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IMECAT :
Interconnection Materials
for Environmentally Compatible
Assembly Technologies
General
IMECAT is a European Commission (EC) funded project in the frame
of the CSG (Competitive and Sustainable Growth) Programme (contract number
G1RD-CT-2002-00711). Some key figures :
-
Starting date : April 1, 2002
-
Finishing date : March 31, 2005
-
Duration : 3 years
-
Total budget : 4.7 MEuro
-
EC funding : 2.5 MEuro
-
9 participating partners from 5 different EC
member countries (Belgium, Germany, Italy, Spain, Finland)
-
38 person-years of effort to be spent on the
project
Objectives and innovative
aspects
In
the frame of the project it is the objective to develop
environmentally friendly materials (lead-free solders and adhesives)
and to apply these materials for electrical interconnection and
assembly technologies in a wide variety of applications. In short the
technical objectives/innovations are :
-
Development
of a variety of lead-free solders and adhesives (ICA :
isotropically conductive and NCA : non-conductive), responding to
the specific requirements of various industrial applications.
-
Development
of advanced, environmentally compatible, and cost-effective
interconnection and assembly technologies (e.g. new fine-pitch
flip-chip technologies, assembly on low temperature substrates,
interconnection technologies using solders and adhesives, which
are compatible with other materials, like liquid crystal
environment). As an example, for flip-chip technologies (both
solder and adhesive), cost effective no-flow underfill
technologies are a target.
-
Introduction
of these new materials and technologies in existing products, thus
creating environmentally
compatible versions of these products (e.g. lead-free soldering
instead of Pb based soldering), or, on the other hand, introducing
the new materials and technologies to create more advanced
products (smaller size, higher functionality), e.g. flip-chip
instead of wire bonding.
-
Developing
lead-free solder bumping technology on wafers, using screen
printing, including in-depth reliability study of assembly
technologies using lead-free solder bumped chips. This technology,
necessary for lead-free solder flip-chip assembly, is not
commercially available today.
-
Developing
thermomechnical models and performing simulations on the realized
assembly configurations.
The
main project outputs will be :
-
A range
of environmentally compatible interconnection materials (lead-free
and VOC-free solders, isotropic and non-conductive adhesives).
-
A method
for lead-free solder bumping of wafers, necessary for lead-free
solder flip-chip. technology; in-depth reliability study of this
assembly technology.
-
A whole
range of advanced interconnection technologies, using the new
materials.
-
New
thermomechanical models for the realised assemblies.
-
Transfer
of the developed technologies to various industrial environments.
Partnership
For
this development a well balanced consortium with 9 partners form 5
different EU member states has been formed. Solder and adhesives
materials development will be done by a major company (Heraeus),
highly skilled in this matter. The materials will be developed
according to the needs and specifications of 5 industrial end users,
coming from 5 different EU member states and active in wide variety of
industrial sectors : CRF (automotive), Tecdis Iberica (displays),
Alcatel Bell (telecom systems), KSW Microtec (smart cards, smart
labels), Elcoteq (portable telecom). Also 2 research institutes (IMEC,
TU Berlin) from 2 different countries with a large experience in
European co-operation on packaging and interconnection take part in
the project for (co-)developing appropriate bumping and basic assembly
technologies, including thermomechanical modelling and simulation, and
technology qualification. Finally an ASIC foundry (AMIS) will design and fabricate dedicated test chips,
needed for flip-chip technology development.
Partnership
in table format :
| Partner |
Location |
Role in
Project |
| IMEC |
Leuven, Gent (Belgium) |
Project co-ordination, basic technologies
development, modeling and simulation |
| Heraeus |
Hanau (near Frankfurt/Main, Germany) |
Development and supply of lead-free, VOC-free
solder and adhesive materials (ICA, NCA) |
| AMIS |
Oudenaarde (Belgium) |
Test chip design and manufacturing |
| TU Berlin |
Berlin (Germany) |
Lead-free solder bumping; basic technology
development; reliability testing |
| Centro Ricerche Fiat (CRF) |
Orbassano (near Torino, Italy) |
Interconnection and assembly technologies for
automotive applications |
| Tecdis Iberica |
Valladolid (Spain) |
Interconnection and assembly technologies for
display applications |
| Alcatel Bell |
Antwerp, Geel (Belgium) |
Interconnection and assembly technologies for
telecom applications |
| KSW Microtec |
Dresden (Germany) |
Interconnection and assembly technologies for
smart card/smart label applications |
| Elcoteq |
Espoo (Finland) |
Interconnection and assembly technologies for
portable telecom applications |
Contact
For more information, contact
the project coordinator :
Prof.. Dr. ir. Jan Vanfleteren,
IMEC/INTEC/TFCG
Technologiepark 914-A, B-9052 GENT-ZWIJNAARDE, Belgium
Tel : +32-9-264.53.60
Fax : +32-9-264.53.72
e-mail : jan.vanfleteren@elis.ugent.be
web page : http://www.elis.ugent.be/ELISgroups/tfcg/staff/jvf.html
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