(This information can be found on http://www.cordis.lu
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Project Acronym : HIPERPRINT Title : High performance boards and subassemblies for telecom and RF applications
Objective : advanced high density multilayer board technology: 2 layer fan-out capability > 500 I/O with 0.2 mm array component path, 50 um line width and spacing including microvias, integrated resistors and capacitors.
General Information : In Hiperprint a cost-effective modular, high volume, high frequency technology for printed subassemblies will be developed. The core of the technology is oriented towards advanced digital circuits operating at frequencies up to 622 Mbits/sec. The technology to be developed uses the latest improvements in cost-effective flip chip, uBGA and multilayer fine line technology. Assembly will cope with silicon ICs, GaAs MMICs and mixed assemblies (cfr. SMT components). The technology will be validated by means of high volume digital telecom circuits and high-end RF demonstrators. The project results will be made available to other users through the exploitation plans of the consortium partners. Project Status : Completed Start Date : 01-Jan-1997 End Date : 31-Dec-1999 Duration : 36 months Programme Acronym : ESPRIT 4 Subprogramme Area : Semiconductors-Enhancement of technology &manufacturing base Programme Type : 4th FWP (Fourth Framework Programme)
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