\begin{thebibliography}{100} \bibitem{ddj_ave:66} A.~Vervaet, ``Invloed van indifferent elektrolyt op de dissociatie van weinig gesplitste verbindingen en de toepassing ervan voor het meten van diffusiepotentialen,'' in {\em Dag der Jongeren}, (Leuven), pp.~3--4, Vlaamse Chemische Vereniging, January 1966. \bibitem{ddj_ave:67} A.~Vervaet, ``Invloed van indifferent elektrolyt op de aktiviteit van zwak zuur- en neerslagionen,'' in {\em Dag der Jongeren}, (Brussel), p.~16, Vlaamse Chemische Vereniging, February 1967. \bibitem{kaw_wri:67} W.~Rigole and A.~Vervaet, ``Meting van diffusiepotentialen in elektrolytoplossingen,'' {\em Mededelingen van de Koninklijke Vlaamse Academie voor Wetenschappen}, vol.~1, pp.~3--10, 1967. \bibitem{vcv_ave:68} A.~Vervaet, ``Invloed van indifferent elektrolyt op de activiteit van zwak zuur- en neerslagionen,'' {\em Mededelingen van de Vlaamse Chemische Vereniging}, vol.~1, pp.~31--34, January 1968. \bibitem{kaw_fvk:71} F.~Vanden~Kerchove and A.~Vervaet, ``Heterogene katalyse i,'' {\em Mededelingen van de Koninklijke Vlaamse Academie voor Wetenschappen}, vol.~6, pp.~3--19, 1971. \bibitem{tsf_avc:71} A.~Van~Calster and H.~Pauwels, ``Dispersion characteristics of thin film capacitances caused by surface trapping,'' {\em Thin Solid Films}, vol.~7, pp.~R17--R20, March--April 1971. \bibitem{kaw_ave:73} A.~Vervaet and F.~Vanden~Kerchove, ``Heterogene katalyse ii,'' {\em Mededelingen van de Koninklijke Vlaamse Academie voor Wetenschappen}, vol.~5, pp.~3--35, 1973. \bibitem{chw_gvh:73} G.~van~der Horst and A.~Vervaet, ``Natuurwetenschappelijk onderwijs op {A}frikaanse bodem: wensdroom of realiteit,'' {\em chemisch weekblad}, vol.~51. \bibitem{sse_avc:73} A.~Van~Calster, ``Effective mobility and bulk trapping in heavily doped {CdSe},'' {\em Solid-State Electronics}, vol.~16, pp.~117--119, 1973. \bibitem{tsf_avc:74} A.~Van~Calster and H.~Pauwels, ``Role of incompletely ionized donors as bulk traps in thin film transistors,'' {\em Thin Solid Films}, vol.~21, pp.~S33--S36, 1974. \bibitem{sse_avc:75} A.~Van~Calster and H.~Pauwels, ``Theoretical influence of surface states and bulk traps on thin film transistors,'' {\em Solid State Electronics}, vol.~18, pp.~691--698, 1975. \bibitem{ihs_avc:77} A.~Van~Calster, ``Industrial potential of research on amorphous semiconductors, thin film transistors and solar cells,'' in {\em ISHM studiedag}, (Gent), LEM - ISHM, March 1977. \bibitem{tsf_avc:77} A.~Van~Calster and P.~Reussens, ``The variation of resistivity with temperature for {n-type} degenerate indium antimonide films,'' {\em Thin Solid Films}, vol.~44, pp.~21--28, July 1977. \bibitem{sse_avc:78} A.~Van~Calster, ``A channel conductance measuring technique for determining the interface properties of a {SiO-InSb} thin film transistor,'' {\em Solid State Electronics}, vol.~21, p.~393, 1978. \bibitem{clt_avc:78} A.~Van~Calster, ``A {InSb} thin film transistor operating at cryogenic temperatures,'' in {\em 15th International Conference on Low Temperature Physics, book of abstracts}, 1978. \bibitem{jdp_avc:78} A.~Van~Calster, ``A {InSb} thin film transistor operating at cryogenic temperatures,'' {\em Journal de physique}, vol.~C6, no.~39, Supplement 8, p.~1186, 1978. \bibitem{jec_ave:78} A.~Vervaet, W.~Gomes, and F.~Cardon, ``Some electrochemical processes at the {N}- and {P}-{InP} electrodes,'' {\em Journal of Electroanalytical Chemistry}, vol.~91, pp.~133--136, 1978. \bibitem{sse_avc:79} A.~Van~Calster, ``The experimental study of the indium antimonide thin film transistor,'' {\em Solid State Electronics}, vol.~22, pp.~77--80, 1979. \bibitem{pss_avc:79} A.~Van~Calster, ``Barrier limited conductivity in thin semiconducting films,'' {\em Physica Status Solidi}, vol.~54, pp.~207--216, 1979. \bibitem{ted_avc:79} A.~Van~Calster and L.~Vandendriessche, ``On the theory of thin-film {MIS} capacitances,'' {\em IEEE Trans. Electron Dev.}, vol.~EDL-26, pp.~765--775, 1979. \bibitem{hmc_avc:79} A.~Van~Calster and A.~De~Vos, ``State of the art in thin film transistor~: a review of the used insulator-semiconductor combinations,'' in {\em Proc. 2nd European Hybrid Microelectronics Conf.}, (Gent), pp.~197--204, ISHM, May, 21-23 1979. \bibitem{jap_avc:80} A.~Van~Calster and {Li Yu-Min}, ``An investigation of the {Al$_2$O$_3$-CdSe} interface in accumulation,'' {\em J. Appl. Phys.}, vol.~23, pp.~327--331, 1980. \bibitem{jph_sdm:80} S.~Demolder and A.~Van~Calster, ``The measuring of {1/f} noise of thick and thin film resistors,'' {\em Journal of Physics}, vol.~80, pp.~1323--1327, 1980. \bibitem{est_avc:80} A.~Van~Calster and A.~De~Vos, ``State of the art in thin film transistor~: a review of the used insulator semiconductor combinations,'' {\em Electrocomponent Science and Technology}, no.~6, pp.~131--134, 1980. \bibitem{hmc_sdm:81} S.~Demolder, A.~Van~Calster, and M.~Vandendriessche, ``Current noise in thick and thin film resistors,'' in {\em Proc. 3rd European Hybrid Microelectronics Conf.}, (Avignon), pp.~19--25, ISHM, 1981. \bibitem{hmc_avc:81} A.~Van~Calster, ``Thin film transistors and thin film transistor circuits,'' in {\em Proc. 3rd European Hybrid Microelectronics Conf.}, (Avignon), pp.~411--416, ISHM, 1981. \bibitem{cpa_avc:82} A.~Van~Calster, {\em Course on thin films}. \newblock Center for Proffesional Advancement, yearly course, started 1982. \bibitem{eel_avc:82} A.~Van~Calster, S.~Demolder, and L.~Van Den~Eede, ``Current noise measurements,'' {\em European Electronics}, vol.~1, pp.~26--27, 1982. \bibitem{kve_avc:82} A.~Van~Calster, A.~De~Vos, and M.~Burgelman, ``The development of the thin film transistor,'' {\em Bulletin {KVE}-Revue}, vol.~98, pp.~95--98, 1982. \bibitem{cen_mtr:82} M.~Trari, A.~Vervaet, and R.~Ouahes, ``Etude de quelques parametres d`une cellule photoelectrochimique,'' in {\em 2ieme Seminaire National sur l`Energie Solaire Commissariat aux Energie Nouvelles (CEN)}, (Algiers, Agerije), 1982. \bibitem{est_avc:83} A.~Van~Calster, ``Thin film transistors and thin film transistor circuits,'' {\em Electrocomponent Science and technology}, vol.~10, p.~153, 1983. \bibitem{est_sdm:83} S.~Demolder, A.~Van~Calster, and M.~Vandendriessche, ``Current noise in thick and thin film resistors,'' {\em Electrocomponent Science and technology}, vol.~10, p.~81, 1983. \bibitem{nps_avc:83} A.~Van~Calster, L.~Van Den~Eede, S.~Demolder, and A.~De~Keyser, ``{1/f} noise in cermet and metanet resistors,'' in {\em 7th Int. Conf. on Noise in Physical Systems, book of abstracts}, (Montpellier), p.~162, 1983. \bibitem{noi_avc:83} A.~Van~Calster, L.~Van Den~Eede, S.~Demolder, and A.~De~Keyser, ``{1/f} noise in cermet and metanet resistors,'' in {\em Noise in Physical Systems and 1/f Noise} (M.~Savelli, G.~Lecoy, and J.-P. Nougier, eds.), (Amsterdam), pp.~193--195, North-Holland, 1983. \bibitem{mpi_avc:83} A.~Van~Calster, {\em Thin film technology}. \newblock Course in Microelectronics Packaging and Interconnection, Amsterdam, June 1983. \bibitem{hmc_avc:83} A.~Van~Calster, L.~Van Den~Eede, S.~Demolder, and B.~Bouw, ``Current and noise measurements on low temperature thick film resistors,'' in {\em Proc. 4th Hybrid European Microelectronics Conf.}, (Copenhagen), ISHM, 1983. \bibitem{esp_hma:83} H.~E. Maes, G.~Heyns, J.~Remmeric, M.~Hinoul, H.~Loos, A.~Van~Calster, A.~Lequesne, and K.~Allaert, ``Comparative study of plasma nitrides for {IC} passivation,'' in {\em The Electrochemical Soc. Proceedings, Symposium}, p.~177, 1983. \bibitem{ssd_gdm:84} G.~De~Mey, D.~Loret, and A.~Van~Calster, ``The boundary element method for modeling the {DMOS} transistor at high drain voltages,'' in {\em Int. Conf. on Simulation of Semiconductor Devices and Processes}, (Swansea), June 1984. \bibitem{ctf_kal:84} K.~Allaert and A.~Van~Calster, ``The influence of the deposition and annealing temperature on plasma enhanced chemical vapour deposition of {Si$_3$N$_4$},'' in {\em 6th Int. Conf. on Thin Films}, August 1984. \bibitem{ctf_avc:84} A.~Van~Calster, ``Fabrication process for the thin film transistor,'' in {\em 6th Int. Conf. on Thin Films}, August 1984. \bibitem{jes_kal:85} K.~Allaert, A.~Van~Calster, H.~Loos, and A.~Lequesne, ``A comparison between silicon nitride films made by {PCVD} of {N$_2$-SiH$_4$/Ar} and {N$_2$-SiH$_4$/He},'' {\em J. of the Electrochemical Soc.}, vol.~132, no.~7, pp.~1763--1766, 1985. \bibitem{hmc_sdm:85} S.~Demolder, A.~Van~Calster, A.~Lequesne, and E.~Daelen, ``Noise-design criteria for thick-film resistors,'' in {\em Proc. 5th European Hybrid Micoelectronics Conf.}, (Stresa), p.~265, ISHM, May 1985. \bibitem{nps_sdm:85} S.~Demolder and A.~Van~Calster, ``A model for the electrical condoction and {1/f-noise} in cermet {thick-film} resistors-systems,'' in {\em 8th Int. Conf. on Noise in Physical Systems and 4th Conf. on 1/f noise, book of abstracts}, (Roma), September 1985. \bibitem{noi_sdm:85} S.~Demolder and A.~Van~Calster, ``A model for the electrical condoction and {1/f-noise} in cermet {thick-film} resistors-systems,'' in {\em Noise in Physical Systems and 1/f Noise} (A.~D'Amico and P.~Mazetti, eds.), (Amsterdam), pp.~145--148, North-Holland, 1985. \bibitem{ped_kal:85} K.~Allaert and A.~Van~Calster, ``Evaluation of {PCVD} silicon nitride as thin film isolator, as a cross over dielectric and as a passivation layer,'' in {\em Proc. 3rd Int. Conf. on Plasma Etching and Plasma Deposition}, pp.~239--243, November 1985. \bibitem{tsf_avc:85} A.~Van~Calster, ``Fabrication processes for the film transistor,'' {\em Thin Solid Films}, vol.~126, pp.~219--225, 1985. \bibitem{epu_avc:85} F.~N. Sinnaduria, ed., {\em Handbook of microelectronics packaging \& interconnection technology, Van Calster, Andr\'e}, ch.~Thin film technology, pp.~15--38. \newblock Ayr: Electrochemical Publications, 1985. \bibitem{edl_jvf:85} J.~Vanfleteren and A.~Van~Calster, ``A four-vacuum-cycle lift-off process for the polycrystalline {CdSe} thin-film transistor,'' {\em IEEE Electron Device Lett.}, vol.~EDL-6, no.~1, pp.~11--13, 1985. \bibitem{sid_jvf:85} J.~Vanfleteren, A.~Van~Calster, and H.~Pauwels, ``Shift registers with polycrystalline {CdSe} thin film transistors,'' in {\em Int. Display Research Conf. 85}, (San-Diego), pp.~72--75, SID, 1985. \bibitem{ata_avc:86} A.~Van~Calster, {\em Course on thin film technology}. \newblock ATAC, London, yearly course, started in 1986. \bibitem{vpw_kal:86} K.~Allaert, A.~Van~Calster, and A.~Vervaet, ``Evaluation of {PCVD} silicon nitride as total passivation layer for chips,'' in {\em 5th {VLSI} Packaging Workshop}, (Paris), p.~26, November 1986. \bibitem{tsf_jvf:86} J.~Vanfleteren and A.~Van~Calster, ``A comparative study of evaporated {Al$_2$O$_3$}, {SiO$_2$} and {SiO$_2$-Al$_2$O$_3$} thin films,'' {\em Thin Solid Films}, no.~139, pp.~89--94, 1986. \bibitem{tsf_ave:86} A.~Vervaet, M.~Burgelman, and D.~Van~Wassenhove, ``Kinetics of the dry formation of {Cu2S} in {Cu2S/CdS} solar cells,'' {\em Thin Solid Films}, no.~151, pp.~133--143, 1986. \bibitem{sid_idr:86} I.~De~Rycke, A.~Van~Calster, J.~Vanfleteren, and A.~De~Clercq, ``The design and simulation of poly-{C}d{S}e {TFT} driving circuits for high resolution {LC} displays,'' in {\em Japan Display 86}, (Tokyo), pp.~304--307, SID, 1986. \bibitem{nps_jdo:87} J.~Doutreloigne, S.~Demolder, A.~Van~Calster, and L.~Vandendriessche, ``{1/f} noise in p-channel {MOS} transistors made in a {BIMOS} process,'' in {\em 9th Int. Conf. on Noise in Physical Systems, book of abstracts}, (Montreal), May 1987. \bibitem{noi_jdo:87} J.~Doutreloigne, S.~Demolder, A.~Van~Calster, and L.~Vandendriessche, ``{1/f} noise in p-channel {MOS} transistors made in a {BIMOS} process,'' in {\em Noise in Physical Systems} (C.~M. Van~Vliet, ed.), (Singapore), pp.~461--464, World Scientific, 1987. \bibitem{hmc_sdm:87} S.~Demolder, D.~Brokken, A.~Van~Calster, A.~Lequesne, and K.~Van~Daele, ``A comparative study of evaluation tests on {PdAg} multilayer systems,'' in {\em Proc. 6th European Hybrid Microelectronics Conf.}, (Bornemouth), p.~464, ISHM, June 1987. \bibitem{fic_kal:87} K.~Allaert, A.~Van~Calster, and A.~Vervaet, ``{PCVD} {SIN} conformal coatings for the improvement of the reliability of wire bonded chips,'' in {\em Int. Symposium on the Physical and Failure Analysis of Integrated Circuits}, (Singapore), 1987. \bibitem{c26_avc:87} A.~Van~Calster, A.~Vervaet, I.~De~Rycke, J.~De~Baets, and J.~Vanfleteren, ``Polycrystalline {CdSe} films for thin film transistors,'' in {\em The Seventh American Conference on Crystal Growth}, (Monterey), July 1987. \bibitem{acc_avc:87} A.~Van~Calster, A.~Vervaet, I.~De~Rycke, J.~De~Baets, and J.~Vanfleteren, ``Polycrystalline {CdSe} films for thin film transistors,'' in {\em 3rd Int. Conf. on {II-VI} compounds, book of abstracts}, (Monterey), p.~397, July 1987. \bibitem{sid_jvf:87} J.~Vanfleteren, P.~Vandenberghe, A.~Van~Calster, J.~De~Baets, I.~De~Rycke, F.~Cuypers, and P.~Jones, ``A self-aligned poly-{CdSe} thin film transistor technology for active matrix addressing with grey scales,'' in {\em Eurodisplay 87}, (London), p.~165, SID, 1987. \bibitem{edl_avc:87} A.~Van~Calster, I.~De~Rycke, A.~Vervaet, J.~De~Baets, and J.~Vanfleteren, ``A new technology for fast switching circuits on glass,'' {\em IEEE Electron Device Lett.}, vol.~EDL-8, no.~10, pp.~477--479, 1987. \bibitem{ana_gdm:87} G.~De~Mey, D.~Loret, and A.~Van~Calster, ``Modelling of dmos transistors,'' {\em Reprint of Colloqium Topics in Applied Numerical Analysis}, 1987. \bibitem{jap_avc:88} A.~Van~Calster, J.~Vanfleteren, I.~De~Rycke, and J.~De~Baets, ``On the field effect in polycrystalline {C}d{S}e thin-film transistors,'' {\em J. Appl. Phys.}, vol.~64, no.~6, pp.~3282--3286, 1988. \bibitem{msl_ave:88} A.~Vervaet, M.~Burgelman, and I.~Clemminck, ``On the interpretation of solid-state coulometry {(SSC)}, used in studies of thin films of copper sulphide,'' {\em Journal of Materials Science Letters}, vol.~8, pp.~69--70, 1988. \bibitem{soc_ave:88} A.~Vervaet, D.~Van~Wassenhove, M.~Burgelman, and I.~Clemminck, ``Structural analysis of {`DRY`} {Cu2S-CdS} solar cells,'' {\em Solar Cells}, vol.~23, pp.~217--232, 1988. \bibitem{jcg_avc:88} A.~Van~Calster, A.~Vervaet, I.~De~Rycke, J.~De~Baets, and J.~Vanfleteren, ``Polycrystalline {CdSe} films for thin film transistors,'' {\em Journal of Crystal Growth}, vol.~86, pp.~924--928, 1988. \bibitem{sid_jvf:88} J.~Vanfleteren, P.~De~Visschere, J.~De~Baets, I.~De~Rycke, J.~Doutreloigne, and A.~Van~Calster, ``Active matrix {CdSe TFT} addressed electroluminescent displays,'' in {\em Int. Display Research Conf. 88}, (San Diego), pp.~74--79, SID, 1988. \bibitem{sid_idr:88} I.~De~Rycke, J.~De~Baets, J.~Doutreloigne, A.~Van~Calster, and J.~Vanfleteren, ``The realisation and evaluation of {poly-CdSe TFT} driving circuits,'' in {\em Int. Display Research Conf. 88}, (San Diego), pp.~70--73, SID, 1988. \bibitem{pse_ave:88} A.~Vervaet, M.~Burgelman, I.~Clemminck, and J.~Capon, ``Screen printing of {CuInSe2} films,'' in {\em 9th European Photovoltaic Solar Energy Conference}, (Freiburg (BRD)), pp.~480--484, 1988. \bibitem{psc_icl:88} I.~Clemminck, A.~Vervaet, M.~Burgelman, and A.~De~Meyere, ``Electrical and morphological properties of screenprinted cds layers for cds-cdte solar cells,'' in {\em Proceedings 20nd {IEEE} Photovoltaic Specialists Conference}, (Las Vegas), pp.~1585--1590, IEEE, 1988. \bibitem{ing_ave:89} A.~Vervaet and M.~Burgelman, ``Analyse apparatuur voor materiaalonderzoek - een verkenning,'' {\em Het Ingenieursblad}, vol.~58, no.~2, pp.~13--20, 1989. \bibitem{hmc_avc:89} A.~Van~Calster, ``Thin film transistors and flat-panel displays,'' in {\em Proc. 7th European Hybrid Microelectronics Conf.}, ISHM, May 1989. \bibitem{sid_avc:89} A.~Van~Calster, J.~De~Baets, I.~De~Rycke, J.~Doutreloigne, H.~De~Smet, and J.~{Vanfleteren}, ``On the poly-{CdSe} thin film transistor technology,'' in {\em Japan Display 89}, (Kyoto), pp.~408--411, SID, 1989. \bibitem{tat_jdo:89} J.~Doutreloigne, J.~De~Baets, I.~De~Rycke, H.~De~Smet, A.~Van~Calster, and J.~Vanfleteren, ``A complementary {Ge-CdSe TFT} technology for flat panel displays,'' in {\em TATF book of abstracts}, (Regensburg), TATF, 1989. \bibitem{nps_jdo:89} J.~Doutreloigne, J.~De~Baets, I.~De~Rycke, H.~De~Smet, A.~Van~Calster, and J.~Vanfleteren, ``A correlation between 1/f-noise and short-term drift in poly {CdSe:In} thin film transistors,'' in {\em 10th Int. Conf. on Noise in Physical Systems, book of abstracts}, (Budapest), pp.~313--315, August 1989. \bibitem{noi_jdo:89} J.~Doutreloigne, J.~De~Baets, I.~De~Rycke, H.~De~Smet, A.~Van~Calster, and J.~Vanfleteren, ``A correlation between 1/f-noise and short-term drift in poly {CdSe:In} thin film transistors,'' in {\em Noise in Physical Systems} (Ambrozy, ed.), pp.~511--514, 1989. \bibitem{kie_ave:89} A.~Vervaet, ``Het gebruik van kunststoffen in het zeefdrukken,'' in {\em Studiedag: Kunststoffen in de Elektronika}, (Anterpen), KVIV, oktober 1989. \bibitem{afr_avc:90} A.~Van~Calster, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, and J.~Vanfleteren, ``Transistori a film sottile per indicatori a schermo piatto,'' {\em Alta Frequenza Riv. di Elett.}, vol.~II, no.~1, pp.~3--8, 1990. \bibitem{tsf_jdo:90} J.~Doutreloigne, J.~De~Baets, I.~De~Rycke, H.~De~Smet, A.~Van~Calster, and J.~Vanfleteren, ``The influence of low copper-doping concentrations on the recrystallisation process in and the electrical properties of germanium in {Ge:Cu} thin film transistors,'' {\em Thin Solid Films}, no.~189, pp.~235--245, 1990. \bibitem{ssc_idr:90} I.~De~Rycke, A.~Van~Calster, J.~Vanfleteren, J.~De~Baets, J.~Doutreloigne, H.~De~Smet, and P.~Vetter, ``{2-MHz} clocked {LCD} drivers on glass,'' {\em IEEE J. Solid-State Circuits}, vol.~25, no.~2, pp.~531--538, 1990. \bibitem{jes_ave:90} A.~Vervaet, I.~Clemminck, and M.~Burgelman, ``Solid-state coulometric titration study of sputtered cuxs layers,'' {\em Journal of the Electrochemical Society}, vol.~137, pp.~2962--2966, 1990. \bibitem{ted_jdb:90} J.~De~Baets, J.~Vanfleteren, I.~De~Rycke, J.~Doutreloigne, A.~Van~Calster, and P.~De~Visschere, ``High-voltage polycrystalline {CdSe} thin film transistors,'' {\em IEEE Trans. Electron Devices}, vol.~37, no.~3, pp.~636--639, 1990. \bibitem{eur_avc:90} A.~Van~Calster, {\em Video course on thin film technology}. \newblock {EuroPACE}, March 1990. \bibitem{iwc_jdb:90} J.~De~Baets, A.~Van~Calster, J.~Capon, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, and J.~Vanfleteren, ``Influence of the processing parameters of {CdSe} on {TFT} characteristics,'' in {\em Proc. of the 1st Int. CdSe Workshop}, (Gent), pp.~53--68, TFCG-RUG, 1990. \bibitem{iwc_jvf:90} J.~Vanfleteren, J.~Capon, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, and A.~Van~Calster, ``{CdSe} {TFT} technology at the {RUGent} laboratory of electronics,'' in {\em Proc. of the 1st Int. CdSe Workshop}, (Gent), pp.~16--26, TFCG-RUG, 1990. \bibitem{iwc_hds:90} H.~De~Smet, J.~Doutreloigne, J.~Capon, J.~De~Baets, I.~De~Rycke, A.~Van~Calster, and J.~Vanfleteren, ``Designing complementary integrated driver circuits,'' in {\em Proc. of the 1st Int. CdSe Workshop}, (Gent), pp.~92--102, TFCG-RUG, 1990. \bibitem{sid_jdo:90} J.~Doutreloigne, H.~De~Smet, J.~De~Baets, I.~De~Rycke, A.~Van~Calster, and J.~Vanfleteren, ``Complementary {CdSe:In/Ge:Cu TFT} circuits for integrated display drivers,'' in {\em Eurodisplay 90}, (Amsterdam), pp.~316--319, SID, 1990. \bibitem{sid_jvf:90} J.~Vanfleteren, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, A.~Van~Calster, P.~De~Visschere, K.~Sallm\'en, and R.~Graeffe, ``Design of a prototype active matrix {CdSe} {TFT} addressed {EL} display,'' in {\em Eurodisplay 90}, (Amsterdam), pp.~216--219, SID, 1990. \bibitem{pvs_ave:90} A.~Vervaet, M.~Burgelman, I.~Clemminck, and M.~Casteleyn, ``Screen printing of {CIS} films for {CIS-CdS} solar cells,'' in {\em Proceedings of the 10th E.C. PVSEC}, (Lissabon), pp.~900--903, 1990. \bibitem{pvs_icl:90} I.~Clemminck, M.~Burgelman, and A.~Vervaet, ``Screenprinted {CdS-CdTe} solar cells,'' in {\em Proceedings of the 10th E.C. PVSEC}, (Lissabon), pp.~577--580, 1990. \bibitem{sse_jdo:91} J.~Doutreloigne, J.~De~Baets, I.~De~Rycke, H.~De~Smet, A.~Van~Calster, and J.~Vanfleteren, ``The electrical performance of a complementary {CdSe:In/Ge:Cu} thin film transistor technology for flat panel displays,'' {\em Solid State Electronics}, vol.~34, no.~2, pp.~143--147, 1991. \bibitem{elc_avc:91} A.~Van~Calster, J.~Capon, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, and J.~Vanfleteren, ``Thin film transistors for the addressing of liquid crystal displays,'' in {\em Summer European Liquid Crystal Conf.}, (Vilnius), ---, August 19--25 1991. \bibitem{sid_jdb:91} J.~De~Baets, J.~Capon, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, A.~Van~Calster, J.~Vanfleteren, T.~Fujisawa, H.~Ogawa, and H.~Takatsu, ``A polymer network liquid crystal {poly-CdSe} {TFT} active matrix display,'' in {\em Int. Display Research Conf. 91}, (San-Diego), pp.~215--218, SID, 1991. \bibitem{sid_jvf:91} J.~Vanfleteren, J.~Capon, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, A.~Van~Calster, P.~De~Visschere, K.~Sallm\'en, and K.~Graeffe, ``Evaluation of a $64 \times 64$ {CdSe} {TFT} addressed {ACTFEL} display demonstrator,'' in {\em Int. Display Research Conf. 91}, (San-Diego), pp.~134--136, SID, 1991. \bibitem{es5_jca:91} J.~Capon, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, A.~Van~Calster, and J.~Vanfleteren, ``{CdSe} based thin film integrated optical sensors,'' in {\em Eurosensors V conf. book of abstracts}, (Rome), p.~257, 1991. \bibitem{hci_rvb:91} R.~Vanden~Berghe, S.~Demolder, M.~Saill\'e, A.~Van~Calster, and H.~Schotte, ``Palladium/silver multilayers,'' {\em Hybrid Circuits}, no.~25, pp.~16--20, 1991. \bibitem{saa_jca:92} J.~Capon, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, A.~Van~Calster, and J.~Vanfleteren, ``{CdSe} based thin film integrated optical sensors,'' {\em Sensors and Actuators A}, vol.~32, no.~1--3, pp.~437--411, 1992. \bibitem{wwa_jvf:92} J.~Vanfleteren, J.~Capon, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, A.~Van~Calster, P.~De~Visschere, K.~Sallm\'en, and R.~Graeffe, ``{CdSe} {TFT} active matrix addressed electroluminescent displays,'' in {\em 3rd Winter workshop AMLCDs}, (Minsk), February 1992. \bibitem{iwc_hds:92} H.~De~Smet, J.~Doutreloigne, J.~Capon, J.~De~Baets, I.~De~Rycke, A.~Van~Calster, and J.~Vanfleteren, ``Unification of {poly-CdSe} active matrix and {poly-CdSe/poly-Ge} integrated driver technology,'' in {\em Proc. of the 2nd Int. CdSe Workshop}, (London), Imperial College, May 1992. \bibitem{iwc_jdb:92} J.~De~Baets, J.~Capon, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, A.~Van~Calster, and J.~Vanfleteren, ``Polymer network liquid crystal {poly-CdSe} {TFT} active matrix displays,'' in {\em Proc. of the 2nd Int. CdSe Workshop}, (London), Imperial College, May 1992. \bibitem{iwc_avc:92} A.~Van~Calster, J.~De~Baets, J.~Capon, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, and J.~Vanfleteren, ``On the ohmic contact formation in {poly-CdSe} thin films,'' in {\em Proc. of the 2nd Int. 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Soc., October 1992. \bibitem{tft_jdb2:92} J.~De~Baets, A.~Van~Calster, J.~Capon, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, J.~Vanfleteren, G.~Nachtergaele, and S.~Demolder, ``Silicon oxynitride layers for device passivation,'' in {\em Proc. of the 1st TFTT Symposium}, vol.~92-24, (Toronto), pp.~192--199, The Electrochem. Soc., October 1992. \bibitem{sid_hds:92} H.~De~Smet, J.~Capon, J.~De~Baets, I.~De~Rycke, J.~Doutreloigne, A.~Van~Calster, and J.~{Vanfleteren}, ``Active matrix with integrated drivers on soda-lime glass using {poly-CdSe} and {poly-Ge},'' in {\em Japan Display 92}, (Hiroshima), pp.~225--228, SID, 1992. \bibitem{ell_mjz:92} M.~J. Zhou, A.~De~Bruycker, A.~Van~Calster, J.~Witters, and G.~Schols, ``Breakdown walkout and its reduction in high-voltage {pLDMOS} transistors on thin epitaxial layer,'' {\em {IEE} Electronics Letters}, vol.~28, no.~16, pp.~1537--1538, 1992. \bibitem{es6_jca:92} J.~Capon, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, A.~Van~Calster, and J.~Vanfleteren, ``A lensless contact-type image sensor based on a {CdSe} photoconductive array,'' in {\em Eurosensors VI conf. book of abstracts}, (San Sebastian), pp.~287--288, October 1992. \bibitem{mol_avc:92} A.~Van~Calster, J.~Capon, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, and J.~Vanfleteren, ``Thin film transistors for the addressing of liquid crystal displays,'' {\em Molecular Materials}, vol.~1, pp.~189--301, 1992. \bibitem{ecs_jdb1:92} J.~De~Baets, A.~Van~Calster, J.~Capon, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, J.~Vanfleteren, T.~Fujisawa, H.~Ogawa, and H.~Takatsu, ``Active matrix design for polymer network liquid crystal projection displays,'' in {\em Thin Film Transistor Technologies, Symposium, Book of Abstracts}, (Toronto), pp.~471--472, The Electrochemical Society, October 1992. \bibitem{ecs_jdb2:92} J.~De~Baets, A.~Van~Calster, J.~Capon, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, and J.~Vanfleteren, ``Silicon oxynitride layers for device passivation,'' in {\em Thin Film Transistor Technologies, Symposium, Book of Abstracts}, vol.~92-2, (Toronto), pp.~454--455, The Electrochemical Society, October 1992. \bibitem{hmc_avc:93} A.~Van~Calster, J.~De~Baets, A.~M. De~Cubber, H.~De~Smet, J.~Capon, J.~Vanfleteren, J.~Farrell, and M.~Westcott, ``Thin film technologies for high density active matrix addressed displays,'' in {\em Proc. 9th European Hybrid Microelectronics Conf.}, (Nice), pp.~84--90, ISHM, June 2--4, 1993. \bibitem{hci_bdm:93} B.~De~Meulemeester, A.~Van~Calster, A.~De~Bruycker, and K.~Allaert, ``Fabrication of high density multi-chip modules with standard {IC} production equipment,'' {\em Hybrid Circuits}, no.~30, pp.~27--30, 1993. \bibitem{jsi_jdb:93} J.~De~Baets, J.~Capon, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, A.~Van~Calster, J.~Vanfleteren, T.~Fujisawa, H.~Ogawa, and H.~Takatsu, ``A polymer-network liquid-crystal {poly-CdSe}-{TFT} active-matrix display,'' {\em Journal of the SID}, vol.~1, no.~2, pp.~189--194, 1993. \bibitem{ell_mjz:93} M.~J. Zhou, A.~De~Bruycker, A.~Van~Calster, and G.~Schols, ``Modified {SPICE} modelling of {DC} characteristics for high- voltage {DMOS} transistors,'' {\em {IEE} Electronic Letters}, vol.~29, no.~1, pp.~126--127, 1993. \bibitem{ell_adb:93} A.~De~Bruycker, M.~J. Zhou, A.~Van~Calster, and J.~Witters, ``Improved negative dynamic resistance model for high voltage {MOSFETs},'' {\em {IEE} Electronic Letters}, vol.~29, no.~2, pp.~212--213, 1993. \bibitem{iwc_hds:93} H.~De~Smet, J.~Capon, J.~De~Baets, A.~M. De~Cubber, A.~Van~Calster, and J.~Vanfleteren, ``Generalised {TFT-Model} for {4-Quadrant} simulations,'' in {\em Proc. of the 3nd Int. CdSe Workshop}, (Strasbourg), Institut {f\"ur} Bildschirmtechnik, Aug 1993. \bibitem{iwc_avc:93} A.~Van~Calster, J.~De~Baets, A.~M. De~Cubber, J.~Capon, H.~De~Smet, and J.~Vanfleteren, ``On the physical properties of a new {HVTFT} design,'' in {\em Proc. of the 3nd Int. 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Zhou, H.~De~Smet, A.~De~Bruycker, and A.~Van~Calster, ``A {2--D} boundary element method approach to the simulation of {DMOS} transistors,'' {\em {IEEE} Trans. on {CAD} of {ICs} and Systems}, vol.~12, no.~6, pp.~810--816, 1993. \bibitem{oit_rba:93} R.~Baets, P.~Demeester, P.~Van~Daele, L.~Martens, J.~Van~Campenhout, H.~Pauwels, A.~Van~Calster, P.~De~Visschere, I.~Veretennicoff, H.~Thienpont, R.~Vounckx, A.~Barel, A.~Vander~Vorst, and D.~Van~Hoenacker, ``Iuap-24: Optoelectronic information technology,'' {\em Physicalia Magazine}, vol.~15, no.~12, pp.~167--181, 1993. \bibitem{saa_jca:93} J.~Capon, J.~De~Baets, I.~De~Rycke, H.~De~Smet, J.~Doutreloigne, A.~Van~Calster, and J.~Vanfleteren, ``A lensless contact-type image sensor based on a {CdSe} photoconductive array,'' {\em Sensors and Actuators A}, vol.~37-38, pp.~546--551, 1993. \bibitem{sid_jdb:93} J.~De~Baets, J.~Capon, A.~M. De~Cubber, H.~De~Smet, A.~Van~Calster, J.~Vanfleteren, T.~Fujisawa, H.~Ogawa, M.~Aizawa, and H.~Takatsu, ``Hysteresis phenomena in active matrix addressed {P}olymer {N}etwork {L}iquid {C}rystal displays,'' in {\em The 13th Int. 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De~Cubber, H.~De~Smet, A.~Van~Calster, and J.~Vanfleteren, ``Analysis of transient photoconductivity in {CdSe:Cu:Cl} thin films,'' {\em Physica Status Solidi (a)}, vol.~142, no.~1, 1994. \bibitem{ept_avc:94} A.~Van~Calster, J.~De~Baets, J.~Vanfleteren, A.~Dravet, K.~Allaert, E.~Cortes, K.~Deckelmann, and G.~Schols, ``Anisotropic conductive adhesives for high density interconnections,'' in {\em Proc. 1st European Conf. on Electron. Packaging Techn.}, pp.~66--68, DVS, 1994. \bibitem{ajt_jvf:94} J.~Vanfleteren, J.~De~Baets, A.~Van~Calster, A.~Dravet, K.~Deckelmann, J.~Wiese, W.~Schmitt, K.~Allaert, P.~Vetter, G.~Schols, and E.~Cort\'es, ``Anisotropic {C}onductive {A}dhesives for high density interconnections in {L}iquid {C}rystal {D}isplays,'' in {\em Proc. of the 1st Int. Conf. on Adhesive Joining Technology in Electronics Manufacturing.}, (Berlin), Nov 1994. \bibitem{cet_mvr:94} M.~Vrana, A.~Van~Calster, D.~Vanick\'y, W.~Delbare, R.~Vanden~Berghe, S.~Demolder, and K.~Allaert, ``Photo-imageable thick films for multichipmodules,'' in {\em International Conference on Electronic Technologies}, (Windsor, England), pp.~41--45, June 1994. \bibitem{sid_avc:94} A.~Van~Calster, A.~M. De~Cubber, J.~De~Baets, H.~De~Smet, and J.~Vanfleteren, ``A simplified 3-step fabrication scheme for high mobility {AMLCD} panels,'' in {\em The 14th Int. Display Research Conf.}, (Monterey, USA), pp.~289--290, SID, October 1994. \bibitem{ecs_jdb:94} J.~De~Baets, A.~Van~Calster, A.~M. De~Cubber, H.~De~Smet, and J.~Vanfleteren, ``Modelling {Poly-CdSe} {TFTs} for {AMLCD},'' in {\em Fall Meeting of the Electrochemical Society, Extended Abstracts}, vol.~94-2, (Miami), pp.~693--694, The Electrochemical Society, October 1994. \bibitem{leo_gdp:94} G.~De~Pestel, W.~Delbare, K.~Allaert, A.~Ambrosy, T.~Qingsheng, J.~Vandewege, J.~Verbeke, and M.~Vrana, ``Multifibre electro-optical modules compatible with the fibre in board technology,'' in {\em LEOS '94 Conference}, (Boston, USA), October 1994. \bibitem{els_jdb:94} J.~De~Baets, A.~Van~Calster, A.~De~Cubber, H.~De~Smet, and J.~Vanfleteren, ``Modelling {Poly-CdSe TFTs} for {AMLCD},'' in {\em Proceedings of the Electrochemical Society}, (Miami, USA), pp.~228--232, October 1994. \bibitem{mem_adc:94} A.~M. De~Cubber and N.~Carchon, ``Active matrix design for projection,'' in {\em Mid European SID AMLCD Meeting}, (Gent), October 1994. \bibitem{sse_mjz:94} M.-J. Zhou and A.~Van~Calster, ``A breakdown voltage model for implanted resurf {p-LDMOS} device n$^{+}$ buried layer,'' {\em Solid-State Electronics}, vol.~37, no.~7, pp.~1383--1385, 1994. \bibitem{oit_rba:94} R.~Baets, P.~Demeester, P.~Van~Daele, L.~Martens, J.~Van~Campenhout, H.~Pauwels, A.~Van~Calster, P.~De~Visschere, I.~Veretenicoff, H.~Thienpont, R.~Vounckx, A.~Barel, A.~Vander~Vorst, and D.~Vanhoenacker, ``Optoelectronic information technology. interuniversity attraction pole 24,'' {\em HF Tijdschrift}, no.~3, pp.~33--42, 1994. \bibitem{mei_mvr:95} M.~Vrana, A.~Van~Calster, D.~Vanick\'y, W.~Delbare, R.~Vanden~Berghe, S.~Demolder, and K.~Allaert, ``Photo-imageable thick films for multichipmodules,'' {\em Microelectronics International}, no.~36, pp.~16--18, 1995. \bibitem{siw_ipo:95} I.~Popov and B.~Tchernorotov, ``{a-SiN:H} thin films for application in diode array {AMLCD's},'' in {\em Proc. of the 4th SID workshop on high informative displays}, (Minsk, Russia), p.~acc., February 1995. \bibitem{cmm_jle:95} J.~Lernout, A.~Van~Calster, M.~Vereeken, and G.~Schols, ``Two-layer silicon hybrids interconnect technology,'' in {\em Proc. of the 4th Int. Conf. on multichip modules}, (Denver, Colorado), pp.~375--380, April 1995. \bibitem{emc_jle:95} J.~Lernout, A.~Van~Calster, M.~Vereeken, and G.~Schols, ``Two-layer silicon hybrid interconnect,'' in {\em Proc. of the 10th European Microelectronics Conference}, (Copenhagen, Denmark), pp.~162--171, May 1995. \bibitem{emc_adr:95} A.~Dravet, S.~S\'echez, A.~Van~Calster, J.~De~Baets, J.~Vanfleteren, K.~Allaert, P.~Vetter, M.~Forrest, G.~Schols, K.~Deckelmann, J.~Wiese, and E.~Cort\'es, ``A new cost-effective {TAB} technology for small and medium volumes,'' in {\em Proc. of the 10th European Microelectronics Conference}, (Copenhagen, Denmark), pp.~547--558, May 1995. \bibitem{emc_mvr:95} M.~Vrana, A.~Van~Calster, R.~Vanden~Berghe, and K.~Allaert, ``Interconnection technology for advanced high density thick films,'' in {\em Proc. of the 10th European Microelectronics Conference}, (Copenhagen, Denmark), pp.~190--198, May 1995. \bibitem{nar_avc:95} A.~Van~Calster, ``Hybrid integrated sensors,'' in {\em NATO Advanced Research Workshop}, (Budapest, Hongary), p.~invited, May 1995. \bibitem{sid_jdb:95} J.~De~Baets, A.~Van~Calster, J.~Van Den~Steen, G.~Van~Doorselaer, D.~Wojciechowski, G.~Schols, and J.~Witters, ``Design of an {x-Si} active matrix for high resolution reflective displays,'' in {\em Proc. of the 15th Int. 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De~Cubber, J.~De~Vos, A.~Van~Calster, and J.~Vanfleteren, ``New model for the characterization and simulation of {TFTs} in all operating regions,'' {\em Journal of the SID}, vol.~3, no.~3, pp.~119--125, 1995. \bibitem{drs_dwo:95} D.~Wojciechowski, A.~Van~Calster, and J.~Witters, ``{Technology-CAD} applied to the development of {DMOS} devices,'' in {\em Proc. of the International Semiconductor Device Research Symposium}, (Charlottesville, Virginia), pp.~785--788, December 1995. \bibitem{flc_bma:95} B.~Maximus, A.~De~Meyere, J.~Capon, E.~De~ley, D.~Corlatan, and H.~Pauwels, ``Optimisation of the design of a discrete cdse-flc oaslm,'' in {\em Book of abstracts FLC 95}, pp.~213--214, 1995. \bibitem{pse_mca:95} M.~Casteleyn, M.~Burgelman, B.~Depuydt, A.~Vervaet, and W.~Vanhelleputte, ``High pressure selenization of {CuInSe2},'' in {\em Proc. of the 13th European Photovoltaic Solar Energy Conference and Exhibition, book of abstracts}, (Nice, France), p.~PO7B.16, October 1995. \bibitem{pec_mca:95} M.~Casteleyn, M.~Burgelman, B.~Depuydt, and A.~Vervaet, ``High pressure selenization of {CuInSe2},'' in {\em Proc. of the 13th European Photovoltaic Energy Conference}, (UK), pp.~1987--1990, October 1995. \bibitem{pse_bdp:95} B.~Depuydt, M.~Burgelman, M.~Casteleyn, and A.~Vervaet, ``The effects of diffusion of impurities from graphite back contacts on {CdTe/CdS} cells,'' in {\em Proc. of the 13th European Photovoltaic Solar Energy Conference and Exhibition, book of abstracts}, (Nice, France), p.~OR3.1, October 1995. \bibitem{pec_bdp:95} B.~Depuydt, M.~Burgelman, M.~Casteleyn, A.~Vervaet, and A.~Niemegiers, ``The effects of diffusion of impurities from graphite back contacts on {CdTe/CdS} cells,'' in {\em Proc. of the 13th European Photovoltaic Energy Conference}, (UK), pp.~593--596, October 1995. \bibitem{ejt_dwo:96} D.~Wojciechowski, A.~Van~Calster, M.~Vrana, J.~De~Baets, and M.~De~Caluw\'e, ``{Flip-chip} technology for chip on glass applications {(LCD)},'' in {\em Proc. of the 2nd European Conf. on Electron. Packaging Techn.}, (Essen, Germany), pp.~47--50, DVS, January 1996. \bibitem{ejt_jvf:96} J.~Vanfleteren, A.~Van~Calster, K.~Sabbe, M.~De~Caluw\'e, A.~Dravet, P.~Kertesz, S.~S\'echer, K.~Deckelmann, J.~Wiese, E.~Cort\'es, M.~Lopez, G.~Schols, K.~Allaert, P.~Vetter, and M.~Forrest, ``Development of an adhesive {TAB} joining technology,'' in {\em Proc. of the 2nd European Conf. on Electron. Packaging Techn.}, (Essen, Germany), pp.~24--26, DVS, January 1996. \bibitem{cpm_gdp:96} G.~De~Pestel, A.~Ambrosy, Q.~Tan, M.~Vrana, F.~Migom, H.~Richter, J.~Vandewege, and P.~Vetter, ``Multichannel optical modules compatiblewith the fiber-in-board technology,'' {\em IEEE Trans. on Components, Packaging and Manufacturing technology}, vol.~B-19, no.~1, pp.~116--123, 1996. \bibitem{cmm_jle:96} J.~Lernout, A.~Van~Calster, and G.~Schols, ``On the effective integration of resistors and capacitors into a {MCM-S}i design,'' in {\em Proc. of the 1996 International Conference on Multichip Modules}, (Denver, Colorado), pp.~391--396, ISHM, April 1996. \bibitem{sid_adr:96} A.~Dravet, P.~Kertesz, S.~S\'echez, A.~Van~Calster, J.~Vanfleteren, M.~De~Caluw\'e, K.~Deckelmann, J.~Wiese, Cortes, M.~Lopez, G.~Schols, K.~Allaert, P.~Vetter, and M.~Forrest, ``A low-cost {TAB} interconnection technology for {LCD} drivers,'' in {\em Digest of technical papers}, (San Diego, California), pp.~925--928, SID, May 1996. \bibitem{sid_mvr:96} M.~Vrana, J.~De~Baets, A.~Van~Calster, D.~Wojciechowski, A.~Ostmann, and H.~Reichl, ``An anisotropic adhesive flip-chip technology for lcd drivers,'' in {\em Digest of technical papers}, (San Diego, California), pp.~929--932, SID, May 1996. \bibitem{jsi_gdp:96} G.~De~Pestel, A.~Ambrosy, Q.~Tan, M.~Vrana, F.~Migom, H.~Richter, J.~Vandewege, and P.~Vetter, ``Parallel optical interconnections for future broad band systems based on the fiber-in-board technology,'' in {\em Proc. of the 46th Electronic Components Technology Conference ({ECTC'96})}, (Orlando, Florida), pp.~264--268, May 1996. \bibitem{sid_ipo:96} I.~Popov, A.~Van~Calster, H.~De~Smet, E.~Boesman, and F.~Callens, ``2{D} direct {X}-ray sensor array on the base of {S}i{N}:{H} thin films,'' in {\em Proc. of the 16th Int. Display Research Conf.}, (Birmingham, England), pp.~431--433, SID, October 1996. \bibitem{ecs_nca:96} N.~Carchon, G.~Van~Doorselaer, A.~M. De~Cubber, J.~De~Baets, A.~Van~Calster, P.~Candry, and J.~Bruggeman, ``A poly-{C}d{S}e active matrix for {PNLC} projection displays,'' in {\em Proc. of the 3rd symposium on thin film transistor technologies} (Y.~Kuo, ed.), vol.~96-2, (Pennington, New Jersey), pp.~366--374, The Electrochemical Society, Electrochemical Publications, October 1996. \bibitem{ecs_can:96} N.~Carchon, G.~Van~Doorselaer, A.~M. De~Cubber, J.~De~Baets, A.~Van~Calster, P.~Candry, and J.~Bruggeman, ``A poly-{C}d{S}e active matrix for {PNLC} projection displays,'' in {\em Book of abstract of the 3rd symposium on thin film transistor technologies}, vol.~2, p.~649, The Electrochemical Society, October 1996. \bibitem{ase_rba:96} R.~Baets, B.~Dhoedt, J.~Blondelle, H.~De~Neve, F.~Fredricx, L.~Vanwassenhove, P.~Demeester, I.~Moerman, P.~Van~Daele, G.~Borghs, J.~Lernout, J.~Van~Campenhout, A.~Van~Calster, H.~Thienpont, I.~Veretennicoff, and R.~Vounckx, ``Micro-cavity {LED}'s and their application in optical interconnect research within the {IUAP-24} project (invited paper),'' in {\em Proc. of the Annual Symposium of the IEEE/LEOS Benelux Chapter}, (Enschede, Nederland), pp.~4--10, November 1996. \bibitem{hci_mvr:96} M.~Vrana, A.~Van~Calster, R.~Van~den Berghe, and K.~Allaert, ``Interconnection technology for advanced high density thick films,'' {\em Microelectronics International (Hybrid Circuits)}, no.~41, pp.~5--8, 1996. \bibitem{edl_adc:96} A.~M. De~Cubber, H.~De~Smet, J.~De~Vos, N.~Carchon, and A.~Van~Calster, ``Complementary high-voltage technology based on n-type {CdSe:In} and p-type {Ge:Cu} thin-film transistor,'' {\em IEEE Electron Device Lett.}, vol.~EDL-17, no.~12, pp.~581--583, 1996. \bibitem{fer_bma:96} B.~Maximus, A.~De~Meyere, J.~Capon, E.~De~Ley, D.~Corlatan, and H.~Pauwels, ``Optimisation of the design of a discrete cdse-flc oaslm,'' {\em Ferroelectrics}, vol.~181, pp.~111--120, 1996. \bibitem{ing_mig:97} M.~Vermandel, ``De warmtebeeldgenerator als visuele prothese voor blinden,'' {\em Het Ingenieursblad}, vol.~EDL-17, no.~3, pp.~52--59, 1997. \bibitem{pcb_szh:97} S.~Zhang, M.~Vereecken, J.~De~Baets, A.~Van~Calster, A.~Vervaet, J.~Peeters, and K.~Allaert, ``Electroless nickel-gold stud bumping on laminate for flip-chip assembly,'' in {\em Proc. of the Printed Circuit Board Technology, Reliability and Microintegration Session}, (Berlin, Germany), January 1997. \bibitem{emc_jle:97} J.~Lernout, J.~Vanfleteren, A.~Van~Calster, and G.~Schols, ``A five layer thin film {MCM-Si} design using oxynitride dielectrics,'' in {\em Proc. of the 11th European Microelectronics Conference}, (Venice, Italy), pp.~637--640, May 1997. \bibitem{wep_jle:97} J.~Lernout, J.~Vanfleteren, A.~Van~Calster, and G.~Schols, ``A five layer thin film {MCM-Si} design using oxynitride dielectrics,'' in {\em Abstract Book of {IMAPS/NATO} Advanced Research Workshop on Electronic Packaging for High Reliability, Low Cost Electronics}, (Bled, Slovenia), May 1997. \bibitem{emc_mvr:97} M.~Vrana, J.~De~Baets, A.~Van~Calster, and B.~Allaert, ``Flip-chip assembly for chips with gold bumps on high density thick film substrates,'' in {\em Proc. of the 11th European Microelectronics Conference}, (Venice, Italy), pp.~175--182, May 1997. \bibitem{emc_lvh:97} L.~Vanwassenhove, L.~Haelvoet, L.~Martens, P.~Van~Daele, A.~Van~Calster, and J.~Vandewege, ``Low-cost fibre-chip coupling for electro-optic {EMC}-probes,'' in {\em Proc. of the 11th European Microelectronics Conference}, (Venice, Italy), pp.~148--155, May 1997. \bibitem{emc_ere:97} E.~Reese and J.~Vanfleteren, ``Fine pitch interconnection using anisotropic conductive adhesives,'' in {\em Proc. of the 11th European Microelectronics Conference}, (Venice, Italy), pp.~457--464, May 1997. \bibitem{erm_vds:97} J.~Van~den Steen, G.~Van~Doorselaer, J.~De~Baets, and A.~Van~Calster, ``Custom design and system integration,'' in {\em Proc. of the 20th International Spring Seminar on Electronic Technology, Education and Research in Microelectronics} (M.~Lukaszewicz and M.~Kramkowska, eds.), (Szklarska Poreba, Poland), pp.~263--266, June 1997. \bibitem{ess_mve:97} M.~Vermandel, C.~De~Backere, and A.~Van~Calster, ``A high voltage {nDMOS} structure in a standard sub-micron {CMOS} process,'' in {\em Proc. of the 27th European Solid-State Device Research Conference} (H.~Grunbacher, ed.), (Stuttgart, Germany), pp.~508--511, ESSDERC, Editions Frontieres, September 1997. \bibitem{sid_jdv:97} J.~De~Vos, H.~De~Smet, and A.~Van~Calster, ``High voltage {EL} drivers integrated on glass,'' in {\em Proc. of the 1997 International Display Research Conference}, (Toronto, Canada), pp.~366--369, SID, September 1997. \bibitem{sid_vds:97} J.~Van~den Steen, N.~Carchon, G.~Van~Doorselaer, C.~De~Backere, J.~De~Baets, H.~De~Smet, J.~De~Vos, J.~Lernout, J.~Vanfleteren, and A.~Van~Calster, ``Technology and circuit aspects of reflective {PNLC} microdisplays,'' in {\em Proc. of the 1997 International Display Research Conference}, (Toronto, Canada), pp.~195--198, SID, September 1997. \bibitem{arr_avc:97} A.~Van~Calster, ``Microdisplays and interconnection technologies for telecommunication systems,'' in {\em IMEC, Annual Research Review Meeting}, (Leuven, Belgium), pp.~20--21, IMEC, November 1997. \bibitem{arr_pvd:97} P.~Van~Daele and A.~Van~Calster, ``Flip-chip and interconnection technology,'' in {\em IMEC, Annual Research Review Meeting}, (Leuven, Belgium), p.~39, IMEC, November 1997. \bibitem{sid_ipo:98} I.~A. Popov, G.~Van~Doorselaer, A.~Van~Calster, H.~De~Smet, F.~Callens, and E.~Boesman, ``Prototype of {2D} direct {X-ray} {a-SiN:H} sensor array,'' in {\em Proc. of the Photonics West'98 Electronic Imaging}, (Anaheim, USA), pp.~126--130, SPIE, January 1998. \bibitem{hci_lva:98} L.~Vanwassenhove, K.~Haelvoet, L.~Martens, P.~Van~Daele, A.~Van~Calster, and J.~Vandewege, ``Low-cost fibre-chip coupling for electro-optic {EMC}-probes,'' {\em Microelectronics International (Hybrid Circuits)}, vol.~15, no.~1, pp.~32--34, 1998. \bibitem{hci_jle:98} J.~Lernout, J.~Vanfleteren, A.~Van~Calster, and G.~Schols, ``A five-layer thin film {MCM-Si} design using oxynitride dielectrics,'' {\em Microelectronics International (Hybrid Circuits)}, vol.~15, no.~1, pp.~39--42, 1998. \bibitem{cpd_mre:98} M.~R\'eczey, R.~Dobay, G.~Harsanyi, Z.~Illyefalvi-Vit\'ez, J.~Van~den Steen, A.~Vervaet, W.~Reinert, J.~Urbancik, A.~Guljajev, C.~Visy, and I.~Barsony, ``{ASIC} chip, hybrid multisensor, and package co-design for smart gas monitoring module,'' in {\em Proc. of the International Workshop on Chip Package Co-Design}, (Zurich, Switzerland), pp.~132--139, IEEE, March 1998. \bibitem{mrs_ipo:98} I.~A. Popov, G.~Van~Doorselaer, A.~Van~Calster, H.~De~Smet, F.~Callens, and E.~Boesman, ``Material aspects of a {a-SiN:H} based {2D} direct {X-ray} sensor array,'' in {\em Proc. of the 1998 Material research Society}, (San francisco, USA), pp.~231--236, ?, April 1998. \bibitem{ima_jvf:98} J.~Vanfleteren, ``Flip chip attachment using adhesives,'' in {\em Proc. of the IMAPS-Benelux Spring Event 98}, (Leuven, Belgium), pp.~?--?, IMAPS, April 1998. \bibitem{ejt_mvr:98} M.~Vrana, J.~De~Baets, A.~Van~Calster, , I.~Born, and D.~Detemmermann, ``Low cost high density multlayer interconnection technology,'' in {\em Proc. of the 3rd European Conf. on Electron. Packaging Techn.}, (Nuremberg, Germany), pp.~129--133, DVS, June 1998. \bibitem{ejt_jle:98} J.~Lernout, J.~Vanfleteren, A.~Van~Calster, L.~Vanwassenhove, and P.~Vandaele, ``Design and fabrication of a two layer thin film interconnection sytem on glass for use in a parallel free-space optical interconnection demonstrator,'' in {\em Proc. of the 3rd European Conf. on Electron. Packaging Techn.}, (Nuremberg, Germany), pp.~7--9, DVS, June 1998. \bibitem{ejt_szh:98} S.~Zhang, M.~Vereeken, , J.~De~Baets, A.~Van~Calster, J.~Peeters, and K.~Allaert, ``The realisation of photo-via technology using multipost as a photo imageable dielectric,'' in {\em Proc. of the 3rd European Conf. on Electron. Packaging Techn.}, (Nuremberg, Germany), pp.~62--65, DVS, June 1998. \bibitem{oco_avc:98} A.~Van~Calster and P.~Vandaele, ``Technological aspects of optoelectronic array devices for free space optical systems,'' in {\em Proc. of Optics in Computing}, (Brugge, Belgium), pp.~506--509, EOS, SPIE, June 1998. \bibitem{ess_mve:98} M.~Vermandel, C.~De~Backere, A.~Van~Calster, J.~Witters, and M.~Tack, ``A high voltage p-type drain extended {MOS} in a low voltage sub-micron {CMOS} technology,'' in {\em Proc. of the 28th European Solid-State Device Research Conference}, (Bordeaux, France), pp.~492--495, ESSDERC, September 1998. \bibitem{icp_gvd:98} G.~Van~Doorselaer, N.~Carchon, J.~Van~den Steen, D.~Cuypers, J.~Vanfleteren, H.~De~Smet, and A.~Van~Calster, ``A reflective polymer dispersed information display made on {CMOS},'' in {\em Proc. of the ICPS}, (Antwerpen, Belgium), pp.~222--225, September 1998. \bibitem{icp_ipo:98} I.~Popov, G.~Van~Doorselaer, A.~Van~Calster, H.~De~Smet, F.~Callens, and E.~Boesman, ``{A-SiN:H TFD} sensor array for digital radiography,'' in {\em Proc. of the ICPS}, (Antwerpen, Belgium), pp.~315--319, September 1998. \bibitem{sid_gvd:98} G.~Van~Doorselaer, N.~Carchon, J.~Van~den Steen, J.~Vanfleteren, H.~De~Smet, D.~Cuypers, and A.~Van~Calster, ``Characterization of a paper-white reflective {PDLC} microdisplay for portable {IT} applications,'' in {\em Proc. of the 1998 International Display Research Conference}, (Seoul, Korea), pp.~55--58, SID, September 1998. \bibitem{sid_cdb:98} C.~De~Backere, M.~Vermandel, and V.~C. A, ``Light shielding with liquid crystal on silicon displays,'' in {\em Proc. of the 1998 International Display Research Conference}, (Seoul, Korea), pp.~415--418, SID, September 1998. \bibitem{ima_dwo:98} D.~Wojciechowski, J.~Vanfleteren, E.~Reese, and H.~Hagedorn, ``New adhesives for high density flip-chip interconnections,'' in {\em Proc. of the IMAPS'98}, (San Diego, USA), pp.~224--229, IMAPS, November 1998. \bibitem{ima_hdp:98} H.~De~Pauw, H.~De~Smet, J.~Vanfleteren, and A.~Van~Calster, ``Multilayer motherboard technology in {MCM-Si} with opto-electronic features,'' in {\em Proc. of the IMAPS'98}, (San Diego, USA), pp.~347--352, IMAPS, November 1998. \bibitem{ima_gvd:98} G.~Van~Doorselaer, B.~Dobbelaere, M.~Vrana, X.~Xie, N.~Carchon, J.~Van~den Steen, J.~Vanfleteren, H.~De~Smet, D.~Cuypers, and A.~Van~Calster, ``A paper-white chip-based display {MCM} package for portable {IT} products,'' in {\em Proc. of the IMAPS'98}, (San Diego, USA), pp.~543--547, IMAPS, November 1998. \bibitem{ima_mvr:98} M.~Vrana, J.~De~Baets, A.~Van~Calster, I.~Born, and D.~Detemmerman, ``High density thick film multilayers with {Ag}-based conductors,'' in {\em Proc. of the IMAPS'98}, (San Diego, USA), pp.~789--794, IMAPS, November 1998. \bibitem{ima_szh:98} S.~Zhang, M.~Vereeken, J.~De~Baets, and A.~Van~Calster, ``The fabrication and reliability of a photovia test vehicle for {MCM-L} applications,'' in {\em Proc. of the IMAPS'98}, (San Diego, USA), pp.~53--58, IMAPS, November 1998. \bibitem{ecs_jdv:98} J.~De~Vos, S.~Stoukatch, H.~De~Pauw, H.~De~Smet, I.~Popov, J.~Vanfleteren, and A.~Van~Calster, ``Active matrix vacuum fluorescent display with {CdSe:In TFTS},'' in {\em Proc. of the 194th meeting of the Electrochemical Society}, (Boston, USA), pp.~?--?, The Electrochemical Society, November 1998. \bibitem{aec_jdv:98} J.~De~Vos, S.~Stoukatch, H.~De~Pauw, H.~De~Smet, I.~Popov, J.~Vanfleteren, and A.~Van~Calster, ``Active matrix vacuum fluorescent display with {CdSe:In TFTS},'' in {\em Meeting abstracts of the 194th meeting of the Electrochemical Society}, vol.~98--2, (Boston, USA), p.~716, The Electrochemical Society, November 1998. \bibitem{noi_ipo:98} I.~Popov, G.~Van~Doorselaer, A.~Van~Calster, H.~De~Smet, F.~Callens, and E.~Boesman, ``{a-SiN:H} thin films for x-ray sensor array,'' in {\em Proc. of international seminar: Noise and degradation processes in semiconductor devices}, (Moscou), pp.~123--129, November 1998. \bibitem{idw_avc:98} A.~Van~Calster, ``Microdisplays for portable {IT} products and projection applications,'' in {\em Proc. of the fifth international display workshops}, (Kobe, Japan), pp.~135--138, IDW, December 1998. \bibitem{eim_avc:99} A.~Van~Calster, ``Design and fabrication of high-resolution light valves with silicon backplanes,'' in {\em Proc. of the 11th international symposium on Electronic Imaging}, (San Jose, USA), pp.~?--?, SPIE, January 1999. \bibitem{eim_gvd:99} G.~Van~Doorselaer, N.~Carchon, J.~Van~den Steen, J.~Vanfleteren, H.~De~Smet, D.~Cuypers, and A.~Van~Calster, ``A silicon based reflective polymer dispersed {LC} display for portable low power applications,'' in {\em Proc. of the 11th international symposium on Electronic Imaging}, (San Jose, USA), pp.~95--102, SPIE, January 1999. \bibitem{vsu_avc:99} H.~De~Smet and A.~Van~Calster, ``Microdisplays,'' in {\em Proc. of the 11th Symposium and Seminar on Displays and Display Technology (VISU 99)}, (Grenoble, France), Le Club Visu (SID France), January 1999. \bibitem{vsu_hds:99} H.~De~Smet, ``Liquid crystal displays on monocrystalline silicon,'' in {\em Proc. of the 11th Symposium and Seminar on Displays and Display Technology (VISU 99)}, (Grenoble, France), Le Club Visu (SID France), January 1999. \bibitem{ssc_jdv:99} J.~De~Vos, H.~De~Smet, A.~De~Cubber, and A.~Van~Calster, ``High voltage {CdSe-Ge TFT} driver circuits for passive {AC-TFEL} displays,'' {\em IEEE J. Solid-State Circuits}, vol.~34, no.~2, pp.~228--232, 1999. \bibitem{cmm_ziv:99} Z.~Illyefalvi-Vit\'ez, A.~Vervaet, A.~Van~Calster, N.~Sinnadurai, M.~Hrovat, P.~Svasta, E.~Toth, D.~Belavic, R.~M. Ionescu, and W.~Dennehy, ``Low cost prototyping of multichip modules,'' in {\em Proc. of the fifth European Conference on MultiChip Modules}, (London, UK), pp.~35--47, IMAPS-UK, February 1999. \bibitem{cmm_ivb:99} I.~Born, D.~Detemmerman, J.~De~Baets, and A.~Van~Calster, ``Low cost high-density multilayer circuits for {MCM-C},'' in {\em Proc. of the fifth European Conference on MultiChip Modules}, (London, UK), pp.~21--26, IMAPS-UK, February 1999. \bibitem{hci_ziv:99} Z.~Illyefalvi-Vit\'ez, A.~Vervaet, A.~Van~Calster, N.~Sinnadurai, M.~Hrovat, P.~Svasta, E.~Toth, D.~Belavic, R.~M. Ionescu, and W.~Dennehy, ``Low cost prototyping of multichip modules -- the european {INCO-Copernicus} project,'' {\em Microelectronics International (Hybrid Circuits)}, vol.~16, no.~2, pp.~13--19, 1999. \bibitem{sen_har:99} G.~Harsanyi, M.~R\'eczey, R.~Dobay, I.~Leps\'enyi, Z.~Illyefalvi-Vit\'ez, J.~Van~den Steen, A.~Vervaet, W.~Reinert, J.~Urbancik, A.~Guljajev, C.~Visy, G.~Inzelt, and I.~Barsony, ``Combining inorganic and organic sensors elements: a new approach for multi- component sensing,'' {\em Sensor Review}, vol.~19, no.~2, pp.~128--134, 1999. \bibitem{hci_ivb:99} I.~Born, D.~Detemmerman, J.~De~Baets, and A.~Van~Calster, ``Low cost high-density multilayer circuits for {MCM-C},'' {\em Microelectronics International (Hybrid Circuits)}, vol.~16, no.~2, pp.~55--58, 1999. \bibitem{jme_ill:99} Z.~Illyefalvi-Vitez, A.~Vervaet, A.~Van~Calster, N.~Sinnadurai, M.~Hrovat, P.~Svasta, E.~Toth, D.~Belavic, R.~Ionescu, and W.~Dennehy, ``Cheap multichip modules,'' {\em Journal of Microelectronics, Electronic Components and Materials}, vol.~29, no.~2, pp.~71--78, 1999. \bibitem{mic_szh:99} S.~Zhang, J.~De~Baets, and A.~Van~Calster, ``A new approach to flip chip on board technology using smt compatible processes,'' {\em Microelectronics International}, vol.~16, no.~3, pp.~39--42, 1999. \bibitem{mpr_mig:99} M.~Vermandel and A.~Van~Calster, ``Implementation of the {HV} natural {DEMOS} in a sub-um {CMOS} technology,'' in {\em Proc. of MIPRO}, (Optatija), pp.~9--12, May 1999. \bibitem{ima_jvf:99} J.~Vanfleteren, J.~De~Baets, A.~Van~Calster, G.~Schols, N.~Pergoot, E.~Jarvinen, and A.~Aintila, ``Design, fabrication and bumping of test chips for development of fine pitch flip-chip technologies,'' in {\em Proc. of the 12th European Microelectronics and Packaging Conference}, (Harrogate, England), pp.~399--404, IMAPS-Europe, June 1999. \bibitem{ima_rec:99} M.~R\'eczey, I.~Leps\'enyi, A.~Reichardt, G.~Harsanyi, R.~Dobay, A.~Schon, Z.~Illyefalvi-Vit\'ez, J.~Van~den Steen, A.~Vervaet, W.~Reinert, J.~Urbancik, A.~Guljajev, C.~Visy, G.~Inzelt, and I.~Barsony, ``Combining inorganic and organic gas sensor elements: a new approach for multicomponent sensing,'' in {\em Proc. of the 12th European Microelectronics and Packaging Conference}, (Harrogate, England), pp.~189--195, IMAPS-Europe, June 1999. \bibitem{ima_szh:99} S.~Zhang, J.~De~Baets, and A.~Van~Calster, ``A new approach of flip chip on board technology using {SMT} compatible processes,'' in {\em Proc. of the 12th European Microelectronics and Packaging Conference}, (Harrogate, England), pp.~111--117, IMAPS-Europe, June 1999. \bibitem{mid_hpa:99} H.~Pauwels and H.~De~Smet, ``Addressing of liquid crystal displays,'' in {\em Proc. of the 6th International Conference on Mixed Design}, (Krakow, Poland), pp.~21--26, June 1999. \bibitem{ecs_szh:99} S.~Zhang, J.~De~Baets, M.~Vereeken, A.~Vervaet, and A.~Van~Calster, ``Stabilizer concentration and local environment: Their effects on electroless nickel plating of pcb micropads,'' {\em Journal of The Electrochemical Society}, vol.~146, no.~8, pp.~2870--2875, 1999. \bibitem{sid_hds:99} H.~De~Smet, J.~Van~den Steen, N.~Carchon, D.~Cuypers, C.~De~Backere, M.~Vermandel, A.~Van~Calster, A.~De~Caussemaeker, A.~Witvrouw, H.~Ziad, K.~Baert, P.~Colson, G.~Schols, and M.~Tack, ``The design and fabrication of a {2560x2048} pixel microdisplay chip,'' in {\em Proc. of the 19th International Display Research Conference (EuroDisplay99)}, (Berlin, Germany), pp.~493--496, SID, September 1999. \bibitem{sdr_cdb:99} C.~De~Backere, M.~Vermandel, J.~Van~den Steen, H.~De~Smet, and A.~Van~Calster, ``A silicon backplane technology for microdisplays,'' in {\em Proceedings of the 29th European Solid-State Device Research Conference ESSDERC`99}, pp.~712--715, 1999. \bibitem{ima_hdp:99} H.~De~Pauw, J.~Vanfleteren, H.~De~Smet, S.~Zhang, and A.~Van~Calster, ``A hybrid thin-film laser driver module for {RF} frequency with a full-custom {C07} analog driver amplifier,'' in {\em Proc. of the IMAPS'99}, (Chicago, USA), pp.~195--200, IMAPS, October 1999. \bibitem{ima_sui:99} S.~Zhang, J.~De~Baets, A.~Van~Calster, D.~Corlatan, P.~De~Langhe, and K.~Allaert, ``Photovia technology: Some important aspects for reliability,'' in {\em Proc. of the IMAPS'99}, (Chicago, USA), pp.~240--245, IMAPS, October 1999. \bibitem{ima_har:99} G.~Harsanyi, I.~Leps\'enyi, A.~Reichardt, R.~R\'eczey, M an~Dobay, A.~Schon, Z.~Illyefalvi-Vit\'ez, J.~Van~den Steen, A.~Vervaet, W.~Reinert, J.~Urbancik, L.~L, A.~Petrikova, A.~Guljajev, C.~Visy, G.~Inzelt, and I.~Barsony, ``New perspectives of selective gas sensing: Combining electroconducting polymers with thick and thin films,'' in {\em Proc. of the IMAPS'99}, (Chicago, USA), pp.~207--212, IMAPS, October 1999. \bibitem{ele_dba:99} D.~Baert and A.~Vervaet, ``Lead-acid battery model for the derivation of peukert's law,'' {\em Electrochimica Acta}, no.~44, pp.~3491--3504, 1999. \bibitem{icm_jdo:99} J.~Doutreloigne, H.~De~Smet, J.~Van~den Steen, and G.~Van~Doorselaer, ``Low-power high-voltage {CMOS} level-shifters for liquid crystal display drivers,'' in {\em Proc. of the 11th International Conference on Microelectronics}, (State of Kuwait), pp.~213--216, November 1999. \bibitem{idw_jvs:99} J.~Van~den Steen, H.~De~Smet, G.~Van~Doorselaer, A.~Van~Calster, and Colson, ``Cost effective reticule design for very high resolution {Si} backplane prototypes,'' in {\em Proc. of IDW}, (Sendai, Japan), pp.~235--238, ITE, December 1999. \bibitem{noi_gul:99} A.~Guljaev, I.~Warlashov, O.~Muchina, I.~Miroshnikova, O.~Sarach, A.~Titov, J.~Van~den Steen, A.~Vervaet, M.~Reczey, R.~Dobay, G.~Horsanyi, Z.~Illjefalvi-Vitez, J.~Urbanchik, and W.~Reinert, ``Sigma sensors intellectual gas monitoring applications,'' in {\em Proc. of the XXX international seminar: Noise and degradation processes in semiconductor devices}, (Moscou), pp.~402--407, November-December 1999. \bibitem{chi_ave:99} A.~Vervaet, A.~Comhaire, and E.~Messens, ``Le professeur arend j. rutgers (1903-1998),'' {\em Chimie Nouvelle}, vol.~17, no.~68, pp.~3024--3027, 1999. \bibitem{elp_jol:99} J.~Lernout, J.~Vanfleteren, A.~Van~Calster, and G.~Schols, ``A five layer thin film {MCM-Si} design using oxynitride dielectrics,'' in {\em Electronic Packaging for High Reliability; Low Cost Electronics}, (Kluwer Academic publishers, {NATO ASI} Series, {ISBN} {0-7923-5218-1}), pp.~179--186, (Tummala, Kosec, Jones, Belavic editors), Vol 57 1999. \bibitem{eim_avc:00} A.~Van~Calster and D.~Cuypers, ``Reflective vertically aligned nematic liquid crystal microdisplays for projection applications (invited paper),'' in {\em Proc. of the 2000 international symposium on Electronic Imaging Vol. 3954: Prction Displays 2000: Sixth in a Series}, (San Jose, USA), pp.~112--119, SPIE, January 2000. \bibitem{sid_dcu:00} D.~Cuypers, ``Vertically aligned nematic liquid crystal displays for projection purposes,'' in {\em Proc. of the Spring '00 meeting of the SID-ME-Chapter meeting}, (Balzers (Liechtenstein)), SID, March 2000. \bibitem{mic_hdp:00} H.~De~Pauw, H.~De~Smet, J.~Vanfleteren, J.~Lernout, and A.~Van~Calster, ``Extension of a multilayer interconnection technology in {MCM-Si} with opto-electronic facilities,'' {\em Microelectronics Reliability}, vol.~40, pp.~163--170, 2000. \bibitem{mrs_ipo:00} I.~Popov, G.~Van~Doorselaer, A.~Van~Calster, H.~De~Smet, J.~De~Baets, F.~Callens, and E.~Boesman, ``{a-SiN:H} thin film diode for digital radiograhph,'' in {\em Proc. of the 2000 Material Research Society}, (San francisco, USA), pp.~A12.9.1--A12.9.5, April 2000. \bibitem{hdi_hdp:00} H.~De~Pauw, J.~Vanfleteren, H.~De~Smet, S.~Zhang, and A.~Van~Calster, ``An {MCM-D} laser driver hybrid with {RF} amplifier chip, combining advanced {FC} assembly and novel single chip bumping technology,'' in {\em Proc. of the International Conference on High-Density Interconnect and Systems Packaging}, (Denver), pp.~557--562, April 2000. \bibitem{sia_ipo:00} I.~Popov, A.~Van~Calster, J.~De~Baets, and H.~De~Pauw, ``Implementation of the sytem of experiment design and taboo search into {SiON} thin film technology,'' in {\em Book of abstracts of the third SIAM Conference on Mathematical Aspects of Materials Science}, (Philadelphia, Pennsylvania), p.~44, May 2000. \bibitem{chi_mig:00} M.~Vermandel, J.~Doutreloigne, P.~Moens, and M.~Tack, ``Calibration during the {TCAD} development of a high voltage {pDEMOS} in a sub um {CMOS} technology,'' in {\em Proceedings of {CHIPPS}}, (Wandlitz, Germany), pp.~3--4, May 2000. \bibitem{ise_jvf:00} J.~Vanfleteren, A.~Vervaet, and A.~Van~Calster, ``Highlights of the {DACTEL} project: Development of adhesive flip-chip technologies for dedicated electronic applications,'' in {\em Proc. of the 23rd International Spring Seminar on Electronics Technology}, (Balatonfured, Hungary), pp.~315--318, May 2000. \bibitem{ima_jdb:00} J.~De~Baets, M.~Vereeken, A.~Van~Calster, D.~Corlatan, E.~Raedschelders, P.~De~Langhe, G.~Patra, M.~Morrell, C.~Haley, G.~Schols, A.~Ostmann, and D.~Mathelin, ``{HIPERPRINT}: A board technology for high-frequency applications,'' in {\em Proceedings of the European Microelectronics Packaging and Interconnection Symposium}, (Prague, Czech Republic), pp.~326--332, June 2000. \bibitem{ima_jvf:00} J.~Vanfleteren, S.~Stoukatch, B.~Vandecasteele, A.~Van~Calster, S.~Criel, G.~Willems, P.~De~Langhe, L.~Vandam, and K.~Allaert, ``Mixed assembly on {PCB} using a novel flip-chip technology,'' in {\em Proceedings of the European Microelectronics Packaging and Interconnection Symposium}, (Prague, Czech Republic), pp.~65--70, June 2000. \bibitem{ima_ser:00} S.~Stoukatch, S.~Zhang, J.~Vanfleteren, M.~Vereeken, A.~Van~Calster, and B.~Vandecasteele, ``Electroless ni plating bath composition and replenishment for microvia plating process,'' in {\em Proceedings of the European Microelectronics Packaging and Interconnection Symposium}, (Prague, Czech Republic), pp.~447--452, June 2000. \bibitem{spi_pco:00} P.~Colson, F.~De~Pestel, M.~Tack, G.~Schols, H.~De~Smet, J.~Van~den Steen, and A.~Van~Calster, ``The design and fabrication of a {GXGA} microdisplay chip,'' in {\em Proceedings of {SPIE} on Micromachining, Micromanufacturing and Microelectronic Manufacturing, Vol.4181}, (Santa Clara, California), pp.~315--323, September 2000. \bibitem{idr_jdo:00} J.~Doutreloigne, H.~De~Smet, and A.~Van~Calster, ``A new architecture for monolithic low-power high voltage display drivers,'' in {\em Proceedings of the 20th International Display Research Conference (IDRC)}, (Palm Beach, Florida), pp.~115--118, September 2000. \bibitem{idr_fbr:00} F.~Bruyneel, H.~De~Smet, J.~Vanfleteren, and A.~Van~Calster, ``Characteristics of {PNLC} in reflective displays,'' in {\em Proceedings of the 20th International Display Research Conference (IDRC)}, (Palm Beach, Florida), pp.~217--220, September 2000. \bibitem{idr_gvd:00} G.~Van~Doorselaer, J.~Van~den Steen, H.~De~Smet, D.~Cuypers, and A.~Van~Calster, ``Flicker reduction in {AMLC} displays by individual pixel voltage correction,'' in {\em Proceedings of the 20th International Display Research Conference (IDRC)}, (Palm Beach, Florida), pp.~447--450, September 2000. \bibitem{ess_mig:00} M.~Vermandel, J.~Doutreloigne, P.~Moens, and M.~Tack, ``Using the self aligned field implant to design high voltage devices in sub-um {CMOS} technologies,'' in {\em Proceedings of ESSDRC}, (Cork), pp.~228--231, September 2000. \bibitem{ami_jvf:00} J.~Vanfleteren, S.~Stoukatch, B.~Vandecasteele, A.~Van~Calster, S.~Criel, G.~Willems, P.~De~Langhe, L.~Vandam, and K.~Allaert, ``Mixed assembly on {PCB} using a novel flip-chip technology,'' {\em Advancing Microelectronics}, vol.~27, no.~5, pp.~28--30, 2000. \bibitem{ecs_avc:00} A.~Van~Calster, ``Analog addressed microdisplays (invited),'' in {\em Proceedings of the 198th Meeting of the Electrochemical Society}, (Phoenix, Arizona), pp.~295--302, October 2000. \bibitem{idw_avc:00} A.~Van~Calster, ``Miniaturized reflective displays (invited),'' in {\em Proceedings of the 7th International Display Workshops (IDW'00)}, (Kobe, Japan), pp.~179--182, November 2000. \bibitem{idw_fbr:00} F.~Bruyneel, H.~De~Smet, A.~Van~Calster, and J.~Egelhaaf, ``Measurement and evaluation of the applicability of reflective displays for direct applications,'' in {\em Proceedings of the 7th International Display Workshops (IDW'00)}, (Kobe, Japan), pp.~45--48, November 2000. \bibitem{spd_pmo:00} P.~Moens, M.~Tack, H.~Van~Hove, M.~Vermandel, and D.~Bolognesi, ``Development of an optimised {40V pDMOS} device by use of a {TCAD} design of experiment methodology,'' in {\em International conference on simulation of Semiconductor Processes and Device, SISPAD2000}, pp.~276--279, 2000. \bibitem{chm_ave:01} A.~Vervaet, A.~Comhaire, and E.~Messens, ``Prof. dr. arend j. rutgers (1903-1998,'' {\em Chemie Magazine}, vol.~27, no.~6, pp.~39--44, 2001. \bibitem{cas_can:01} C.~Anghel, N.~Heyfyene, A.~Ionescu, M.~Vermandel, B.~Bakeroot, J.~Doutreloigne, R.~Gillon, S.~Frere, C.~Maier, and Y.~Mourier, ``Physical modelling strategy for (quasi) saturation effects in lateral dmos transistors based on the concept of intrinsic drain voltage,'' in {\em Proceedings of the International Semiconductor Conference CAS2001}, (Sinaia, Romania), pp.~417--420, 2001. \bibitem{apx_jdb:01} S.~Harris, G.~Patra, S.~Mainwaring, G.~Schols, D.~Mathelin, D.~Corlatan, E.~Raedschelders, P.~De~Langhe, J.~De~Baets, M.~Vereeken, A.~Van~Calster, M.~Morrell, C.~Haley, and A.~Ostman, ``Standard {SMT} process for flip-chip assembly on {FR4} substrate,'' in {\em Proceedings of the Electronics Assembly Process exhibition conference (APEX)}, (San Diego, USA), pp.~1--13, January 2001. \bibitem{isc_jdo:01} J.~Doutreloigne, H.~De~Smet, and A.~Van~Calster, ``A versatile {micro-power} {high-voltage} flat panel display driver,'' in {\em Proceedings of the IEEE International Solid-State Circuits Conference (ISSCC)}, (San Francisco, USA), pp.~254--255, February 2001. \bibitem{msm_bba:01} B.~Bakeroot, P.~Moens, M.~Vermandel, and J.~Doutreloigne, ``Using adaptive resurf technique and field plate working to improve the safe operating area of {n-type} drain extended {MOS} transistors,'' in {\em Proceedings of MSM 2001}, (South Carolina, USA), pp.~498--501, March 2001. \bibitem{ope_fbr:01} F.~Bruyneel, H.~De~Smet, J.~Vanfleteren, and A.~Van~Calster, ``Method for measuring the cell gap in liquid crystal displays,'' {\em Optical Engineering}, vol.~40, no.~2, pp.~259--267, 2001. \bibitem{mec_hds:01} H.~De~Smet, J.~Van~den Steen, and J.~Doutreloigne, ``Custom display driver design (invited speech),'' in {\em Proceedings of the SID-ME Spring meeting}, (Delft, The Netherlands), pp.~--, April 2001. \bibitem{hde_hdp:01} H.~De~Pauw, J.~Vanfleteren, J.~De~Baets, and A.~Van~Calster, ``Novel electroless bumping technologies for {MCM-D}: bumping of single chips and straight-wall bumping on cu metallisations,'' in {\em Proceedings of the 2001 International Conference on High-Density Interconnect and Systems Packaging}, (Santa Clara, California), pp.~302--307, April 2001. \bibitem{dve_avc:01} A.~Van~Calster, ``Microdisplays: A cost-effective technology for high-resolution displays (invited),'' in {\em Proceedings of the conference on Displays and Vacuum Electronics}, (Garmisch-Partenkirchen, Germany), pp.~115--119, May 2001. \bibitem{dve_jdo:01} J.~Doutreloigne, H.~De~Smet, A.~Van~Calster, R.~Klappert, and J.~Grupp, ``High-voltage driver for cholesteric {LCD}s,'' in {\em Proceedings of the conference on Displays and Vacuum Electronics}, (Garmisch-Partenkirchen, Germany), pp.~283--287, May 2001. \bibitem{mpc_jvf:01} J.~Vanfleteren, B.~Vandecasteele, T.~Podprocky, and P.~Jacobs, ``Low temperature flip-chip assembly for biomedical applications,'' in {\em Proceedings of 13th European Microelectronics and Packaging Conference and Exhibition}, (Strassbourg, France), pp.~213--216, May 2001. \bibitem{mpc_jdb:01} J.~De~Baets, M.~Vereeken, A.~Van~Calster, D.~Corlatan, E.~Roose, A.~Van~Laere, S.~Mainwaring, G.~Patra, S.~Harris, M.~Morell, C.~Haley, G.~Schols, A.~Ostmann, and D.~Mathelin, ``Reliability of a board technology for high-frequency applications,'' in {\em Proceedings of 13th European Microelectronics and Packaging Conference and Exhibition}, (Strassbourg, France), pp.~271--275, May 2001. \bibitem{sid_hds:01} H.~De~Smet, J.~Van~den Steen, and A.~Van~Calster, ``Microdisplays with high pixel counts (invited),'' in {\em Proceedings of the International Symposium, Seminar and Exhibition (SID)}, (San Jose, California), pp.~968--971, June 2001. \bibitem{sid_fbr:01} F.~Bruyneel, H.~De~Smet, and A.~Van~Calster, ``Assembly of reflective {PDLC} microdisplays,'' in {\em Proceedings of the International Symposium, Seminar and Exhibition (SID)}, (San Jose, California), pp.~442--445, June 2001. \bibitem{mic_jvd:01} J.~Van~den Steen, G.~Van~Doorselaer, D.~Cuypers, H.~De~Smet, A.~Van~Calster, F.~Chu, and L.~Tseng, ``A 0.9 {XGA} {LCoS} backplane for projection applications,'' in {\em Proceedings of the Microdisplay 2001 conference}, (Westminster, Colorado), pp.~87--90, August 2001. \bibitem{lcr_fbr:01} F.~Bruyneel, H.~De~Smet, J.~Vanfleteren, and A.~Van~Calster, ``Cell gap optimization and alignment effects in reflective {PDLC} microdisplays,'' {\em Liquid Crystals}, vol.~28, no.~8, pp.~1245--1252, 2001. \bibitem{mic_hds:01} H.~De~Smet, J.~Van~den Steen, D.~Cuypers, N.~Carchon, and A.~Van~Calster, ``Monocrystalline silicon active matrix reflective light valve (invited speech),'' in {\em Proceedings of Microdisplay Conference}, (Edinburg), pp.~--, September 2001. \bibitem{idw_fbr:01} F.~Bruyneel, W.~Hendrix, H.~De~Smet, and A.~Van~Calster, ``Fast {PDLC} using field oriented addressing,'' in {\em Proceedings of Asia Display/IDW}, (Nagoya, Japan), pp.~45--48, October 2001. \bibitem{jsi_fbr:01} F.~Bruyneel, H.~De~Smet, A.~Van~Calster, and J.~Egelhaaf, ``Comparison of reflective {PNLCDs} and reflective single-polarizer heilmeier guest-host displays,'' {\em Journal of the SID}, vol.~9, no.~4, pp.~313--318, 2001. \bibitem{cpa_ppa:01} P.~Palm, J.~Maattanen, Y.~De~Maquille, A.~Picault, J.~Vanfleteren, and B.~Vandecasteele, ``Reliability of different flex materials in high density flip chip on flex applications,'' in {\em Proceedings of the first International {IEEE} Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic)}, (Potsdam, Germany), pp.~224--229, October 2001. \bibitem{cpa_ill:01} Z.~Illyefalvi-Vitez, R.~Berenyi, P.~Gordon, J.~Pinkola, M.~Ruszinko, and J.~Vanfleteren, ``Laser via generation into flexible substrates,'' in {\em Proceedings of the first International {IEEE} Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic)}, (Potsdam, Germany), pp.~230--235, October 2001. \bibitem{ite_dba:01} D.~Baert and A.~Vervaet, ``Determination of the state-of-health of {VRLA} batteries by means of noise measurements,'' in {\em Proceedings of the 23rd International Telecommunications Energy Conference (INTELEC)}, (Edinburgh, UK), pp.~301--306, October 2001. \bibitem{phd_jvs:01} J.~Van~den Steen, G.~Van~Doorselaer, H.~De~Smet, and A.~Van~Calster, ``On the design of {LCoS} backplanes for large information content displays,'' in {\em Proceedings of the 2nd RUG-FTW PhD Symposium}, (Gent, Belgium), p.~paper 79, December 2001. \bibitem{phd_fbr:01} F.~Bruyneel, H.~De~Smet, and A.~Van~Calster, ``Introduction of color in reflective microdisplays,'' in {\em Proceedings of the 2nd RUG-FTW PhD Symposium}, (Gent, Belgium), p.~paper9, December 2001. \bibitem{sdr_nhe:01} N.~Heyfyene, C.~Anghel, A.~Ionescu, S.~Frere, R.~Gillon, M.~Vermandel, B.~Bakeroot, and J.~Doutreloigne, ``An experimental approach for bias-dependent drain series resistances evaluation in asymmetric {HV MOSFETs},'' in {\em Proceedings of the 31th European Solid-State Device Research Conference}, (Nuremberg), pp.~403--406, 2001. \bibitem{sdr_can:01} C.~Anghel, N.~Heyfyene, A.~Ionescu, M.~Vermandel, B.~Bakeroot, J.~Doutreloigne, R.~Gillon, S.~Frere, C.~Maier, and Y.~Mourier, ``Investigations and physical modelling of saturation effects in lateral {DMOS} transistor architectures based on the concept of intrinsic drain voltage,'' in {\em Proceedings of the 31th European solid-state Device Research Conference}, (Nuremberg), pp.~399--402, 2001. \bibitem{sol_jdo:01} J.~Doutreloigne, H.~De~Smet, and A.~Van~Calster, ``A versatile micropower high-voltage flat-panel display driver in a {100V} 0.7 um {CMOS} intelligent interface technology,'' {\em IEEE Journal of Solid-State Circuits}, vol.~36, no.~12, pp.~2039--2048, 2001. \bibitem{eim_hds:02} H.~De~Smet, J.~Van~den Steen, and P.~Colson, ``Use of stitching in microdisplay fabrication,'' in {\em Proc. of SPIE, Vol. 4657: Projection Displays VIII}, (San Jose, USA), pp.~23--30, SPIE, January 2002. \bibitem{sid_fbr:02} F.~Bruyneel, H.~De~Smet, and A.~Van~Calster, ``Reflective color {PDLC} displays using color filters,'' in {\em Proceedings of SID, Digest of technical papers, vol. XXXIII, number I}, (Boston, USA), pp.~534--537, May 2002. \bibitem{sid_wdm:02} W.~De~Moerloose, G.~Van~Doorselaer, and A.~Van~Calster, ``Reducing greyvalue non-uniformities in microdisplays,'' in {\em Proceedings of SID, Digest of technical papers, vol. XXXIII, number I}, (Boston, USA), pp.~635--637, May 2002. \bibitem{die_jvf:02} J.~Vanfleteren, B.~Vandecasteele, and T.~Podprocky, ``Low cost adhesive flip-chip assembly technology using a combination of {ICA} and {NCA},'' in {\em Presented at {GOOD-DIE} International Workshop}, (Brugge, Belgium), May 2002. \bibitem{elc_ave:02} A.~Vervaet and D.~Baert, ``The lead acid battery: semiconducting properties and peukert's law,'' {\em Electrochimica Acta}, vol.~47, pp.~3297--3302, 2002. \bibitem{ima_bvc:02} B.~Vandecasteele, T.~Podprocky, and J.~Vanfleteren, ``High density flip chip with adhesives on ceramics,'' in {\em Proceedings of IMAPS-Europe}, (Cracow, Poland), pp.~175--180, June 2002. \bibitem{pol_jvf:02} J.~Vanfleteren, B.~Vandecasteele, S.~Raevens, J.~Maattanen, and P.~Perttula, ``Reduced temperature flip-chip technologies on flexible display substrates using adhesives,'' in {\em Proceedings of the 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC 2002)}, (Zalaegerszeg, Hungary), pp.~92--95, June 2002. \bibitem{ima_jvf:02} J.~Vanfleteren, B.~Vandecasteele, and T.~Podprocky, ``Low cost, wide temperature range adhesive flip-chip technology using a combination of {ICA} and {NCA},'' in {\em Book of Extended Abstracts, IMAPS Flip-Chip Technology Workshop and Exhibition}, (Austin, Texas USA), June 2002. \bibitem{ply_jvf:02} J.~Vanfleteren, B.~Vandecasteele, and T.~Podprocky, ``A new adhesive flip-chip technology for low temperature and high density electronic assembly,'' in {\em Presented at 1st {POLYSCENE} Workshop}, (Leuven, Belgium), June 2002. \bibitem{dis_hds:02} H.~De~Smet, D.~Cuypers, A.~Van~Calster, J.~Van~den Steen, and G.~Van~Doorselaer, ``Design, fabrication and evaluation of a high-performance {XGA VAN-LCOS} microdisplay,'' {\em Displays}, vol.~23, no.~3, pp.~89--98, 2002. \bibitem{mrs_bma:02} B.~Manirambona, J.~De~Baets, and A.~Vervaet, ``Eximer laser microvia technology in mcms,'' in {\em Book of abstracts of the European Materials Research Society (MRS)}, (Strasbourg, France), pp.~D--II.27, June 2002. \bibitem{edl_fbr:02} F.~Bruyneel, H.~De~Smet, and A.~Van~Calster, ``Reduction of the switching time of polymer dispersed liquid crystal using field oriented addressing,'' {\em IEEE Electron Device Letters}, vol.~23, no.~7, pp.~401--403, 2002. \bibitem{ima_hdp:02} H.~De~Pauw, J.~De~Baets, J.~Vanfleteren, and A.~Van~Calster, ``An {O/E} measurement probe based on an optics-extented {MCM-D} motherboard technology,'' in {\em Proceedings of IMAPS}, (Denver, Colorado), pp.~936--941, September 2002. \bibitem{ess_bba:02} B.~Bakeroot, M.~Vermandel, J.~Doutreloigne, P.~Moens, and D.~Bolognesi, ``Cost effective implementation of a 90 v {RESURF} p-type drain extended {MOS} in 0.35 um based smart power technology,'' in {\em Proceedings of ESSDERC-ESSCIRC}, (Florence, Italy), pp.~291--294, September 2002. \bibitem{ess_pmo:02} P.~Moens, D.~Bolognesi, L.~Delobel, D.~Villanueva, K.~Reynders, A.~Lowe, G.~Van~Herzeele, M.~Tack, and B.~Bakeroot, ``Future trends in intelligent interface technologies for 42 v battery automotive applications,'' in {\em Proceedings of ESSDERC-ESSCIRC}, (Florence, Italy), pp.~287--290, September 2002. \bibitem{eur_gvd:02} G.~Van~Doorselaer, D.~Cuypers, H.~De~Smet, J.~Van~den Steen, A.~Van~Calster, K.-S. Ten, and L.-Y. Tseng, ``A {XGA VAN-LCoS} projector,'' in {\em Proceedings of Eurodisplay 2002}, (Nice, France), pp.~205--208, October 2002. \bibitem{eur_dcu:02} D.~Cuypers, G.~Van~Doorselaer, J.~Van~den Steen, H.~De~Smet, and A.~Van~Calster, ``Assembly of an {XGA 0.9"} {LCoS} display using inorganic alignment layers for {VAN LC},'' in {\em Proceedings of Eurodisplay 2002}, (Nice, France), pp.~551--554, October 2002. \bibitem{eur_tbe:02} T.~Bert, G.~Van~Steenberge, H.~De~Smet, F.~Bruyneel, J.~Doutreloigne, E.~Schroten, and A.~Ketelaars, ``Passive matrix addressing of electrophoretic image display,'' in {\em Proceedings of Eurodisplay 2002}, (Nice, France), pp.~251--254, October 2002. \bibitem{idw_dcu:02} D.~Cuypers, G.~Van~Doorselaer, J.~Van~den Steen, H.~De~Smet, and A.~Van~Calster, ``A projection system using vertically aligned nematic liquid crystal on silicon panels,'' in {\em Proceedings of IDW 2002}, (Hiroshima, Japan), pp.~45--48, December 2002. \bibitem{idw_wih:02} W.~Hendrix, J.~Doutreloigne, and A.~Van~Calster, ``Programmable and frequency regulated low-power, high-voltage generators for display drivers,'' in {\em Proceedings of IDW 2002}, (Hiroshima, Japan), pp.~379--382, December 2002. \bibitem{ept_jvf:02} J.~Vanfleteren, B.~Vandecasteele, and T.~Podprocky, ``Low temperature flip-chip process using {ICA} and {NCA} (isotropically and non-conductive adhesive) for flexible displays application,'' in {\em Proceedings of 4th Electronics Packaging Technology Conference (EPTC)}, (Singapore), pp.~139--143, December 2002. \bibitem{spi_dcu:03} D.~Cuypers, H.~De~Smet, G.~Van~Doorselaer, J.~Van~den Steen, and A.~Van~Calster, ``Measurement methodology for vertically aligned nematic reflective displays,'' in {\em Proceedings of {SPIE}, Vol. 5002}, (Santa Clara), pp.~62--72, January 2003. \bibitem{mic_jvf:03} P.~Palm, J.~Maattanen, Y.~De~Maquille, A.~Picault, J.~Vanfleteren, and B.~Vandecasteele, ``Comparison of different flex materials in high density flip chip on flex applications,'' {\em Microelectronics Reliability}, vol.~43, no.~3, pp.~445--451, 2003. \bibitem{dis_tbe:03} T.~Bert and H.~De~Smet, ``The microscopic physics of electronic paper revealed,'' {\em Displays}, vol.~24, no.~3, pp.~103--110, 2003. \bibitem{jps_dba:03} D.~Baert and A.~Vervaet, ``Small bandwith measurement of the noise voltage of batteries,'' {\em Journal of Power Sources}, vol.~114, no.~2, pp.~357--365, 2003. \bibitem{ass_bma:03} B.~Manirambona, J.~De~Baets, and A.~Vervaet, ``Excimer laser microvia technology in multichip modules,'' {\em Applied Surface Science}, pp.~171--176, 2003. \bibitem{mec_jdo:03} J.~Doutreloigne, H.~De~Smet, W.~Hendrix, M.~Vermandel, and A.~Van~Calster, ``Low-power high-voltage drivers for reflective bistable {LCD}s,'' in {\em Proceedings of {SID-ME} Chapter Meeting}, (Neuchatel, Switzerland), pp.~--, March 2003. \bibitem{ise_sam:03} S.~Siau, L.~Degrendele, J.~De~Baets, and A.~Van~Calster, ``Electroless {Ni/Au} plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask,'' in {\em Proceedings of the 26 th International Spring Seminar on Electronics Technology}, (Stara Lesna, Slovakia), pp.~158--162, May 2003. \bibitem{ise_top:03} T.~Podprocky, B.~Vandecasteele, J.~De~Baets, A.~Van~Calster, and J.~Bansky, ``Integration of thick film resistors in a multilayer structure,'' in {\em Proceedings of the 26 th International Spring Seminar on Electronics Technology}, (Stara Lesna, Slovakia), pp.~137--140, May 2003. \bibitem{ise_bvc:03} B.~Vandecasteele, J.~Vanfleteren, J.~Maattanen, and T.~Laitinen, ``Results of a high density flip chip on flex reliability test program,'' in {\em Proceedings of the 26 th International Spring Seminar on Electronics Technology}, (Stara Lesna, Slovakia), pp.~1--6, May 2003. \bibitem{sid_jdo:03} J.~Doutreloigne, M.~Vermandel, H.~De~Smet, and A.~Van~Calster, ``A micro-power {100V} cholesteric texture {LCD} driver,'' in {\em Proceedings of {SID} International Symposium, Digest of technical papers, Volume {XXXIV}, book I}, (Baltimore, USA), pp.~328--331, May 2003. \bibitem{sid_whe:03} W.~Hendrix, J.~Doutreloigne, M.~Vermandel, and A.~Van~Calster, ``Design of an integrated low-power high-voltage driver,'' in {\em Proceedings of {SID} International Symposium, Digest of technical papers, Volume {XXXIV}, book I}, (Baltimore, USA), pp.~320--323, May 2003. \bibitem{ima_bvc:03} B.~Vandecasteele, T.~Podprocky, J.~Vanfleteren, and J.~Maattanen, ``Low temperature flip chip with adhesives on {PES},'' in {\em Proceedings of the 14th European Microelectronics and Packaging Conference and Exhibition}, (Friedrichshafen, Germany), pp.~319--324, June 2003. \bibitem{ima_tpo:03} T.~Podprocky, B.~Vandecasteele, J.~De~Baets, and A.~Van~Calster, ``Thick film inductors for {RF} applications,'' in {\em Proceedings of the 14th European Microelectronics and Packaging Conference and Exhibition}, (Friedrichshafen, Germany), pp.~138--142, June 2003. \bibitem{iep_hdp:03} H.~De~Pauw, J.~De~Baets, J.~Vanfleteren, and A.~Van~Calster, ``Integrated optics in a standard {MCM-D} motherboard technology demonstrated in {O/E} measurement probes,'' in {\em Proceedings of International Electronic Packaging Technical Conference and Exhibition}, (Maui,Hawaii, USA), p.~35192, July 2003. \bibitem{leo_jvs:03} H.~De~Smet, J.~Van~den Steen, G.~Van~Doorselaer, D.~Cuypers, N.~Carchon, and A.~Van~Calster, ``On the development of {VAN LCOS} microdisplays (invited),'' in {\em Proceedings of the {IEEE LEOS} Annual Meeting Conference}, (Tucson, Arizona), pp.~814--815, October 2003. \bibitem{acs_sam:03} S.~Siau, A.~Vervaet, A.~Van~Calster, Y.~Swennen, and E.~Schacht, ``Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for usage as build-up layer,'' in {\em Abstracts of the 7th International Conference on Atomically Controlled Surfaces, Interfaces and Nanostructures}, (Nara, Japan), p.~496, November 2003. \bibitem{idw_hds:03} H.~De~Smet, J.~Van~den Steen, and D.~Cuypers, ``Spice model for a dynamic liquid crystal pixel capacitance,'' in {\em Proceedings of the 10th international Display Workshops (IDW)}, (Fukuoka,Japan), pp.~53--56, December 2003. \bibitem{idw_dcu:03} D.~Cuypers, J.~Van~den Steen, G.~Van~Doorselaer, H.~De~Smet, and A.~Van~Calster, ``{WXGA LCOS} projection panel with vertically aligned nematic {LC},'' in {\em Proceedings of the 10th international Display Workshops (IDW)}, (Fukuoka,Japan), pp.~1541--1544, December 2003. \bibitem{idw_tbe:03} T.~Bert and H.~De~Smet, ``A new insight in electronic paper: {EPID} or {DEPID},'' in {\em Proceedings of the 10th international Display Workshops (IDW)}, (Fukuoka,Japan), pp.~1621--1624, December 2003. \bibitem{sia_jec:04} S.~Siau, A.~Vervaet, Schacht, and A.~Van~Calster, ``Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited {C}u for use in electronic interconnections,'' {\em Journal of the Electrochemical Society}, vol.~151, no.~2, pp.~133--141, 2004. \bibitem{tbe_dis:04} T.~Bert and H.~De~Smet, ``Dielectrophoresis in electronic paper,'' {\em Displays}, vol.~24, no.~4, pp.~223--230, 2004. \bibitem{bvc_ice:04} B.~Vandecasteele, J.~Maattanen, T.~Podprocky, and J.~Vanfleteren, ``Low temperature flip chip attachment for flexible display applications,'' in {\em Proceedings of the International Conference on Electronics Packaging}, (Tokyo, Japan), pp.~307--312, April 2004. \bibitem{maa_elv:04} J.~Maatanen, B.~Vandecasteele, J.~Vanfleteren, and Y.~de~Maquille, ``Tiheiden joustaville alustoille tehtyjen kääntösiruliitosten testausohjelma ja tulokset, reliability results of high density flip chip on flex assemblies,'' in {\em Proceedings of Elektroniikan Valmistus 2004; Elektroniikan tuotanto-ja pakkaustekniikan konferenssii}, (Pori, Finland), pp.~89--93, May 2004. \bibitem{sid_whe:04} W.~Hendrix, J.~Doutreloigne, and A.~Van~Calster, ``Integrated low-power high-voltage driver for bistable nematic displays,'' in {\em Proceedings of the Society for Information Display 2004, Digest of technical papers, Volume {XXXV}, Book I}, (Seattle,Washington), pp.~376--379, May 2004. \bibitem{hds_lic:04} H.~De~Smet, J.~Van~den Steen, and D.~Cuypers, ``Electrical model of a liquid crystal pixel with dynamic, voltage history-dependent capacitance value,'' {\em Liquid Crystals}, vol.~31, no.~5, pp.~705--711, 2004. \bibitem{sia_els:04} S.~Siau, A.~Vervaet, A.~Van~Calster, and E.~Schacht, ``Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper,'' in {\em Meeting abstracts of the 205th Meeting of The Electrochemical Society}, (San Antonio, Texas), p.~207, May 2004. \bibitem{jec_sia:04} S.~Siau, A.~Vervaet, A.~Van~Calster, I.~Swennen, and E.~Schacht, ``Epoxy polymer surface roughness modeling based on kinetic studies of wet chemical treatments,'' {\em Journal of the Electrochemical Society}, vol.~151, no.~8, pp.~54--61, 2004. \bibitem{idr_jdo:04} J.~Doutreloigne and W.~Hendrix, ``Integrated high-voltage generators for low-power bistable {LCD} drivers,'' in {\em Proceedings of the 24th International Display Research conference (IDRC Asia Display 2004 and the 4th International Meeting on Information Display (IMID 2004)}, (Daegu, Korea), pp.~135--138, August 2004. \bibitem{ass_sia:04} S.~Siau, A.~Vervaet, A.~Van~Calster, I.~Swennen, and E.~Schacht, ``Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer,'' {\em Applied Surface Science}, vol.~237, no.~1, pp.~457--462, 2004. \bibitem{ssd_bba:04} B.~Bakeroot, J.~Doutreloigne, and P.~Moens, ``A new substrate current free n{LIGBT} for junction isolated technologies,'' in {\em Proceedings of the 34th European Solid-State Device Research Conference}, (Leuven, Belgium), pp.~461--464, September 2004. \bibitem{sid_tbe:04} T.~Bert, F.~Beunis, H.~De~Smet, and K.~Neyts, ``Transient current properties in electronic paper,'' in {\em Proceedings of the {SID-ME} 2004 10th Anniversary Meeting}, (Stuttgart, Germany), October 2004. \bibitem{ade_tbe:04} T.~Bert and H.~De~Smet, ``How total internal reflection can make electronic paper better,'' in {\em Proceedings of Americas Display Engineering and Applications Conference (ADEAC 2004)}, (Ft. Worth, Texas, USA), pp.~84--86, October 2004. \bibitem{ism_hdp:04} H.~De~Pauw, N.~Carchon, J.~De~Baets, and A.~Van~Calster, ``Redistribution on wafer: an alternative, cost-efficient approach,'' in {\em Proceedings of the 37th International Symposium on Microelectronics}, (Long Beach, California, USA), November 2004. \bibitem{doc_tbe:04} T.~Bert and H.~De~Smet, ``Current transport mechanisms in electronic paper,'' in {\em Proceedings of the 5th Doctoraatssymposium}, (UGent, Belgium), p.~28, December 2004. \bibitem{jec_sam:04} S.~Siau, A.~Vervaet, S.~Nalines, E.~Schacht, and A.~Van~Calster, ``Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for build-up layers. part 1: sweller influence,'' {\em Journal of the Electrochemical Society}, vol.~151, no.~12, pp.~816--830, 2004. \bibitem{sam_jec:04} S.~Siau, A.~Vervaet, S.~Nalines, E.~Schacht, and A.~Van~Calster, ``Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for build-up layers. part 2: oxidative treatment of the surface,'' {\em Journal of the Electrochemical Society}, vol.~151, no.~12, pp.~831--849, 2004. \bibitem{icm_jdo:04} J.~Doutreloigne, ``A monolithic low-power high-voltage driver for bistable {LCD}s,'' in {\em Proceedings of the 16th International Conference on Microelectronics (ICM)}, (Tunis, Tunesia), pp.~425--428, December 2004. \bibitem{idw_tbe:04} T.~Bert, F.~Beunis, H.~De~Smet, and K.~Neyts, ``Transient current properties in electronic paper,'' in {\em Proceedings of 11th Internation Display Workshops (IDW)}, (Niigata, Japan), pp.~1749--1752, December 2004. \bibitem{idw_whe:04} W.~Hendrix, J.~Doutreloigne, and A.~Van~Calster, ``A fully integrated low-power high-voltage bistable display driver for smartcard applications,'' in {\em Proceedings of 11th Internation Display Workshops (IDW)}, (Niigata, Japan), pp.~1733--1736, December 2004. \bibitem{idw_amo:04} A.~Monte, J.~Doutreloigne, and A.~Van~Calster, ``An intelligent driving scheme for high-voltage display drivers,'' in {\em Proceedings of 11th Internation Display Workshops (IDW)}, (Niigata, Japan), pp.~1737--1740, December 2004. \bibitem{idw_dcu:04} D.~Cuypers, H.~De~Smet, and A.~Van~Calster, ``Fringe-field induced disclinations in van lcos panels,'' in {\em Proceedings of 11th Internation Display Workshops (IDW)}, (Niigata, Japan), pp.~1679--1682, December 2004. \bibitem{sia_ass:04} S.~Siau, A.~Vervaet, S.~Degrande, E.~Schacht, and A.~Van~Calster, ``Dip coating of dielectric and solder mask epoxy polymers layers for buid-up purposes,'' {\em Applied Surface Science}, vol.~245, no.~1, pp.~353--368, 2004. \bibitem{sam_mir:04} S.~Siau, J.~De~Baets, A.~Van~Calster, L.~Heremans, and S.~Tanghe, ``Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards,'' {\em Microelectronics Reliability}, vol.~45, no.~3, pp.~675--687, 2005. \bibitem{spi_hmu:05} H.~Murat, H.~De~Smet, D.~Cuypers, Y.~Meuret, H.~Thienpont, M.~Vervaeke, and L.~Desmet, ``Increased lumens per etendue by combining pulsed {LED}s,'' in {\em Proceedings of {SPIE}, Projection Displays XI, Vol. 5740}, (San Jose), pp.~1--12, January 2005. \bibitem{sse_bba:05} B.~Bakeroot, J.~Doutreloigne, and P.~Moens, ``A new {LIGBT} structure to suppress substrate currents in a junction isolated technology,'' {\em Solid-State Electronics}, vol.~49, no.~3, pp.~363--367, 2005. \bibitem{sid_hmu:05} H.~Murat, H.~De~Smet, and D.~Cuypers, ``Time sharing of pulsed {LED}s increases lumen output within the same etendue,'' in {\em Proceedings of joint {SID} meeting ({SID-ME}/Le Club Visu) on CD-rom}, (Ghent), March 2005. \bibitem{sid_tbe:05} T.~Bert and H.~De~Smet, ``Hexagonal patterns in electronic paper,'' in {\em Proceedings of joint {SID} meeting ({SID-ME}/Le Club Visu) on CD-rom}, (Ghent), March 2005. \bibitem{sid_jvf:05} J.~Vanfleteren, ``Presentation of {FP6} integrated project {FLEXIDIS},'' in {\em Proceedings of joint {SID} meeting ({SID-ME}/Le Club Visu) on CD-rom}, (Ghent), March 2005. \bibitem{sid_hds:05} H.~De~Smet, ``Presentation of {FP5-IST} project {LCOS4LCOS},'' in {\em Proceedings of joint {SID} meeting ({SID-ME}/Le Club Visu) on CD-rom}, (Ghent), March 2005. \bibitem{isc_jdo:05} J.~Doutreloigne, M.~Vermandel, H.~De~Smet, and A.~Van~Calster, ``A multifunctional high-voltage driver chip for low-power mobile display systems,'' in {\em Proceedings of the 2005 IEEE International Symposium on Circuits and Systems (ISCAS 2005)}, (Kobe, Japan), pp.~1855--1858, May 2005. \bibitem{dcu_sid:05} D.~Cuypers, H.~De~Smet, and A.~Van~Calster, ``Fringe field effects in microdisplays,'' in {\em Proceedings of the Society for Information Display 2005}, (Boston, Massachusetts, USA), pp.~1298--1301, May 2005. \bibitem{tbe_sid:05} T.~Bert and H.~De~Smet, ``Pattern formation in electronic paper,'' in {\em Proceedings of the Society for Information Display 2005}, (Boston, Massachusetts, USA), pp.~765--767, May 2005. \bibitem{sam_jec:05} S.~Siau, A.~Vervaet, L.~Van~Vaeck, E.~Schacht, U.~Demeter, and A.~Van~Calster, ``Adhesion strength of the epoxy polymer/copper interface for use in microelectronics,'' {\em Journal of the Electrochemical Society}, vol.~152, no.~6, pp.~c442--c455, 2005. \bibitem{sia_ass:05} S.~Siau, A.~Vervaet, S.~Degrande, E.~Schacht, and A.~Van~Calster, ``Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes,'' {\em Applied Surface Science}, vol.~245, no.~1. \bibitem{sia_jec:05} S.~Siau, A.~Vervaet, E.~Schacht, S.~Degrande, K.~Callewaert, and A.~Van~Calster, ``Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper,'' {\em Journal of the Electrochemical Society}, vol.~152, no.~9, pp.~d136--d150, 2005. \bibitem{sam_els:05} S.~Siau, A.~Vervaet, E.~Schacht, and A.~Van~Calster, ``Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of eltrochemically deposited copper,'' in {\em Meeting abstracts of the 207th meeting of The Electrochemical Society}, (Ville de Quebec, Canada), p.~348, May 2005. \bibitem{sam_mrs:05} S.~Siau, A.~Vervaet, A.~Van~Calster, E.~Schacht, and E.~Demeter, ``Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics,'' in {\em Meeting abstracts of {E-MRS} 2005 Spring meeting}, (Strassbourg), pp.~e37--e38, June 2005. \bibitem{sam_isp:05} S.~Siau, A.~Vervaet, A.~Van~Calster, and D.~Baert, ``The development of epoxy polymer surface roughness due to wet chemical treatments and its relevance to adhesion of elctrochemically deposited copper (invited),'' in {\em Proceedings of the fifth International Symposium on Polymer Surface Modification (relevanced to adhesion)}, (Toronto, Canada), p.~22, June 2005. \bibitem{fle_tbe:05} T.~Bert, J.~Vanfleteren, B.~Vandecasteele, S.~Maeyaert, J.~Doutreloigne, J.~Govaerts, H.~De~Smet, and A.~Van~Calster, ``Advanced technologies in fabrication and interconnection of flexible displays and substrates,'' in {\em Proceedings of flexible displays and electronics (FDE) 2005}, (San Francisco), pp.~1--14, June 2005. \bibitem{ima_jdb:05} A.~Ostmann, J.~De~Baets, A.~Kriechbaum, H.~Kostner, and A.~Neumann, ``Technology for embedding active dies,'' in {\em Proceedings of the 15th European Microelectronics and Packaging Conference and Exhibition}, (Brugge, Belgium), pp.~101--106, June 2005. \bibitem{ima_jvf:05} J.~Vanfleteren, ``{FP5-CSG-IMECAT}: Introduction and highlights of an {EC} funded project on lead-free materials and assembly development technologies,'' in {\em Proceedings of the 15th European Microelectronics and Packaging Conference and Exhibition}, (Brugge, Belgium), pp.~419--422, June 2005. \bibitem{ima_bvd:05} B.~Vandecasteele, J.~Vanfleteren, D.~Manessis, A.~Ostmann, H.-W. 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