CMST in the news

Picture (c) Thales Avionics - Philippe Coni

(most recent entries at the top)

• 1 September 2011. The Engineer interviewed us about the ODICIS project and concluded that 'Development could usher in single-touchscreen cockpits'
• 20-26 June 2011, A mock-up resulting from The FP7 project ODICIS was exhibited during the Le Bourget airshow in Paris.
• 16 November 2010, The FP7 project ODICIS, investigating the feasibility of a giant touch screen to replace a complete cockpit instrumenarium, is covered on the Press4Transport website. (pdf version)

Older press coverage:  

• The flex-stretch workshop was covered in a news item on national Flemish-Belgian television (VTM, November 17, 2009) (in Dutch). Starring Frederick and Jan

• Flex007, 12 March 2009, IMEC's New Technology Paves the Way to Wearable Electronics
• EDN.com, 12 March 2009, IMEC introduces ultra-thin packaging for wearable electronics
• UTCP in Semiconductor.net, 11 March 2009, IMEC Develops Flexible System Integration Process
• UTCP in Global SMT and packaging, 11 March 2009, IMEC reports ultra-thin chip embedding for wearable electronics
• UTCP in Electronics Weekly, 10 March 2009, IMEC 3D process produces flexible circuits under 60µm thick
• Ultra thin chip packages (UTCP) press release by IMEC, 10 March 2009, IMEC reports ultra-thin chip embedding for wearable electronics
• OnBoard Technology, April 2008, Elastic Interconnections For Stretchable Electronics
• The Economist, March 2008, The new shape of circuitry
• Markt und Technik, March 2008, Dehnbare Schaltungen: Zukunft oder Vision?
• PCB Magazine, February 2008, Interconnessioni elastiche per l'elettronica allungabile
• Advanced Packaging, January 2008, Elastic Interconnections for Stretchable Electronics