IMECAT Project Results

Results overview

The table below shows the results of the project, obtained so far, and also mentioned in the Technology Implementation Plan (TIP). Some of these results are available for dissemination and exploitation outside the consortium. Click on the result to see more details and contact co-ordinates.

No.	Self-descriptive title of the result	Partner(s) owning the result(s)
1	High reliability adhesive flip-chip technology on FR4 PCB substrates	IMEC
2	Thermo-mechanical analysis of lead-free solder joint reliability for electronic packages	IMEC
3	Development of new NCA ( None Conductive Adhesive) and ICA ( Isoptropic Conductive Adhesive) materials	Heraeus
4	Test chips for flip-chip interconnect verification	AMIS
5	Development of lead-free wafer bumping technology and bumping of IMECAT test wafers	TUBerlin
6	Interconnection and assembly of test chips on FR4 board	TUBerlin
7	Validation and implementation of lead-free assembly processes and high density interconnect substrates in automotive environment (engine control unit)	CR Fiat
8	New Flex circuit to glass interconnection, using Isotropic Conductive Adhesive (ICA) and Non Conductive Adhesives (NCA)	Tecdis
9	Environmentally compatible soldering for telecom applications	Alcatel Bell
10	Low cost flip chip interconnections for smart cards and smart label	KSW
11	Lead free solder assembly for portable telecom applications	Elcoteq

Contact

For more information, contact the project coordinator :

Prof..Dr. ir. Jan Vanfleteren, IMEC/INTEC/TFCG
Technologiepark 914-A, B-9052 GENT-ZWIJNAARDE, Belgium
Tel : +32-9-264.53.60
Fax : +32-9-264.53.72
e-mail : jan.vanfleteren@elis.ugent.be
web page : http://www.elis.ugent.be/ELISgroups/tfcg/staff/jvf.html

IMECAT public > results

Page created by Jan Vanfleteren. Latest update: 10-June-2005