layers via
chemical modificatio,” Applied Surface Science,
vol. 255, pp. 8780-8787, 2009.
[532]L. Bogaert, Y. Meuret, B. Van Giel,
H. De Smet, and H. Thienpont, “Design of a compact projection
display for the visualization of 3-D images using polarization sensitive
eyeglasses,” Journal of the SID, vol. 17.
[533]J. Windels, C. Van Praet, H. De Pauw,
and J. Doutreloigne, “Comparative study of the effects of PVT variations
between a novel All-MOS current reference and alternative CMOS solutions,” in 52nd IEEE International Midwest
Symposium on Circuits and Systems 2009 (MWSCAS 2009), (Cancun, Mexico), pp. 49-53,
August 2009.
[534]D. Brosteaux, E. Lippens, R. Cornelissen,
E. Schacht, R. Carta, P. Jourand, R. Puers, F. Axisa,
T. Vervust, F. Bossuyt, and J. Vanfleteren, “In vitro cytotoxicity
testing and the application of elastic interconnection technology for
short-term implantable electronics,” in
The 31th Int. Conf of the IEEE Eng. in Medicine and Biology Society (IEEE
EMBC 2009), (Minneapolis, Minnesota, USA), pp. 4880-4883, September 2009.
[535]F. Axisa, P. Jourand, E. Lippens,
P. R, R. Cornelissen, M. Rymarczyk-Machal, N. De Smet,
E. Schacht, and J. Vanfleteren, “Design and fabrication of a low cost
implantable bladder pressure monitor,” in
The 31th Int. Conf of the IEEE Eng. in Medicine and Biology Society (IEEE
EMBC 2009), (Minneapolis, Minnesota, USA), pp. 4864-4867, September 2009.
[536]J. Missinne, G. Van Steenberge,
J. Vanfleteren, and P. Van Daele, “Multimode PDMS waveguides
fabricated using a hot-embossing technique,” in submitted for presentation at the 35th Int. Conf. on Micro and Nano Engineering
(MNE), (Ghent, Belgium), pp. -, September-October 2009.
[537]B. Huyghe, J. Vanfleteren, and J. Doutreloigne,
“Design of flexible, low-power and wireless sensor nodes for human posture
tracking aiding epileptic seizure detection,” in accepted for presentation at the 8th Ann. IEEE Conference on
Sensors (IEEE Sensors 2009), (Chirstchurch, New Zealand), pp. -, October
2009.