IMECAT Publications

[1] Petar Ratchev, Bart Vandevelde and Ingrid De Wolf : “Reliability and Failure Analysis of Sn-Ag-Cu Solder Interconnections for PSGA packages on Ni/Au Surface Finish”, IEEE-TMDR, 2003

[2] Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner and Herbert Reichl, “Stencil Printing Technology for 100µm Flip Chip Bumping”, Proc. IMAPS Boston, 2003, pp. 241-246.

[3] D.Manessis, R.Patzelt, A. Ostmann, R. Aschenbrenner, H. Reichl, “Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping”, Microelectronics Reliability Volume 44, Issue 5 , May 2004, pp.797-803

[4] D. Manessis, R. Patzelt, A. Ostmann, R. Aschenbrenner, H. Reichl, “Stencil Printing technology for 100µm flip chip bumping”, GLOBAL SMT&PACKAGING, Volume 4, Number 2, February 2004, pp. 10-14.

[5] Els Parton, Mario Gonzales, Riet Rabie, Bart Vandevelde, Jan Vanfleteren und Petar Ratchev : “Bleifrei in die Gehäusezukunft”, Productronic 12’ 03, December 2003, pp. 2-5, also in “D&V Kompendium 2004/2005”, A.04, pp.89-94.

[6] Bart Vandevelde, Petar Ratchev, Riet Labie, Jan Vanfleteren, Mario Gonzalez : “IMEC goes lead-free”, IMEC Lead-free workshop, Leuven, February 6, 2004.

[7] Jan Vanfleteren : “IMECAT : an EC-FP5-Growth funded research project on lead-free assembly materials and technologies”, Interconex 2004, IMAPS France, Versailles, France, May 4-5, 2004.

[8] Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev and Eric Beyne : “Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages”, Eurosime04 Conference: Brussels, May 9-12, 2004

[9] Jan Vanfleteren : “Adhesive flip-chip technology”, IMAPS Benelux Spring Event 2004 on Advanced Interconnect, Gent, Belgium, May 14, 2004

[10] Bart Vandevelde : “Omschakeling naar loodvrije PCB assemblage”, TechWatch Seminar “PCB assembly”, Leuven, May 27, 2004.

[11] Mario Gonzalez, B. Vandevelde and E. Beyne, “Thermo-mechanical analysis of a chip scale package (CSP) using lead free and lead containing solder materials”, EMPS IMAPS seminar: Prague, June 16-18, 2004, pp. 247–252.

[12] B. Vandevelde, M. Gonzalez, E. Beyne, D. Vandepitte, M. Baelmans, “Influence of Printed Circuit Board Properties on Solder Joint Fatigue Life of Assembled IC Packages”, EMPS IMAPS seminar: Prague, June 16-18, 2004.

[13] Jan Vanfleteren : “IMECAT : an EC FP5-Growth project on the development and application of lead-free solders and adhesives”, accepted for presentation, 2nd International Conference on Lead-Free Electronics, IPC & Soldertec, Amsterdam, Netherlands, June 21-23, 2004.

[14] Marco Mango : “Investigation on lead-free flip chip for under the hood applications”, IMAPS Italy, Milan, June 22, 2004.

[15] Inge Schildermans, “Status of lead-free soldering at Alcatel Bell Geel”, presentation at Alcatel Bell Geel’s Technology Day 2004, Geel, Belgium, June 10, 2004.

[16] Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Jan Vanfleteren, Eric Beyne, “Leadfree solder joint reliability estimation by finite element modelling: advantages, challenges and limitations”, IPC 7th international conference on Leadfree electronic components and assemblies, Frankfurt, Germany, October 21-22, 2004. <paper> <presentation>

[17] Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl, Joachim Wiese, Christina Modes, “Accomplishments in Lead-Free Flip Chip Wafer Bumping using Stencil Printing Technology”, IMAPS 2004, Long Beach, USA.

[18] Petar Ratchev, Riet Labie, Eric Beyne,. “Nanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder joints” Proc. 6th Electronic Packaging Technology Conference - EPTC. IEEE, 2004, Singapore, .8-10 December 2004, pp.339-342.

[19] Koen Snoeckx, Bart Vandevelde, Jan Vanfleteren, “Naar een nieuw tijdperk van loodvrij solderen”, Het Ingenieursblad, 3/2005, pp. 52-58 (in Dutch).

[20] Bart Vandevelde, Jan Vanfleteren, Bjorn Vandecasteele, Mario Gonzalez, Petar Ratchev, Inge Schildermans, Geert Willems, Joachim Wiese, Hans-Werner Hagedorn, Dion Manessis, Marco Mango, Jarmo Määttänen, Greta Maakannas, Daniel Vanderstraeten, Eddy Blansaer, Frank Kriebel, Manuel Lopez, “FP5-CSG-IMECAT : Highlights of a EC funded Project on Lead-Free Materials and Assembly Development Technology”, IPC/Soldertec Global 3rd International Conference on Lead Free Electronics, Barcelona, Spain, June 7-10, 2005. <paper> <presentation>

[21] Petar Ratchev, Tony Loccufier, Bart Vandevelde, Bert Verlinden, Steven Teliszewski, Daniel Werkhoven, Bart Allaert, “A Study of Brittle to Ductile Fracture Transition Temperatures in Bulk Pb-Free Solders”, EMPC 2005 conference, Bruges, Belgium, 12-15 June 2005..

[22] Jan Vanfleteren, “FP5-CSG-IMECAT: introduction and highlights of an EC funded project on lead-free materials and assembly development technologies”, EMPC 2005 conference, Bruges, Belgium, 12-15 June 2005. <paper> <presentation>

[23] Joachim Wiese, “Development of a lead-free solder paste”, EMPC 2005 conference, Bruges, Belgium, 12-15 June 2005.. <paper> <presentation>

[24] Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl, Joachim Wiese, Christina Modes, “Technological advancements in lead-free waferbumping using stencil printing technology”, EMPC 2005 conference, Bruges, Belgium, 12-15 June 2005. <paper> <presentation>

[25] Björn Vandecasteele, Jan Vanfleteren, Dionysios Manessis, Andreas Ostmann, Hans-Werner Hagedorn, Joachim Wiese, “Lead-free Flip Chip: a comparison between leadfree solder and adhesives, EMPC 2005 conference, Bruges, Belgium, 12-15 June 2005. <paper> <presentation>

[26] Mario Gonzalez, Bart Vandevelde, Jan Vanfleteren, Dionysios Manessis, “Thermo-mechanical FEM analysis of lead free and lead containing solder for Flip Chip applications”, EMPC 2005 conference, Bruges, Belgium, 12-15 June 2005. <paper> <presentation>

[27] Inge Schildermans, Geert Willems, “Lead-free soldering development for assembly of complex telecom boards”, EMPC 2005 conference, Bruges, Belgium, 12-15 June 2005. <paper> <presentation>

[28] Marco Mango, “Lead-free electronic assembly for automotive applications”, EMPC 2005 conference, Bruges, Belgium, 12-15 June 2005. <paper> <presentation>

[29] Jarmo Määttänen, Greta Maakannas, “Development of the lead free soldering process for portable applications”, EMPC 2005 conference, Bruges, Belgium, 12-15 June 2005. <paper> <presentation>

IMECAT public > publicationss

Page created by Jan Vanfleteren. Latest update: 14-June-2005